Patents by Inventor Chuang-Shin Chiou

Chuang-Shin Chiou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming via-holes in multilayer circuit boards
    Patent number: 6632372
    Abstract: The invention discloses a method of forming via-holes in multilayer circuit boards. The process includes forming covering substances in predetermined spots in a multilayer circuit board and thereafter applying an insulating layer upon the circuit board. The predetermined spots are then uncovered and the covering substances are removed to form via-holes.
    Type: Grant
    Filed: November 22, 2000
    Date of Patent: October 14, 2003
    Assignee: Industrial Technology Research Institute
    Inventors: Man-Lin Chen, Hsien-Kuang Lin, Chuang-Shin Chiou, Tien-Shou Shieh, Pey-Ching Liou
  • Method for manufacturing high-density multilayer printed circuit boards
    Patent number: 6119338
    Abstract: A method for making high-density multilayer printed circuit boards is disclosed.
    Type: Grant
    Filed: March 19, 1998
    Date of Patent: September 19, 2000
    Assignee: Industrial Technology Research Institute
    Inventors: Tsung-Hsiung Wang, Man-Lin Chen, Chuang-Shin Chiou, Ming-Shun Chan, Pei-Wen Ding