Patents by Inventor Chuang-Bing Li

Chuang-Bing Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for improving via's impedance
    Patent number: 7409668
    Abstract: A method is for controlling an impedance of a via of a printed circuit board. The Via is connected with a trace and includes a drill hole, a pad and an anti-pad. The method includes steps of: building a math model; testing whether an impedance of the via matching with an impedance of the trace; analyzing the impedance of the via if passing the testing; and adjusting parameters of the pad, the anti-pad, and the drill hole if fails testing, and returning to the simulating step, till impedance matching achieved. The method which can efficiently keep signals integrality and increase signal transmission speed.
    Type: Grant
    Filed: March 29, 2006
    Date of Patent: August 5, 2008
    Assignees: Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Yu-Hsu Lin, Shang-Tsang Yeh, Chuang-Bing Li