Abstract: Disclosed is a reflow solderable positive temperature coefficient circuit protective device, comprising: an upper conductive blade terminal (1), which is composed of a first chip bonding portion (101), a first circuit bonding portion (105) and a connecting portion (103) therebetween, wherein the first chip bonding portion (101) has a first planar profile; a lower conductive blade terminal (2), which comprises a second chip bonding portion (201) having a second planar profile; a positive temperature coefficient chip, which is sandwiched between the upper conductive blade terminal (1) and the lower conductive blade terminal (2) and respectively bonded to the lower surface of the first chip bonding portion (101) and the upper surface of the second chip bonding portion (201) via solder, and has a third planar profile, wherein: the first planar profile and the second planar profile are in the interior of the third planar profile, and the third planar profile has portions that are not covered by the first planar pr

Abstract: A reflow solderable positive temperature coefficient circuit protection device is provided, the device comprising: an electrically conductive sheet-like upper terminal composed of a first chip junction portion, a first circuit junction portion, and a connection portion therebetween, wherein the first chip junction portion having a first planar profile; an electrically conductive sheet-like lower terminal comprising a second chip junction portion having a second planar profile; and a positive temperature coefficient chip which is sandwiched between the sheet-like upper terminal and the sheet-like lower terminal, and respectively combined with the lower surface of the first chip junction portion and the upper surface of the second chip junction portion by soldering, and the positive temperature coefficient chip having a third planar profile.