Abstract: A glue application head for bonding is provided, including a main body. The main body includes a cavity for storing glue and a slit for applying the glue. Through the slit, the glue in the cavity is discharged from the glue application head to be applied on a workpiece to form a glue path with a predetermined line width. Not only can a glue layer with a uniform thickness be obtained, but also a problem of no glue coming out can be prevented. Accordingly, the glue application head has improved performance in coating the glue on the workpiece, and bonding ability of the glue can also be improved. A gluing mechanism with the glue application head and a bonding equipment including the gluing mechanism are also provided. A good fit is provided between the glue application head and the workpiece to prevent no dispensing and an overflow of the glue.