Abstract: A cooling system and a cooling device are provided. The cooling device includes a container, a heat dissipation module, and a cooling module. The cooling module includes a cover plate and a heat dissipation fin assembly. The cover plate covers an opening of the container. The cover plate includes a cooling channel. The cooling channel is arranged in the cover plate and includes an inlet and an outlet. The inlet and the outlet are respectively located at two sides of the cover plate. One side of the heat dissipation fin assembly is in contact with a surface of the cover plate, and an other side of the heat dissipation fin assembly is located in the container. Through the above structure, a usage amount of heat transfer fluid injected into the container of the cooling device is lower than that of a conventional immersion cooling device.

Abstract: An immersion cooling device includes a housing, at least one heating component, at least one heat dissipation component, and at least one fluid-driving unit. The housing includes a tank and at least one cover and has a containing structure. The heating component is located in the containing structure. The immersion cooling device is adapted to cool the heating component in a single phase. The heat dissipation component is disposed on the heating component. The cover has a flow-guiding structure and covers the heat dissipation component, such that the heat dissipation component is located in the flow-guiding structure. The fluid-driving unit is connected to the cover. The flow-guiding structure communicates between the fluid-driving unit and the containing structure. Additionally, an active heat dissipation module and an active flow-guiding module are also provided.

Abstract: A cooling system and a cooling device are provided. The cooling device includes a container, a heat dissipation module, and a cooling module. The cooling module includes a cover plate and a heat dissipation fin assembly. The cover plate covers an opening of the container. The cover plate includes a cooling channel. The cooling channel is arranged in the cover plate and includes an inlet and an outlet. The inlet and the outlet are respectively located at two sides of the cover plate. One side of the heat dissipation fin assembly is in contact with a surface of the cover plate, and an other side of the heat dissipation fin assembly is located in the container. Through the above structure, a usage amount of heat transfer fluid injected into the container of the cooling device is lower than that of a conventional immersion cooling device.

Abstract: The disclosed embodiments relate to an active coolant distribution device and an electronic apparatus, where the active coolant distribution device includes a manifold including a first and second primary pipes and branches. At least one of the first and second primary pipes is suitable for accommodating the flow generator. The second primary pipe includes a first hollow post and a first and second inner wall portions. The first hollow post has first liquid inlets. The first and second inner wall portions form a first channel, a second channel, and an accommodation space inside the first hollow post. The first inner wall portion has converging port, the second inner wall portion has ejecting port, the first channel is located between the first liquid inlets and the converging port and connected to the accommodation space, the ejecting port is connected to the accommodation space and the second channel.

Abstract: The disclosed embodiments relate to an active coolant distribution device and an electronic apparatus, where the active coolant distribution device includes a manifold including a first and second primary pipes and branches. At least one of the first and second primary pipes is suitable for accommodating the flow generator. The second primary pipe includes a first hollow post and a first and second inner wall portions. The first hollow post has first liquid inlets. The first and second inner wall portions form a first channel, a second channel, and an accommodation space inside the first hollow post. The first inner wall portion has converging port, the second inner wall portion has ejecting port, the first channel is located between the first liquid inlets and the converging port and connected to the accommodation space, the ejecting port is connected to the accommodation space and the second channel.

Abstract: A constraint mechanism includes a constraint component disposed on a second housing, and a flexible component disposed on a first housing. The constraint component includes a guide slot and an engaging portion. The flexible component includes a main body, a bending portion and a contacting portion. A first edge of the main body is fixed by a side of an opening on the first housing. A first side of the bending portion is connected to the main body, and is located at a position adjacent to a second edge of the main body. The contacting portion is disposed on a second side of the bending portion. A rim of the contacting portion is an arc structure. The contacting portion moves along the guide slot, so that the arc structure can be constrained by the engaging portion, to constrain a movement of the first housing relative to the second housing.

