Abstract: Disclosed is a method for measuring gas pressure of a close-distance seam group simultaneously, including the following steps: constructing a pressure-measuring drill hole inclined downwards; lowering a first seam piezometer tube, lowering a baffle and a polyurethane blocking material after a tube head reaching a lowermost seam; and installing a gas pressure gauge; lowering a second seam piezometer tube, lowering the baffle and the polyurethane blocking material after the tube head reaching a second layer of seam; and installing the gas pressure gauge; lowering a nth seam piezometer tube, lowering the baffle and the polyurethane blocking material after the tube head reaching a nth layer of seam; and installing the gas pressure gauge; injecting a high-water and quick-solidifying material into the drill hole; and connecting the gas pressure gauges through optical fibers, and connecting the gas pressure gauges with a ground control system.

Abstract: Disclosed is a method for measuring gas pressure of a close-distance seam group simultaneously, including the following steps: constructing a pressure-measuring drill hole inclined downwards; lowering a first seam piezometer tube, lowering a baffle and a polyurethane blocking material after a tube head reaching a lowermost seam; and installing a gas pressure gauge; lowering a second seam piezometer tube, lowering the baffle and the polyurethane blocking material after the tube head reaching a second layer of seam; and installing the gas pressure gauge; lowering a nth seam piezometer tube, lowering the baffle and the polyurethane blocking material after the tube head reaching a nth layer of seam; and installing the gas pressure gauge; injecting a high-water and quick-solidifying material into the drill hole; and connecting the gas pressure gauges through optical fibers, and connecting the gas pressure gauges with a ground control system.

Abstract: An electronics assembly line includes a first electronics assembly machine and a second electronics assembly machine. The first electronics assembly machine has a first electronics assembly machine outlet. The second electronics assembly machine has a second electronics assembly machine inlet and outlet. The inlet of the second electronics assembly machine is coupled to the outlet of the first electronics assembly machine by a conveyor. A first optical inspection sensor is disposed over the conveyor before the inlet of the second electronics assembly and is configured to provide first sensor inspection image data relative to a substrate that passes beneath the first optical inspection sensor in a non-stop fashion. A second optical inspection sensor is disposed over the conveyor after the outlet of the second electronics assembly machine and is configured to provide second sensor inspection image data relative to a substrate that passes beneath the second optical inspection sensor in a non-stop fashion.

Abstract: An optical inspection sensor is provided. The sensor includes an array of cameras configured to acquire image data relative to a workpiece that moves relative to the array of cameras in a non-stop fashion. An illumination system is disposed to provide a pulse of illumination when the array of cameras acquires the image data. At least some image data includes data regarding a skip mark or barcode on the workpiece.

Abstract: An optical inspection system (92) for inspecting a workpiece (10) including a feature (60) to be inspected is provided. The system (92) includes a workpiece transport conveyor (26) configured to transport the workpiece (10) in a nonstop manner. The system (92) also includes an illuminator (9) configured to provide a first strobed illumination field type and a second strobed illumination field type. An array of cameras (4) is configured to digitally image the feature, wherein the array of cameras (4) is configured to generate a first image of the feature with the first illumination field and a second image of the feature with the second illumination field. A processing device (90) is operably coupled to the illuminator (9) and the array of cameras (4), the processing device (90) provides an inspection result relative to the feature (60) on the workpiece (10) based, at least in part, upon the first and second images.

Abstract: An electronics assembly line includes a first electronics assembly machine and a second electronics assembly machine. The first electronics assembly machine has a first electronics assembly machine outlet. The second electronics assembly machine has a second electronics assembly machine inlet and outlet. The inlet of the second electronics assembly machine is coupled to the outlet of the first electronics assembly machine by a conveyor. A first optical inspection sensor is disposed over the conveyor before the inlet of the second electronics assembly and is configured to provide first sensor inspection image data relative to a substrate that passes beneath the first optical inspection sensor in a non-stop fashion. A second optical inspection sensor is disposed over the conveyor after the outlet of the second electronics assembly machine and is configured to provide second sensor inspection image data relative to a substrate that passes beneath the second optical inspection sensor in a non-stop fashion.

Abstract: A scanning apparatus includes a support frame and a laser scanner mounted to the frame. A five bar closed loop spherical linkage supports a clamping device for retaining an object. The linkage moves the object through a scanning beam about a spherical surface to facilitate scanning of curved objects. The linkage is mounted on an arm rotatably mounted to the frame and the clamping device is rotatably mounted to the linkage to provide four degrees of freedom. Encoders and motors drive the linkage to provide accurate positioning and providing for digitizing the scanned object.

Abstract: A scanning apparatus includes a support frame and a laser scanner mounted to the frame. A five bar closed loop spherical linkage supports a clamping device for retaining an object. The linkage moves the object through a scanning beam about a spherical surface to facilitate scanning of curved objects. The linkage is mounted on an arm rotatably mounted to the frame and the clamping device is rotatably mounted to the linkage to provide four degrees of freedom. Encoders and motors drive the linkage to provide accurate positioning and providing for digitizing the scanned object.

Abstract: A scanning apparatus includes a support frame and a laser scanner mounted to the frame. A five bar closed loop spherical linkage supports a clamping device for retaining an object. The linkage moves the object through a scanning beam about a spherical surface to facilitate scanning of curved objects. The linkage is mounted on an arm rotatably mounted to the frame and the clamping device is rotatably mounted to the linkage to provide four degrees of freedom. Encoders and motors drive the linkage to provide accurate positioning and providing for digitizing the scanned object.