Patents by Inventor Chuang-Ping Hou

Chuang-Ping Hou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Scratch reduction for chemical mechanical polishing
    Patent number: 7297632
    Abstract: A method for forming a semiconductor device utilizing a chemical-mechanical polishing (CMP) process is provided. In one example, the method includes sequentially performing a first CMP process for removing a first portion of an oxide surface of a semiconductor device using a high selectivity slurry (HSS) and a first polish pad, interrupting the first CMP process, cleaning the semiconductor device and the first polish pad, and performing a second CMP process for removing a second portion of the oxide surface.
    Type: Grant
    Filed: March 17, 2005
    Date of Patent: November 20, 2007
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chuang-Ping Hou, Syun-Ming Jang, Ying-Ho Chen, Chu-Yun Fu, Tung-Ching Tseng
  • Scratch reduction for chemical mechanical polishing
    Publication number: 20060211250
    Abstract: A method for forming a semiconductor device utilizing a chemical-mechanical polishing (CMP) process is provided. In one example, the method includes sequentially performing a first CMP process for removing a first portion of an oxide surface of a semiconductor device using a high selectivity slurry (HSS) and a first polish pad, interrupting the first CMP process, cleaning the semiconductor device and the first polish pad, and performing a second CMP process for removing a second portion of the oxide surface.
    Type: Application
    Filed: March 17, 2005
    Publication date: September 21, 2006
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chuang-Ping Hou, Syun-Ming Jang, Ying-Ho Chen, Chu-Yun Fu, Tung-Ching Tseng