Abstract: Embodiments relate to an audio system that performs equalization of audio signals based on one or more diffuse field head-related transfer functions (HRTFs) and device-specific data. User-specific data and device-specific data (i.e., transducer-specific data) are applied to an acoustic model to predict an acoustic response for a user. An equalization filter is then determined using the acoustic response and the one or more diffuse field HRTFs. The equalization filter is applied to a processed version of an audio signal to create a modified version of the audio signal. The modified version of the audio signal is presented to the user via a transducer array of the audio system. The audio system can further include a microphone assembly that reduces the Helmholtz resonance effect.

Abstract: Embodiments relate to an audio system that performs equalization of audio signals based on one or more diffuse field head-related transfer functions (HRTFs) and device-specific data. User-specific data and device-specific data (i.e., transducer-specific data) are applied to an acoustic model to predict an acoustic response for a user. An equalization filter is then determined using the acoustic response and the one or more diffuse field HRTFs. The equalization filter is applied to a processed version of an audio signal to create a modified version of the audio signal. The modified version of the audio signal is presented to the user via a transducer array of the audio system. The audio system can further include a microphone assembly that reduces the Helmholtz resonance effect.

Abstract: The disclosed computing device may include electronic components, at least one of which is a processor. The computing device may also include a heat sink thermally coupled to the electronic components, as well as a temperature sensor that determines the current temperature inside the computing device. The computing device may further include a controller. The processor may generate a load schedule for the electronic components based on the current temperature inside the computing device. This load schedule ensures that a maximum temperature for the heat sink is not exceeded even when the total system power load exceeds, for a short period of time, the maximum sustainable power level the heat sink can dissipate. The controller may then load the electronic components according to the generated load schedule. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: Embodiments relate to an audio system that performs equalization of audio signals based on one or more diffuse field head-related transfer functions (HRTFs) and device-specific data. User-specific data and device-specific data (i.e., transducer-specific data) are applied to an acoustic model to predict an acoustic response for a user. An equalization filter is then determined using the acoustic response and the one or more diffuse field HRTFs. The equalization filter is applied to a processed version of an audio signal to create a modified version of the audio signal. The modified version of the audio signal is presented to the user via a transducer array of the audio system. The audio system can further include a microphone assembly that reduces the Helmholtz resonance effect.

Abstract: The disclosed computing device may include electronic components, at least one of which is a processor. The computing device may also include a heat sink thermally coupled to the electronic components, as well as a temperature sensor that determines the current temperature inside the computing device. The computing device may further include a controller. The processor may generate a load schedule for the electronic components based on the current temperature inside the computing device. This load schedule ensures that a maximum temperature for the heat sink is not exceeded even when the total system power load exceeds, for a short period of time, the maximum sustainable power level the heat sink can dissipate. The controller may then load the electronic components according to the generated load schedule. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: The disclosed computing device may include electronic components, at least one of which is a processor. The computing device may also include a heat sink thermally coupled to the electronic components, as well as a temperature sensor that determines the current temperature inside the computing device. The computing device may further include a controller. The processor may generate a load schedule for the electronic components based on the current temperature inside the computing device. This load schedule ensures that a maximum temperature for the heat sink is not exceeded even when the total system power load exceeds, for a short period of time, the maximum sustainable power level the heat sink can dissipate. The controller may then load the electronic components according to the generated load schedule. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: A removeable drive-plane board may include (1) keyhole openings that are configured to interlock with keyhole fasteners of a retaining member of a storage-system chassis, (2) storage-drive connectors, (3) a storage-system module connector, and (4) electrical interconnects that electrically couple the storage-drive connectors to the storage-system module connector. In some examples, the keyhole fasteners of the retaining member may be oriented downward relative to the storage-system chassis. Various other removeable drive-plane apparatus, systems, and methods are also disclosed.

Abstract: The disclosed mounting systems may include a rail assembly, a cradle, and at least one bracket. The rail assembly may include at least one base rail element and at least one sliding rail element. The cradle may be configured to couple to the sliding rail element. The bracket may be configured to support a video-conferencing device and to couple to the cradle. Various other related methods and systems are also disclosed.

Abstract: The disclosed mounting system for a video-conferencing device may include a cradle configured to support a video-conferencing device, a top bracket configured to couple to a chassis of the video-conferencing device and configured to removably couple to an upper portion of the cradle, and a bottom bracket configured to couple to the chassis and configured to removably couple to a lower portion of the cradle. Various other methods and systems are also disclosed.

Abstract: A display system includes a display device having a wedge base to enable the display device to rest on a horizontal surface or to be mounted to a vertical surface in a number of different mounting configurations. A mounting kit provides parts usable to mount the display device to a wall or door jam in alternative ways. The mounting kit includes several modular parts, where many of the parts are usable in multiple mounting configurations, thereby reducing the number of parts needed for the kit. The mounting configurations include paths for cables to hide them when the display is installed.

Abstract: A multi-purpose storage-system partition may include (1) a bottom having a keyhole fastener configured to (a) interlock with a keyhole opening of a removable drive-plane board having front storage-drive connectors and rear storage-drive connectors and (b) retain the removable drive-plane board within a storage-system chassis, (2) a front having front storage-drive contact points configured to (a) retain front carrierless storage drives within the storage-system chassis and (b) align the front carrierless storage drives with the front storage-drive connectors, (3) a rear having rear storage-drive contact points configured to (a) retain rear carrierless storage drives within the storage-system chassis and (b) align the rear carrierless storage drives with the rear storage-drive connectors, (4) and a side having a fastener-retaining member configured to engage a fastener that couples the multi-purpose storage-system partition to a side of the storage-system chassis.

