Patents by Inventor Chuanfa Lin

Chuanfa Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7701124
    Abstract: A white light source has a substrate with a blue light-emitting diode placed thereon and a cap layer enclosing the blue light-emitting diode. The cap layer includes a mixture of silicon and phosphor blend at ratio of 1:0.2-0.5. The phosphor blend includes a red phosphor, a green phosphor and a yellow phosphor.
    Type: Grant
    Filed: February 28, 2007
    Date of Patent: April 20, 2010
    Assignee: Harvatek Corporation
    Inventors: Bily Wang, Jonnie Chuang, Chuanfa Lin, Chih Shan Yu
  • Patent number: 7563641
    Abstract: A laminated light-emitting diode display device and a manufacturing method thereof are described. The laminated light-emitting diode display device has an insulator, a circuitry device placed on the insulator and having of a plurality of circuits interconnected with each other, and a plurality of SMT-type light-emitting diodes electrically connected to the circuits of the circuitry unit.
    Type: Grant
    Filed: November 29, 2006
    Date of Patent: July 21, 2009
    Assignee: Harvatek Corporation
    Inventors: Bily Wang, Jonnie Chuang, Chuanfa Lin, Chao-Yuan Huang
  • Publication number: 20070152562
    Abstract: A white light source has a substrate with a blue light-emitting diode placed thereon and a cap layer enclosing the blue light-emitting diode. The cap layer includes a mixture of silicon and phosphor blend at ratio of 1:0.2-0.5. The phosphor blend includes a red phosphor, a green phosphor and a yellow phosphor.
    Type: Application
    Filed: February 28, 2007
    Publication date: July 5, 2007
    Inventors: Bily Wang, Jonnie Chuang, Chuanfa Lin, Chih Yu
  • Patent number: 7237938
    Abstract: A backlight module arranged under a flat display includes a printed circuit board being parallel to the flat display and including a plurality of LEDs, a reflection portion being a reflection wall bent from a fringe of the LEDs to extend over the LEDs, and a guide light plate being parallel to the printed circuit board. The reflection portion includes an orientation wall parallel to the reflection wall and an outlet with a direction parallel to the printed circuit board. The guide light plate has an end connecting inside the outlet of the reflection portion, a light delivering surface adjacent to the flat display, and a reflection surface arranged at a bottom thereof.
    Type: Grant
    Filed: March 25, 2005
    Date of Patent: July 3, 2007
    Assignee: Harvatek Corporation
    Inventors: Bily Wang, Jonnie Chuang, Chuanfa Lin
  • Publication number: 20070072506
    Abstract: A laminated light-emitting diode display device and a manufacturing method thereof are described. The laminated light-emitting diode display device has an insulator, a circuitry device placed on the insulator and having of a plurality of circuits interconnected with each other, and a plurality of SMT-type light-emitting diodes electrically connected to the circuits of the circuitry unit.
    Type: Application
    Filed: November 29, 2006
    Publication date: March 29, 2007
    Inventors: Bily Wang, Jonnie Chuang, Chuanfa Lin, Chao-Yuan Huang
  • Publication number: 20060215387
    Abstract: A backlight module arranged under a flat display includes a printed circuit board being parallel to the flat display and including a plurality of LEDs, a reflection portion being a reflection wall bent from a fringe of the LEDs to extend over the LEDs, and a guide light plate being parallel to the printed circuit board. The reflection portion includes an orientation wall parallel to the reflection wall and an outlet with a direction parallel to the printed circuit board. The guide light plate has an end connecting inside the outlet of the reflection portion, a light delivering surface adjacent to the flat display, and a reflection surface arranged at a bottom thereof.
    Type: Application
    Filed: March 25, 2005
    Publication date: September 28, 2006
    Inventors: Bily Wang, Jonnie Chuang, Chuanfa Lin
  • Patent number: 7049639
    Abstract: An LED packaging structure has a substrate having two holes formed thereon. One of two conductive elements extends through the two holes to connect electrically to a conductive pad and a first electrode pad on the upper and lower surfaces of the substrate and the other of the two conductive elements extends through the holes to connect to the conductive strip and the second electrode pad on the upper and lower surfaces the substrate. A light-emitting chip electrically connects to the conductive pad and the conductive strip. The light-emitting chip is encapsulated by a protection colloid on the substrate, so as to make LED packaging structure easy to fabricate and avoid the short circuits of adjacent LED packaging structures due to contact between conductor materials therebetween.