Abstract: A flap door mechanism with closable function includes a door member, a resilient member and a spring arm member. The door member is pivoted to a casing. The resilient member is installed on the door member and for driving the door member to rotate in a first direction. The resilient member includes a first end and a second end. The spring arm member is selectively disposed on the door member or on the casing. The spring arm member abuts against the first end. When the door member rotates in a second direction opposite to the first direction, the spring arm member is pushed to bend by the first end or is pressed to flatten by the casing, so as to reduce deformation between the first end and the second end of the resilient member.

Abstract: A flap door mechanism with closable function includes a door member, a resilient member and a spring arm member. The door member is pivoted to a casing. The resilient member is installed on the door member and for driving the door member to rotate in a first direction. The resilient member includes a first end and a second end. The spring arm member is selectively disposed on the door member or on the casing. The spring arm member abuts against the first end. When the door member rotates in a second direction opposite to the first direction, the spring arm member is pushed to bend by the first end or is pressed to flatten by the casing, so as to reduce deformation between the first end and the second end of the resilient member.

Abstract: A decoration element comprising a light guiding shell, a light guiding panel and a light source is provided. The light guiding shell has a light entrance, and comprises a first inclined plate, a second inclined plate, a first flat plate and a second flat plate. The first inclined plate is disposed on one side of the light entrance, while the second inclined plate is disposed on the other side of the light entrance. The first flat plate is connected to the first inclined plate, and the second flat plate is connected to the second inclined plate. The light guiding panel is disposed in the light guiding shell. The light source is disposed in the light entrance. The included angel between the first inclined plate and the second inclined plate ranges between 60 and 160 degrees.

Abstract: A method for managing read/write (R/W) operations on an electronic device with hard disks, includes: upon receipt of R/W operation information related to an intended R/W operation, configuring a processor to decide which of the hard disks will be read/written with reference to the R/W operation information and sets of pre-established performance information. The sets respectively correspond to R/W operation settings. Each set includes multiple pieces of information each containing a performance indication related to a corresponding one of candidate combinations of the hard disks under the corresponding R/W operation setting. The decision is made with reference to the set, the R/W operation setting corresponding to which matches the R/W operation information.

Abstract: A fan control system includes a host device including a detecting unit for detecting a component so as to generate a detecting signal. The host device further includes BIOS for storing relationship information between the detecting signal and a rotational speed of a fan and for generating a rotational signal according to the detecting signal and the relationship information. The fan control system further includes a fan device including a fan and a fan driving unit for driving the fan. The fan device further includes a rotational speed modulating unit for controlling the fan driving unit to drive the fan to rotate at a second rotational speed outside a first range when a first rotational speed corresponding to the rotational signal according to the relationship information is within the first range.

Abstract: A constraint mechanism includes a constraint component disposed on a second housing, and a flexible component disposed on a first housing. The constraint component includes a guide slot and an engaging portion. The flexible component includes a main body, a bending portion and a contacting portion. A first edge of the main body is fixed by a side of an opening on the first housing. A first side of the bending portion is connected to the main body, and is located at a position adjacent to a second edge of the main body. The contacting portion is disposed on a second side of the bending portion. A rim of the contacting portion is an arc structure. The contacting portion moves along the guide slot, so that the arc structure can be constrained by the engaging portion, to constrain a movement of the first housing relative to the second housing.

Abstract: A method for managing read/write (R/W) operations on an electronic device with hard disks, includes: upon receipt of R/W operation information related to an intended R/W operation, configuring a processor to decide which of the hard disks will be read/written with reference to the R/W operation information and sets of pre-established performance information. The sets respectively correspond to R/W operation settings. Each set includes multiple pieces of information each containing a performance indication related to a corresponding one of candidate combinations of the hard disks under the corresponding R/W operation setting. The decision is made with reference to the set, the R/W operation setting corresponding to which matches the R/W operation information.

