Abstract: An optical module including an upper shell part, a circuit board, a base, and a light reception component and a light emission component respectively disposed on upper and lower surfaces of the base; a base mounting portion is formed on the surface of the circuit board, through which the base is secured to the circuit board. In order to increase heat dissipation effect of the base, a protrusion is formed on an upper surface of the base, which protrudes towards and is in thermal connection with the upper shell part, conducting heat through the base. To dissipate heat generated by the light emission component more effectively, the light emission component is disposed on a lower surface of the base. Heat dissipation effect of the base is improved by forming the protrusion on the upper surface of the base and using it as a heat dissipation protrusion.

Abstract: An optical module includes a base, a first cover, a circuit board, a light emitting assembly and a light receiving assembly. Part of the circuit board is arranged on a surface of the base, and part thereof arranged outside the base. The light emitting assembly includes a plurality of light-emitting chips disposed on the base and an optical multiplexer disposed on the first cover and located in a laser exit direction of the plurality of light-emitting chips. The light receiving assembly includes an optical demultiplexer disposed on the first cover, a plurality of light-receiving chips disposed on the circuit board and are located in a laser exit direction of the optical demultiplexer, a reflection prism disposed at a side of the plurality of light-receiving chips away from the circuit board, and an optical receiving case covering the plurality of light-receiving chips and the reflection prism.

Abstract: An optical module includes a base, a first cover, a circuit board, a light emitting assembly and a light receiving assembly. The light emitting assembly includes a plurality of light-emitting chips and an optical multiplexer. The plurality of light-emitting chips are disposed on the first bottom plate. The optical multiplexer is disposed on the first cover and is located in a laser exit direction of the plurality of light-emitting chips. The light receiving assembly includes an optical demultiplexer and a plurality of light-receiving chips. The optical demultiplexer is disposed on the first cover. The plurality of light-receiving chips are disposed on the circuit board and are located in a laser exit direction of the optical demultiplexer.

Abstract: An optical module includes a circuit board, a light-emitting housing, a first optical fiber adapter, a first internal optical fiber, and an optical fiber connector. An end of the first internal optical fiber is connected to the first optical fiber adapter, and the optical fiber connector is optically connected to the light-emitting component and wraps another end of the first internal optical fiber. The first internal optical fiber and the optical fiber connector are transparent material members, and light transmittance of the two is different. The light-emitting housing includes a bottom wall and a concave groove. The optical fiber connector is disposed on the bottom wall, and a portion of the optical fiber connector is located above the concave groove. An orthogonal projection of the another end of the first internal optical fiber on the bottom wall is located in the concave groove.

Abstract: An optical module includes a base, a first cover, a circuit board, a light emitting assembly and a light receiving assembly. The light emitting assembly includes a plurality of light-emitting chips and an optical multiplexer. The plurality of light-emitting chips are disposed on the first bottom plate. The optical multiplexer is disposed on the first cover and is located in a laser exit direction of the plurality of light-emitting chips. The light receiving assembly includes an optical demultiplexer and a plurality of light-receiving chips. The optical demultiplexer is disposed on the first cover. The plurality of light-receiving chips are disposed on the circuit board and are located in a laser exit direction of the optical demultiplexer.