Patents by Inventor Chuan-Yi KO

Chuan-Yi KO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Movement microelectromechanical systems (MEMS) package
    Patent number: 9527721
    Abstract: The present disclosure relates to a microelectromechanical systems (MEMS) package with an anti-stiction layer, and an associated method of formation. In some embodiments, the MEMS package comprises a device substrate and a CMOS substrate. The device substrate comprises a MEMS device having a moveable or flexible part that is movable or flexible with respect to the device substrate. A surface of the moveable or flexible part is coated by a conformal anti-stiction layer made of polycrystalline silicon. A method for manufacturing the MEMS package is also provided.
    Type: Grant
    Filed: May 15, 2015
    Date of Patent: December 27, 2016
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shyh-Wei Cheng, Chao-Po Lu, Chung-Hsien Hun, Chih-Shan Chen, Chuan-Yi Ko, Chih-Yu Wang, Hsi-Cheng Hsu, Ji-Hong Chiang, Jui-Chun Weng, Wei-Ding Wu
  • Movement Microelectromechanical Systems (MEMS) Package
    Publication number: 20160332863
    Abstract: The present disclosure relates to a microelectromechanical systems (MEMS) package with an anti-stiction layer, and an associated method of formation. In some embodiments, the MEMS package comprises a device substrate and a CMOS substrate. The device substrate comprises a MEMS device having a moveable or flexible part that is movable or flexible with respect to the device substrate. A surface of the moveable or flexible part is coated by a conformal anti-stiction layer made of polycrystalline silicon. A method for manufacturing the MEMS package is also provided.
    Type: Application
    Filed: May 15, 2015
    Publication date: November 17, 2016
    Inventors: Shyh-Wei Cheng, Chao-Po Lu, Chung-Hsien Hun, Chih-Shan Chen, Chuan-Yi Ko, Chih-Yu Wang, Hsi-Cheng Hsu, Ji-Hong Chiang, Jui-Chun Weng, Wei-Ding Wu
  • Mechanism for forming MEMS device
    Patent number: 9090452
    Abstract: Embodiments of mechanisms for forming a micro-electro mechanical system (MEMS) device are provided. The MEMS device includes a substrate and a MEMS substrate disposed on the substrate. The MEMS substrate includes a movable element, a fixed element and at least a spring connected to the movable element and the fixed element. The MEMS device also includes a polysilicon layer on the movable element.
    Type: Grant
    Filed: December 6, 2013
    Date of Patent: July 28, 2015
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shyh-Wei Cheng, Jui-Chun Weng, Hsi-Cheng Hsu, Chih-Yu Wang, Chuan-Yi Ko, Ji-Hong Chiang, Chung-Hsien Hung, Hsin-Yu Chen, Chih-Hsien Chen, Yu-Mei Wu, Jong Chen
  • MECHANISM FOR FORMING MEMS DEVICE
    Publication number: 20150158716
    Abstract: Embodiments of mechanisms for forming a micro-electro mechanical system (MEMS) device are provided. The MEMS device includes a substrate and a MEMS substrate disposed on the substrate. The MEMS substrate includes a movable element, a fixed element and at least a spring connected to the movable element and the fixed element. The MEMS device also includes a polysilicon layer on the movable element.
    Type: Application
    Filed: December 6, 2013
    Publication date: June 11, 2015
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Shyh-Wei CHENG, Jui-Chun WENG, Hsi-Cheng HSU, Chih-Yu WANG, Chuan-Yi KO, Ji-Hong CHIANG, Chung-Hsien HUNG, Hsin-Yu CHEN, Chih-Hsien CHEN, Yu-Mei WU, Jong CHEN