Patents by Inventor Chuang-Yi Chiu

Chuang-Yi Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    Publication number: 20180315714
    Abstract: A chip package structure and a manufacturing method thereof are provided. The chip package structure includes a circuit board, a chip, a housing, an antenna pattern, a conductive line pattern and a shielding layer. The chip is disposed on the circuit board. The housing is disposed on the circuit board and covers the chip, wherein the housing includes a cover and sidewalls, and the housing contains catalyst particles. The antenna pattern is disposed on an outer surface of the cover. The conductive line pattern is disposed on an outer surface of the sidewalls and electrically connected to the antenna pattern and the circuit board. The shielding layer is disposed at least on an inner surface of the cover.
    Type: Application
    Filed: April 26, 2017
    Publication date: November 1, 2018
    Applicant: Unimicron Technology Corp.
    Inventors: Jui-Chun Kuo, Chuang-Yi Chiu, Kuei-Sheng Wu, Wen-Shen Lo