Patents by Inventor Chuanning Chen

Chuanning Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9928767
    Abstract: A system and method of testing chip-on-glass (COG) bonding quality automatically includes a glass panel comprising two test pads, the test pads electrically interconnected, a display driver comprising an input node and an output node, and an adhesive layer between the glass panel and the display driver, the adhesive layer binding the glass panel with the display driver, the adhesive layer comprising conductive portions across the adhesive layer between the glass panel and the display driver, wherein the input node, the output node, the two test pads, and the conductive portions are electrically connected to form an electrical testing loop, the electrical testing loop configured to measure a voltage drop across the conductive portions.
    Type: Grant
    Filed: January 5, 2016
    Date of Patent: March 27, 2018
    Assignee: Futurewei Technologies, Inc.
    Inventors: Xiangan Zhu, Guoping Luo, Qian Han, Shunlin Chen, Guangrong Wu, Jose Garcia, Steven R. Loza, Chuanning Chen
  • Publication number: 20170193870
    Abstract: A system and method of testing chip-on-glass (COG) bonding quality automatically includes a glass panel comprising two test pads, the test pads electrically interconnected, a display driver comprising an input node and an output node, and an adhesive layer between the glass panel and the display driver, the adhesive layer binding the glass panel with the display driver, the adhesive layer comprising conductive portions across the adhesive layer between the glass panel and the display driver, wherein the input node, the output node, the two test pads, and the conductive portions are electrically connected to form an electrical testing loop, the electrical testing loop configured to measure a voltage drop across the conductive portions.
    Type: Application
    Filed: January 5, 2016
    Publication date: July 6, 2017
    Inventors: Xiangan Zhu, Guoping Luo, Qian Han, Shunlin Chen, Guangrong Wu, Jose Garcia, Steven R. Loza, Chuanning Chen
  • Publication number: 20070030858
    Abstract: A broadband access device comprises a subscriber interface board, a master control board and a backboard, wherein the backboard is configured with a uniform serial bus; the subscriber interface board is configured with an interface unit; and the interface unit is connected to the master control board via the serial bus of backboard. A broadband access method comprises: connecting the master control board and subscriber interface board via a uniform serial bus; transforming the subscriber traffics into serial signal frames by the master control board or the subscriber interface board, and transmitting the serial signal frames to the other board; upon receiving the serial signal frames by the other board, restoring the format of the serial signal frames and transmitting the restored data to corresponding data channel. The present invention achieves broadband access when different access techniques are adopted, simplifies device structure and reduces costs.
    Type: Application
    Filed: July 25, 2006
    Publication date: February 8, 2007
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Chuanning Chen, Wumao Chen, Yangbao Jin