Abstract: A drive latch apparatus may include a latch coupled to a chassis such that the latch secures a hard drive to the chassis. The apparatus may also include a handle coupled to a proximal end of the latch such that compressing the handle unlocks the latch from the chassis. In addition, the apparatus may include a drive holder coupled to a distal end of the latch such that a distal end of the drive holder bends under the hard drive to unseat the hard drive and the drive holder slides vertically from the chassis in tandem with the latch. Various other apparatuses, systems, and methods are also disclosed.

Abstract: An interface adapter may include a printed circuit board that includes an edge connector dimensioned to be inserted into an expansion socket of a computing device. The interface adapter may also include a plurality of modular computing components removably mounted to a top surface of the printed circuit board, where each modular computing component includes a connector dimensioned to be inserted into a socket of the printed circuit board and the connector of each modular computing component includes a pinout that is more compact than a pinout of the edge connector of the printed circuit board. In addition, the interface adapter may include one or more modular heatsinks coupled to a top surface of each modular computing component to facilitate heat dissipation from the top surface of the modular computing component. Various other apparatuses, systems, and methods are also disclosed.

Abstract: An interface adapter may include a printed circuit board that includes an edge connector dimensioned to be inserted into an expansion socket of a computing device. The interface adapter may also include a plurality of modular computing components removably mounted to a top surface of the printed circuit board, where each modular computing component includes a connector dimensioned to be inserted into a socket of the printed circuit board and the connector of each modular computing component includes a pinout that is more compact than a pinout of the edge connector of the printed circuit board. In addition, the interface adapter may include one or more modular heatsinks coupled to a top surface of each modular computing component to facilitate heat dissipation from the top surface of the modular computing component. Various other apparatuses, systems, and methods are also disclosed.

Abstract: The disclosed mounting assembly for mounting information technology modules within an information technology rack may include (1) a support tray coupled to a frame of the information technology rack, (2) a drawer positioned on the support tray that is moveable between an initial position and an extended position within the support tray, and (3) at least one elongate handle, attached to a front panel of the drawer, that includes a button that interacts with a latching mechanism that locks the drawer into the initial position, where (1) when disengaged, the latching mechanism allows the drawer to move into the extended position and (2) the latching mechanism is disengaged when the button is pressed.

Abstract: An apparatus for dampening vibrations generated by exhaust fans may include (1) at least one exhaust fan that (A) generates airflow across an array of storage devices that include rotating disks and (B) generates acoustic waves that produce propagating vibrations and (2) at least one acoustic attenuator that (A) includes a group of honeycomb-shaped openings that dampen the acoustic waves generated by the exhaust fan and (B) mitigates, by way of the honeycomb-shaped openings, interference to the rotating disks caused by the propagating vibrations produced by the acoustic waves. Various other apparatuses, systems, and methods are also disclosed.

Abstract: An apparatus for dampening vibrations generated by exhaust fans may include (1) at least one exhaust fan that (A) generates airflow across an array of storage devices that include rotating disks and (B) generates acoustic waves that produce propagating vibrations and (2) at least one acoustic attenuator that (A) includes a group of honeycomb-shaped openings that dampen the acoustic waves generated by the exhaust fan and (B) mitigates, by way of the honeycomb-shaped openings, interference to the rotating disks caused by the propagating vibrations produced by the acoustic waves. Various other apparatuses, systems, and methods are also disclosed.

Abstract: A multi-purpose storage-system partition may include (1) a bottom having a keyhole fastener configured to (a) interlock with a keyhole opening of a removable drive-plane board having front storage-drive connectors and rear storage-drive connectors and (b) retain the removable drive-plane board within a storage-system chassis, (2) a front having front storage-drive contact points configured to (a) retain front carrierless storage drives within the storage-system chassis and (b) align the front carrierless storage drives with the front storage-drive connectors, (3) a rear having rear storage-drive contact points configured to (a) retain rear carrierless storage drives within the storage-system chassis and (b) align the rear carrierless storage drives with the rear storage-drive connectors, (4) and a side having a fastener-retaining member configured to engage a fastener that couples the multi-purpose storage-system partition to a side of the storage-system chassis.

Abstract: A rack latch apparatus may include a rigid rack lock latch that includes a distal end coupled to a chassis and a protrusion dimensioned to lock the chassis in a rack. The apparatus may also include at least one spring standoff that couples the distal end of the rack lock latch to the chassis such that a tension maintains a locked position of the rack lock latch during a shock event. Various other apparatuses, systems, and methods are also disclosed.

Abstract: An expansion card latching mechanism may include a base anchored to a printed circuit board. The latching mechanism may also include a latch coupled to the base such that a proximal end of the latch locks a proximal end of an expansion card to a fixed position on the printed circuit board. In addition the latching mechanism may include a compression spring wrapped around an arm of the latch such that the compression spring exerts a tension to maintain a locked position of the latch. Various other apparatuses, systems, and methods are also disclosed.