Abstract: A method includes depositing a surface modification layer on sidewalls of a plurality of cavities of a shaped article. The surface modification layer is formed from a glass material including a mobile component. The shaped article is formed from a glass material, a glass ceramic material, or a combination thereof. At least a portion of the mobile component is migrated from the surface modification layer into surface regions of the sidewalls of the shaped article, whereby subsequent to the migration, the surface regions have a reduced annealing point compared to a bulk of the shaped article. The surface modification layer and the surface regions of the sidewalls are reflowed. A surface roughness of the surface modification layer disposed on the sidewalls following the reflowing is less than a surface roughness of the sidewalls prior to the depositing.

Abstract: A liquid lens can include a first substrate with an interior recess. A second substrate with a bore can be bonded to the first substrate, whereby the interior recess of the first substrate and the bore of the second substrate cooperatively define at least a portion of a cavity of the liquid lens. A first liquid and a second liquid can be disposed in the cavity. A variable interface can be disposed between the first liquid and the second liquid, thereby forming a variable lens. The interior recess of the first substrate can be positioned outside of a sidewall projection of a sidewall surface of the cavity through the first substrate.

Abstract: Embodiments of a glass laminate structure comprising a non-strengthened glass sheet, a strengthened glass sheet, and at least one polymer interlayer intermediate the external and internal glass sheets are disclosed. The strengthened glass sheet can have a thickness ranging from about 0.3 mm to about 1.5 mm, the non-strengthened glass sheet can have a thickness ranging from about 1.5 mm to about 3.0 mm, and the polymer interlayer can have a first edge with a first thickness and a second edge opposite the first edge with a second thickness greater than the first thickness. The glass laminate structures provide advantageous optical properties. The glass laminate structure can be employed to provide a transparent display screen that minimizes image offset between two images formed by two reflections at two surfaces of the strengthened internal glass sheet.

Abstract: A method includes depositing a surface modification layer on sidewalls of a plurality of cavities of a shaped article. The surface modification layer is formed from a glass material including a mobile component. The shaped article is formed from a glass material, a glass ceramic material, or a combination thereof. At least a portion of the mobile component is migrated from the surface modification layer into surface regions of the sidewalls of the shaped article, whereby subsequent to the migration, the surface regions have a reduced annealing point compared to a bulk of the shaped article. The surface modification layer and the surface regions of the sidewalls are reflowed. A surface roughness of the surface modification layer disposed on the sidewalls following the reflowing is less than a surface roughness of the sidewalls prior to the depositing.

Abstract: Described herein are apparatuses for holding a substrate in a near vertical position, wherein the design minimizes substrate sag while allowing the substrate to expand and contract under varying thermal conditions. The apparatus minimizes the stress on the substrate, preventing breakage of or damage to the substrate while it undergoes coating and other thermal processes.

Abstract: Embodiments of a glass laminate structure comprising a non-strengthened glass sheet, a strengthened glass sheet, and at least one polymer interlayer intermediate the external and internal glass sheets are disclosed. The strengthened glass sheet can have a thickness ranging from about 0.3 mm to about 1.5 mm, the non-strengthened glass sheet can have a thickness ranging from about 1.5 mm to about 3.0 mm, and the polymer interlayer can have a first edge with a first thickness and a second edge opposite the first edge with a second thickness greater than the first thickness. The glass laminate structures provide advantageous optical properties. The glass laminate structure can be employed to provide a transparent display screen that minimizes image offset between two images formed by two reflections at two surfaces of the strengthened internal glass sheet.

Abstract: A glass laminate structure comprising a non-strengthened external glass sheet, a strengthened internal glass sheet, and at least one polymer interlayer intermediate the external and internal glass sheets. The internal glass sheet can have a thickness ranging from about 0.3 mm to about 1.5 mm, the external glass sheet can have a thickness ranging from about 1.5 mm to about 3.0 mm, and the polymer interlayer can have a first edge with a first thickness and a second edge opposite the first edge with a second thickness greater than the first thickness. Other embodiments include external and internal strengthened glass sheets as well as an external strengthened glass sheet and an internal non-strengthened glass sheet.

Abstract: Methods and apparatus for producing a thin film transistor (TFT) result in: a glass or glass ceramic substrate; a single crystal semiconductor layer; a source structure disposed on the single crystal semiconductor layer; a drain structure disposed on the single crystal semiconductor layer; and a gate structure located with respect to the drain structure defining a lightly doped drain region therein, wherein a lateral length of the lightly doped drain region is such that the TFT exhibits a relatively low carrier mobility and moderate sub-threshold slope suitable for OLED display applications.

Abstract: Methods and apparatus for producing a CMOS image sensor result in a plurality of photo sensitive layers, each layer including: a glass or glass ceramic substrate having first and second spaced-apart surfaces; a semiconductor layer disposed on the first surface of the glass or glass ceramic substrate; and a plurality of pixel structures formed in the semiconductor layer, each pixel structure including a plurality of semiconductor islands, at least one island operating as a color sensitive photo-detector sensitive to a respective range of light wavelengths, wherein the plurality of photo sensitive layers are stacked one on the other, such that incident light enters the CMOS image sensor through the first spaced-apart surface of the glass or glass ceramic substrate of one of the plurality of photo sensitive layers, and subsequently passes into further photo sensitive layers if one or more wavelengths of the incident light are sufficiently long.

Abstract: Methods and apparatus for producing a semiconductor on glass (SiOG) structure include: subjecting an implantation surface of a donor single crystal semiconductor wafer to an ion implantation process to create an exfoliation layer of the donor semiconductor wafer; bonding the implantation surface of the exfoliation layer to a glass substrate using electrolysis; separating the exfoliation layer from the donor semiconductor wafer, thereby exposing a cleaved surface of the exfoliation layer; subjecting the cleaved surface of the exfoliation layer to a dry etching process to produce a single crystal semiconductor layer of about 5-20 nm thickness; and forming a thin film transistor in the thin semiconductor layer.

Abstract: One embodiment is directed to a gimbal mechanism for a MEMS mirror device having folded flexure hinges. Another embodiment is directed to a gimbal mechanism having a frame with through-holes or recesses distributed thereabout to reduce weight of said frame. Other embodiments are directed to improved electrode structures for electrostatically actuated MEMS devices. Other embodiments are directed to methods for fabricating electrodes for electrostatically actuated MEMS devices. Other embodiments are directed to methods of fabricating through-wafer interconnect devices. Other embodiments are directed to MEMS mirror array packaging. Other embodiments are directed to electrostatically actuated MEMS devices having driver circuits integrated therewith. Other embodiments are directed to methods of patterning wafers with a plurality of through-holes. Other embodiments are directed to methods of forming moveable structures in MEMS devices.

Abstract: One embodiment is directed to a gimbal mechanism for a MEMS mirror device having folded flexure hinges. Another embodiment is directed to a gimbal mechanism having a frame with through-holes or recesses distributed thereabout to reduce weight of said frame. Other embodiments are directed to improved electrode structures for electrostatically actuated MEMS devices. Other embodiments are directed to methods for fabricating electrodes for electrostatically actuated MEMS devices. Other embodiments are directed to methods of fabricating through-wafer interconnect devices. Other embodiments are directed to MEMS mirror array packaging. Other embodiments are directed to electrostatically actuated MEMS devices having driver circuits integrated therewith. Other embodiments are directed to methods of patterning wafers with a plurality of through-holes. Other embodiments are directed to methods of forming moveable structures in MEMS devices.