Patents by Inventor Chuanguo WANG

Chuanguo WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240179858
    Abstract: A housing comprises a first housing with a first through-hole, a second housing with a second through-hole, a decoration part with a third through-hole, and a first breathable film. The first housing is disposed outside the second housing, and the decoration part is disposed on the first housing and covers the first through-hole. An orthographic projection of the third through-hole on the second housing is located outside an orthographic projection of the second through-hole on the second housing. A first gap exists between the decoration part and the second housing and is communicated with both the second through-hole and the third through-hole. The first breathable film is disposed on the second housing and covers the second through-hole.
    Type: Application
    Filed: January 18, 2022
    Publication date: May 30, 2024
    Inventors: Jiuliang GAO, Kangle XUE, Yan WANG, Chuanguo WANG
  • Publication number: 20240089650
    Abstract: Disclosed are a speaker module and an earphone. The speaker module includes a first speaker unit, a bracket, and a second speaker unit. The first speaker unit includes a basin frame and a wiring terminal. The wiring terminal is disposed on the basin frame. The bracket includes an electrically conductive portion. The second speaker unit is fastened to the basin frame by using the bracket. An electrode of the second speaker unit is electrically connected to the wiring terminal by using the electrically conductive portion.
    Type: Application
    Filed: August 24, 2022
    Publication date: March 14, 2024
    Inventors: Chuanguo WANG, Yunhai LI, Dong WU, Chienfeng YEH, Yuanwu JIANG
  • Publication number: 20240080610
    Abstract: A speaker module and a headset (100) are provided. The speaker module is used for the headset (100). The headset (100) includes a housing (1). The speaker module includes a first speaker unit (4a) and a second speaker unit (4b). An outer surface of a first diaphragm assembly (4a21) of the first speaker unit (4a) faces a first side, the second speaker unit (4b) is located on one side of a circumferential direction of the first speaker unit (4a), the second speaker unit (4b) emits sound toward the first side, and sound emission frequency of the second speaker unit (4b) is greater than sound emission frequency of the first speaker unit (4a).
    Type: Application
    Filed: August 25, 2022
    Publication date: March 7, 2024
    Inventors: Jinhua LIU, Jianfei CHU, Yunhai LI, Chuanguo WANG
  • Publication number: 20230078037
    Abstract: The present disclosure provides example electronic devices, auxiliary materials, and rear housing assemblies of an electronic device. One example electronic device includes a rear housing, a middle frame, a functional component, a speaker box, and an auxiliary material, where the rear housing covers the middle frame and forms a mounting cavity together with the middle frame. The functional component, the speaker box, and the auxiliary material are disposed in the mounting cavity. The functional component is adjacent to the speaker box. A rear acoustic cavity of the speaker box is connected to the mounting cavity. The auxiliary material is bonded between the rear housing and the functional component. The auxiliary material has a weak-adhesion surface and a strong-adhesion surface that are opposite to each other. The weak-adhesion surface is bonded to the functional component, and the strong-adhesion surface is bonded to the rear housing.
    Type: Application
    Filed: March 2, 2021
    Publication date: March 16, 2023
    Inventors: Tienan ZHANG, Chao XU, Yuguo ZHANG, Chuanguo WANG, Cheng ZHANG
  • Patent number: D1025263
    Type: Grant
    Filed: March 12, 2022
    Date of Patent: April 30, 2024
    Assignee: Hefei Bohong Information Technology Co., Ltd.
    Inventor: Chuanguo Wang