Abstract: A fan control system includes a host device including a detecting unit for detecting a component so as to generate a detecting signal. The host device further includes BIOS for storing relationship information between the detecting signal and a rotational speed of a fan and for generating a rotational signal according to the detecting signal and the relationship information. The fan control system further includes a fan device including a fan and a fan driving unit for driving the fan. The fan device further includes a rotational speed modulating unit for controlling the fan driving unit to drive the fan to rotate at a second rotational speed outside a first range when a first rotational speed corresponding to the rotational signal according to the relationship information is within the first range.

Abstract: A heat dissipating device includes a supporting component installed on a circuit board. A plurality of openings is formed on the supporting component. The heat dissipating device further includes a plurality of heat dissipating components disposed on a side of the supporting component and installed inside the plurality of openings respectively for dissipating heat generated by a plurality of heat sources disposed on the other side of the supporting component. The heat dissipating device further includes a plurality of elastic components for pressing the plurality of heat dissipating components so that the plurality of heat dissipating components contacts the plurality of heat sources closely.

Abstract: A lathe frame assembly has a lathe frame, a front end of the lathe frame having an axial hole and two recesses, a clamper having a retaining hole at a middle section thereof; a front end of the clamper being installed with a protrusion which is received in a positioning hole of the lathe sheet; a lower end of the clamper having two noses which are received into the two recesses of the lathe frame so as to lock the lathe sheet; and a front end of the lathe frame having an engaging portion which is formed with two resting portions. The engaging portion has a shape selected from rectangular shapes, rhombus shapes and triangular shapes so as to clamp the lathe sheet tightly.

Abstract: An electronic device having a heat-dissipating module includes a housing and an electronic component (e.g., a central processing unit) disposed within the housing. The heat-dissipating module is used for dissipating heat of the electronic component, and includes a two-phase flow heat-dissipating loop and a thermoelectric cooling component. The two-phase flow heat-dissipating loop can be a loop heat pipe (LHP) or a capillary pumped loop (CPL). The thermoelectric cooling component includes a cooling portion and a heat-generating portion respectively to cool or heat necessary portions of the two-phase flow heat-dissipating loop, or directly cool the electronic component through the cooling portion, thereby increasing the heat-dissipation effect of the two-phase flow heat-dissipating loop.

Abstract: A heat dissipation device adapted for dissipating heat generated by a heat source is provided. The heat dissipation device includes a base and a heat dissipation fin assembly. The base is disposed on the heat source. The heat dissipation fin assembly is disposed on the base and includes a plurality of parallel fins. The heat dissipation fins assembly has opposite air inlet side and air outlet side. A turbulence generating structure is formed by at least a part of the fins or holes at the air inlet or the air outlet of the heat dissipation fin assembly.

Abstract: An electronic device having a heat-dissipating module includes a housing and an electronic component (e.g., a central processing unit) disposed within the housing. The heat-dissipating module is used for dissipating heat of the electronic component, and includes a two-phase flow heat-dissipating loop and a thermoelectric cooling component. The two-phase flow heat-dissipating loop can be a loop heat pipe (LHP) or a capillary pumped loop (CPL). The thermoelectric cooling component includes a cooling portion and a heat-generating portion respectively to cool or heat necessary portions of the two-phase flow heat-dissipating loop, or directly cool the electronic component through the cooling portion, thereby increasing the heat-dissipation effect of the two-phase flow heat-dissipating loop.

Abstract: A heat sink apparatus for heat dissipation for a CPU includes a fan, a heat sink module and a latch. The fan has at least one attachment hole. The heat sink module is mounted onto the CPU, and is itself a metal heat conduction column having, a plurality of arc-shaped cooling fins radiating from the edge of the metal heat conduction column and a plurality of mounting holes positioned at the ends of the arc-shaped cooling fins. In addition, each mounting hole corresponds to a respective attachment hole. The latch comprises at least a latch arm, a plurality of openings and at least one latch hole. The latch arm is secured to the flange at the side of the CPU socket. Each of the openings corresponds to a mounting hole on the arc-shaped cooling fins of the heat sink module and the attachment holes on the fan.