Patents by Inventor Chuantong CHEN

Chuantong CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • BONDING MEMBER, METHOD FOR PRODUCING BONDING MEMBER AND METHOD FOR PRODUCING BONDING STRUCTURE
    Publication number: 20220347799
    Abstract: A bonding member (10) includes surface-processed silver surfaces (11a, 11b).
    Type: Application
    Filed: July 13, 2022
    Publication date: November 3, 2022
    Applicant: OSAKA UNIVERSITY
    Inventors: Katsuaki SUGANUMA, Chuantong CHEN, Toshiyuki ISHINA, Seungjun NOH, Chanyang CHOE
  • BONDING STRUCTURE PRODUCTION METHOD AND BONDING STRUCTURE
    Publication number: 20220230988
    Abstract: A bonding structure production method for producing a bonding structure (100) includes at least bonding a semiconductor element (30) and a substrate (10) using a silver paste. The substrate (10) includes a die attachment portion (12) to which the semiconductor element (30) is to be bonded. The die attachment portion (12) includes an alumina layer (16) serving as a surface layer on a bonding side of the die attachment portion (12) to which the semiconductor element (30) is to be bonded. The silver paste contains a solvent and silver particles with a residual strain measured by X-ray diffractometry of at least 5.0%. Preferably, the silver particles have a volume-based 50% cumulative diameter of at least 100 nm and no greater than 50 ?m.
    Type: Application
    Filed: May 28, 2020
    Publication date: July 21, 2022
    Applicant: OSAKA UNIVERSITY
    Inventors: Katsuaki SUGANUMA, Chuantong CHEN, Zheng ZHANG
  • BONDING MEMBER, METHOD FOR PRODUCING BONDING MEMBER AND METHOD FOR PRODUCING BONDING STRUCTURE
    Publication number: 20200039007
    Abstract: A bonding member (10) includes surface-processed silver surfaces (11a, 11b).
    Type: Application
    Filed: February 23, 2018
    Publication date: February 6, 2020
    Applicant: OSAKA UNIVERSITY
    Inventors: Katsuaki SUGANUMA, Chuantong CHEN, Toshiyuki ISHINA, Seungjun NOH, Chanyang CHOE