Abstract: Embodiments of the present application provide a method and an apparatus for adjusting metal wiring density. By detecting metal wiring density in each of metal density detection windows in a target layout, a region in which the metal wiring density is greater than a preset density threshold can be quickly positioned in the target layout, thereby improving the layout correction efficiency; then a power fill mesh in a target metal density detection window in which the metal wiring density is greater than the preset density threshold is cropped multiple times, until the metal wiring density in each of the metal density detection windows is less than or equal to the preset density threshold, such that sufficient power fill meshes are retained in the target layout while the metal wiring density of the target layout is less than or equal to the preset density threshold.

Abstract: Embodiments of the application disclose a check tool and a check method for a Design Rule Check (DRC) rule deck of an integrated circuit layout. The check tool (100) for the DRC rule deck of the integrated circuit layout includes: an intelligent database creation engine (110), configured to generate a test case database; an intelligent arrangement engine (120), configured to generate a standard integrated circuit layout (150) according to the test case database; and an intelligent detection and analysis engine (130), configured to detect and analyze a target DRC rule deck (140) of the integrated circuit layout according to the standard integrated circuit layout (150).

Abstract: A method and an apparatus for checking a signal line are provided. The method includes: obtaining custom design information of a target signal line in a circuit schematic, and generating a layout design rule corresponding to the target signal line based on the custom design information; checking whether the target signal line meets the layout design rule in a circuit layout corresponding to the circuit schematic; and adding a first label to a position of the target signal line in the circuit layout when the target signal line in the circuit layout does not meet the layout design rule. The first label is configured to indicate that the target signal line does not meet the layout design rule.

Abstract: Embodiments of the present disclosure relate to the field of semiconductor circuit design and provide an analysis system for signal eye diagrams and method. The analysis system includes: a display structure, configured to receive a plurality of pieces of first display information of a plurality of groups of signal eye diagrams, receive second display information of a standard effective region generated based on an industry standard, display all the signal eye diagrams based on the first display information, and display an outer edge of the standard effective region based on the second display information, where each signal eye diagram corresponds to one piece of first display information, different signal eye diagrams are located in different layers, and different signal eye diagrams are displayed in different ways.

Abstract: Embodiments relate to the field of semiconductors, and provide a method for layout placement and routing, a circuit layout, an electronic device, and a storage medium. The method includes: generating a plurality of layout units (100) arranged along a preset direction (X) based on a schematic circuit diagram, each of the plurality of layout units (100) having a plurality of connection nodes (101), and two connection nodes (101) at two ends of each of the plurality of layout units (100) being defined as assessment nodes; determining any one of the plurality of layout units (100) as a target layout unit, and obtaining a positional relationship between the connection nodes (101) in rest of the plurality of layout units having same node information as the assessment nodes in the target layout unit and the assessment nodes; and performing routing to electrically connect the connection nodes (101) having the same node information.

Abstract: The present disclosure relates to a layout repairing method and apparatus, a computer device, and a storage medium. The method includes: obtaining an initial layout of a semiconductor integrated circuit, wherein a metal connection line is formed on the initial layout; forming a power fill grid on the initial layout, wherein the power fill grid includes a slotted hole that overlaps orthographic projection of the metal connection line on the power fill grid, and the slotted hole includes a first section overlapping the metal connection line and at least one second section staggered with the metal connection line; and increasing area of the second section if the area of the second section is less than a lower threshold, to form a repaired layout.

Abstract: A DRC test pattern generation method includes: receiving a DRC test pattern generation request, the DRC test pattern generation request carrying the number of correct patterns and the number of erroneous patterns; acquiring layout design rule information and corresponding layer configuration information, the layer configuration information including process layer configuration parameter information that is set according to a process type; parsing parameter information corresponding to each rule in the layout design rule information and the process layer configuration parameter information in the layer configuration information, and generating formatted parameter information corresponding to the each rule; and generating a corresponding number of correct patterns and a corresponding number of erroneous patterns corresponding to each rule according to the formatted parameter information.

Abstract: A method for automatic expansion of a storage array includes: acquiring a word-line total number and bit-line total number of a target expanded storage array; calculating a translation amount of a translation array in a translation direction according to the word-line total number and the bit-line total number, a word-line total number and bit-line total number of the translation array and a preset translation rule, and calculating a number of repetitions of a repetition array in a repetition direction according to the translation amount, a word-line total number and bit-line total number of the repetition array and a preset repetition rule; and controlling at least part of the translation array and at least part of the repetition array to translate the translation amount along the translation direction and controlling the repetition array to repeat for the number of repetitions along the repetition direction to obtain the target expanded storage array.

Abstract: Embodiments of the present application provide a method and an apparatus for adjusting metal wiring density. By detecting metal wiring density in each of metal density detection windows in a target layout, a region in which the metal wiring density is greater than a preset density threshold can be quickly positioned in the target layout, thereby improving the layout correction efficiency; then a power fill mesh in a target metal density detection window in which the metal wiring density is greater than the preset density threshold is cropped multiple times, until the metal wiring density in each of the metal density detection windows is less than or equal to the preset density threshold, such that sufficient power fill meshes are retained in the target layout while the metal wiring density of the target layout is less than or equal to the preset density threshold.

Abstract: A semiconductor integrated circuit design method and apparatus, and relates to the technical field of semiconductors are provided. The semiconductor integrated circuit design method includes: determining, based on an original layout, an original length of an end of a gate structure extending out of an active region in which the gate structure is located; redetermining, based on a preset rule and the original length, a correction length of the end of the gate structure extending out of the active region in which the gate structure is located; and integrating the original layout and the correction lengths, and forming an updated layout.

Abstract: A method and an apparatus of designing an integrated circuit are provided. The method includes: S1, loading a power fill to a circuit layout with original metal lines; S2, checking whether a current layout includes a region with a spacing error; if yes, performing S3; otherwise, outputting the current layout; and S3, pruning a power fill shape corresponding to the region with a spacing error by a predetermined spacing width delta, and returning to the S2.

Abstract: The present application relates to a layout method and a layout apparatus for an integrated circuit. The layout method for an integrated circuit includes the following steps: providing a layout, the layout including a first element region and a second element region, a spacing region being provided between the first element region and the second element region; and detecting whether a width of the spacing region is less than a preset width, and if yes, marking at least one of the first element region, the second element region and the spacing region, the preset width being a minimum width meeting a requirement, wherein the requirement is to fill the spacing region with at least one dummy pattern.

Abstract: Embodiments of the application disclose a check tool and a check method for a Design Rule Check (DRC) rule deck of an integrated circuit layout. The check tool (100) for the DRC rule deck of the integrated circuit layout includes: an intelligent database creation engine (110), configured to generate a test case database; an intelligent arrangement engine (120), configured to generate a standard integrated circuit layout (150) according to the test case database; and an intelligent detection and analysis engine (130), configured to detect and analyze a target DRC rule deck (140) of the integrated circuit layout according to the standard integrated circuit layout (150).