Patents by Inventor ChuanDao Wang

ChuanDao Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230349040
    Abstract: A method and system for forming a structure are disclosed. An exemplary method includes providing a substrate comprising a plurality of gaps within a first reaction chamber, forming a doped adhesion film on the surface of a substrate and within the plurality of gaps, wherein the doped adhesion film comprises a first material and a second material, and depositing a metal overlying the doped adhesion film. Exemplary methods can further include a step of depositing a nucleation layer overlying the doped adhesion film. An exemplary system can perform the method of forming the structure.
    Type: Application
    Filed: May 1, 2023
    Publication date: November 2, 2023
    Inventors: Moataz Bellah Mousa, Jiyeon Kim, Jaebeom Lee, Charith Eranga Nanayakkara, Paul Ma, Chuandao Wang, YoungChol Byun, Jacqueline Wrench, Guannan Chen
  • Patent number: 9540249
    Abstract: Embodiments may pertain to methods for preparing a transition metal oxide.
    Type: Grant
    Filed: August 28, 2013
    Date of Patent: January 10, 2017
    Assignee: The University of Hong Kong
    Inventors: Wallace Chik Ho Choy, Fengxian Xie, ChuanDao Wang
  • Publication number: 20140061550
    Abstract: Embodiments may pertain to methods for preparing a transition metal oxide.
    Type: Application
    Filed: August 28, 2013
    Publication date: March 6, 2014
    Inventors: Wallace Chik Ho Choy, Fengxian Xie, ChuanDao Wang