Patents by Inventor Chuan-Yung SHIH

Chuan-Yung SHIH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package device and method of manufacturing the same
    Patent number: 10344383
    Abstract: In one or more embodiments, an apparatus for processing a wafer includes a ceramic wall, a metal wall and a frame. The ceramic wall defines a chamber for accommodating the wafer. The ceramic wall has a first surface defining a first opening. The metal wall surrounds the ceramic wall. The metal wall has a second surface defining a second opening adjacent to the first opening. The frame covers the second surface.
    Type: Grant
    Filed: August 3, 2017
    Date of Patent: July 9, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chuan-Yung Shih, Tai-Yuan Huang, Yu-Chi Wang, Chin-Feng Wang, Sing-Syuan Shiau, Chun-Wei Shih, Shao-Ci Huang, Huang-Hsien Chang, Yuan-Feng Chiang
  • SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20190040527
    Abstract: In one or more embodiments, an apparatus for processing a wafer includes a ceramic wall, a metal wall and a frame. The ceramic wall defines a chamber for accommodating the wafer. The ceramic wall has a first surface defining a first opening. The metal wall surrounds the ceramic wall. The metal wall has a second surface defining a second opening adjacent to the first opening. The frame covers the second surface.
    Type: Application
    Filed: August 3, 2017
    Publication date: February 7, 2019
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chuan-Yung SHIH, Tai-Yuan HUANG, Yu-Chi WANG, Chin-Feng WANG, Sing-Syuan SHIAU, Chun-Wei SHIH, Shao-Ci HUANG, Huang-Hsien CHANG, Yuan-Feng CHIANG