    Type: Grant
    Filed: May 28, 2004
    Date of Patent: May 23, 2006
    Assignee: Harvatek Corporation
    Inventors: Bily Wang, Jonnie Chuang, Chuanfa Lin, Heng-Yen Lee
  • Publication number: 20060038485
    Abstract: A laminated light-emitting diode display device and a manufacturing method thereof are described. The laminated light-emitting diode display device has an insulator, a circuitry device placed on the insulator and having of a plurality of circuits interconnected with each other, and a plurality of SMT-type light-emitting diodes electrically connected to the circuits of the circuitry unit.
    Type: Application
    Filed: August 18, 2004
    Publication date: February 23, 2006
    Inventors: Bily Wang, Jonnie Chuang, Chuanfa Lin, Chao-Yuan Huang
  • Publication number: 20050274957
    Abstract: An LED packaging structure has a substrate having two drills formed thereon. One of two conductive elements extends through the two drills to connect electrically to a conductive pad and a first electrode pad on the upper and lower surfaces of the substrate and the other of the two conductive elements extends through the drills to connect to the conductive strip and the second electrode pad on the upper and lower surfaces the substrate. A light-emitting chip electrically connects to the conductive pad and the conductive strip. The light-emitting chip is encapsulated by a protection colloid on the substrate, so as to make LED packaging structure easy to fabricate and avoid the short circuits of adjacent LED packaging structures due to contact between conductor materials therebetween.
    Type: Application
    Filed: May 28, 2004
    Publication date: December 15, 2005
    Inventors: Bily Wang, Jonnie Chuang, Chuanfa Lin, Heng-Yen Lee
  • Publication number: 20050264173
    Abstract: A while light emitting diode light source and method for manufacturing the same are proposed. The while light emitting diode light source has a printed circuit board, and a plurality of LED units on one face of the PCB, each of the LED units comprising a substrate, a blue LED on the substrate and a red-green-yellow phosphor mixture enclosing the blue LED. The red-green-yellow phosphor mixture is a mixture of a red phosphor, a green phosphor and a yellow phosphor. The red phosphor is CaS:Eu or SrS:Eu. The green phosphor is SrGa2S4:Eu or Ca8EuMnMg(SiO4)4C12. The yellow phosphor is YAG:Ce or ThAG:Ce. The light emitted from the phosphors are mixed with blue light into white light with a satisfactory color rendering property.
    Type: Application
    Filed: May 28, 2004
    Publication date: December 1, 2005
    Inventors: Bily Wang, Jonnie Chuang, Chuanfa Lin
  • Publication number: 20050236958
    Abstract: A white light source has a substrate with a blue light-emitting diode placed thereon and a phosphor mixture coated on the blue light-emitting diode and made of a red phosphor, a green phosphor and a yellow phosphor. The red phosphor can be CaS:Eu or SrS:Eu; the green phosphor can be SrGa2S4:Eu or Ca8EuMnMg(SiO4)4C12; and the yellow phosphor can be YAG:Ce or ThAG:Ce. The red phosphor, the green phosphor and the yellow phosphor emit, respectively, red light, green light and yellow light after receiving blue light from the blue light-emitting diode to mix a white light with a good color-rendering property.
    Type: Application
    Filed: April 23, 2004
    Publication date: October 27, 2005
    Inventors: Bily Wang, Jonnie Chuang, Chuanfa Lin, Chih Yu
  • Patent number: 6919584
    Abstract: A colorless light approaching that of white light in nature, is produced by using a blue color LEDs and a green color LED are covered with a red color phosphorescent glue and a yellow phosphorescent glue in separate layers or a mixed layer.
    Type: Grant
    Filed: October 3, 2003
    Date of Patent: July 19, 2005
    Assignee: Harvatek Corporation
    Inventors: Bily Wang, Jonnie Chuang, Chuanfa Lin
  • Publication number: 20040256626
    Abstract: A colorless light approaching that of white light in nature, is produced by using a blue color LEDs and a green color LED are covered with a red color phosphorescent glue and a yellow phosphorescent glue in separate layers or a mixed layer.
    Type: Application
    Filed: October 3, 2003
    Publication date: December 23, 2004
    Inventors: Bily Wang, Jonnie Chuang, Chuanfa Lin