Abstract: The present embodiments relate to systems and methods for automatic sign in upon account signup. Particularly, the present embodiments can utilize a federated login approach for automatic sign in upon account signup for a cloud infrastructure. Specifically, the signup and sign in service (also known as SOUP) and an identity provider portal can be configured such that the nodes are aware of each other as Security Assertion Markup Language (SAML) partners. After new account registration, the signup service can redirect the user browser to a cloud infrastructure console to start with a federated login flow, where a sign in service can issue a SAML authentication request, and redirects it to signup service. Responsive to validating the browser using a SAML authentication process, the browser can be automatically signed into the new account and allowed access the account relating to the cloud infrastructure service.

Abstract: A method, system, and computer program product for circuit design automation. The method identifies a set of circuit components for a proposed circuit design. A subset of circuit components is selected to generate an initial topology for the proposed circuit design. A set of subsequent topologies are iteratively generated by a heuristic search algorithm based on the subset of circuit components and the initial topology. A set of valid topologies of the set of subsequent topologies are determined by a circuit simulator based on the subset of circuit components and a set of connections within the set of subsequent topologies. The method generates the proposed circuit design from the set of valid topologies.

Abstract: Aspects of the disclosure provide a semiconductor device. The semiconductor device includes a memory stack of gate layers and insulating layers. The gate layers and the insulating layers are stacked alternatingly and are formed into stair steps in a staircase region. The semiconductor device includes a first landing pad on a first gate layer of a first stair step. The first gate layer is a top gate layer of the first stair step. The semiconductor device further includes a first sidewall isolation structure on a riser sidewall of a second gate layer of a second stair step. The second gate layer is a top gate layer of the second stair step and is stacked on the first gate layer in the memory stack. The first sidewall isolation structure isolates the second gate layer from the first landing pad.

Abstract: This patent relates to a multi-mode communication method for detecting states of power transmission line, which belongs to electric power communication technology field. In this method, there are sensing devices installed on power transmission line. These sensing devices are used to detect status signals of power transmission line. Status signals are sent to remote monitoring center through communication terminals. Both sensing devices and communication terminals are powered by battery. The main communication network between sensing devices and communication terminals is formed by ZigBee network. Meanwhile, Bluetooth network is a backup communication network between sensing devices and communication terminals. Communication terminals and remote monitoring center are linked through WinMAX.

Abstract: This patent relates to a multi-mode communication method for detecting states of power transmission line, which belongs to electric power communication technology field. In this method, there are sensing devices installed on power transmission line. These sensing devices are used to detect status signals of power transmission line. Status signals are sent to remote monitoring center through communication terminals. Both sensing devices and communication terminals are powered by battery. The main communication network between sensing devices and communication terminals is formed by ZigBee network. Meanwhile, Bluetooth network is a backup communication network between sensing devices and communication terminals. Communication terminals and remote monitoring center are linked through WinMAX.

Abstract: An insulating cylinder and a main circuit structure using the insulating cylinder includes a main cavity, a secondary grounded insert connected with the main cavity, an arc-distinguishing chamber connected with the main cavity, and an outlet terminal insert connected with an end of the arc-distinguishing chamber. An observation window is provided at a side of the main cavity. A main circuit structure using the insulating cylinder, which further includes a main grounded rod and a main grounded contact positioned in the main cavity, an arc-distinguishing chamber insulating pole, an isolated insulating pole, an isolated conductive block, an isolated rod and an isolated contact, and a main bus-bar bushing connected with the isolated contact. A flexible connection is provided between the main grounded contact, the arc-distinguishing chamber and the isolated conductive block.

Abstract: An insulating cylinder and a main circuit structure using the insulating cylinder includes a main cavity, a secondary grounded insert connected with the main cavity, an arc-distinguishing chamber connected with the main cavity, and an outlet terminal insert connected with an end of the arc-distinguishing chamber. An observation window is provided at a side of the main cavity. A main circuit structure using the insulating cylinder, which further includes a main grounded rod and a main grounded contact positioned in the main cavity, an arc-distinguishing chamber insulating pole, an isolated insulating pole, an isolated conductive block, an isolated rod and an isolated contact, and a main bus-bar bushing connected with the isolated contact. A flexible connection is provided between the main grounded contact, the arc-distinguishing chamber and the isolated conductive block.