Abstract: This invention discloses a method for manufacturing a CMOS acoustic pressure sensor. After completing the CMOS process, a cavity is etched into the substrate of the CMOS wafer, and then the oxide insulation structure on the front side of the CMOS wafer is removed, thereby completing the fabrication of the CMOS acoustic pressure sensor.

Abstract: The disclosure provides a method for generating training data and an electronic device. The method includes: obtaining an object model of a specific object; obtaining a first image when the object model is positioned at a first angle and a first silhouette corresponding to the first image; retrieving a first object image representing the specific object positioned at the first angle from the first image based on the first silhouette; embedding the first object image into a first background image to generate a first training image; generating a first labeled data of the first object image in the first training image; and defining the first training image and the first labeled data as a first training data of the specific object.

Abstract: The present invention discloses a Micro-Electro-Mechanical System (MEMS) acoustic pressure sensor device and a method for making same. The MEMS device includes: a substrate; a fixed electrode provided on the substrate; and a multilayer structure, which includes multiple metal layers and multiple metal plugs, wherein the multiple metal layers are connected by the multiple metal plugs. A cavity is formed between the multilayer structure and the fixed electrode. Each metal layer in the multilayer structure includes multiple metal sections. The multiple metal sections of one metal layer and those of at least another metal layer are staggered to form a substantially blanket surface as viewed from a moving direction of an acoustic wave.

Abstract: A complementary metal-oxide-semiconductor (CMOS) micro electro-mechanical system (MEMS) microphone and a method for fabricating the same are disclosed. Firstly, a CMOS device including a semiconductor substrate, a first oxide insulation layer, a doped polysilicon layer, a second oxide insulation layer, a patterned polysilicon layer, and a metal wiring layer from bottom to top. The metal wiring layer is formed on the second oxide insulation layer. The patterned polysilicon layer includes undoped polysilicon. Then, a part of the metal wiring layer is removed to form a metal electrode and the semiconductor substrate is penetrated to have a chamber and expose the first oxide insulation layer, thereby forming a MEMS microphone.

Abstract: A complementary metal-oxide-semiconductor (CMOS) micro electro-mechanical system (MEMS) microphone and a method for fabricating the same are disclosed. Firstly, a CMOS device including a semiconductor substrate, a first oxide insulation layer, a doped polysilicon layer, a second oxide insulation layer, a patterned polysilicon layer, and a metal wiring layer from bottom to top. The metal wiring layer is formed on the second oxide insulation layer. The patterned polysilicon layer includes undoped polysilicon. Then, a part of the metal wiring layer is removed to form a metal electrode and the semiconductor substrate is penetrated to have a chamber and expose the first oxide insulation layer, thereby forming a MEMS microphone.

Abstract: The present invention discloses a Micro-Electro-Mechanical System (MEMS) acoustic pressure sensor device and a method for making same. The MEMS device includes: a substrate; a fixed electrode provided on the substrate; and a multilayer structure, which includes multiple metal layers and multiple metal plugs, wherein the multiple metal layers are connected by the multiple metal plugs. A cavity is formed between the multilayer structure and the fixed electrode. Each metal layer in the multilayer structure includes multiple metal sections. The multiple metal sections of one metal layer and those of at least another metal layer are staggered to form a substantially blanket surface as viewed from a moving direction of an acoustic wave.

Abstract: The present invention discloses a Micro-Electro-Mechanical System (MEMS) acoustic pressure sensor device and a method for making same. The MEMS device includes: a substrate; a fixed electrode provided on the substrate; and a multilayer structure, which includes multiple metal layers and multiple metal plugs, wherein the multiple metal layers are connected by the multiple metal plugs. A cavity is formed between the multilayer structure and the fixed electrode. Each metal layer in the multilayer structure includes multiple metal sections. The multiple metal sections of one metal layer and those of at least another metal layer are staggered to form a substantially blanket surface as viewed from a moving direction of an acoustic wave.

Abstract: A makeup device and a makeup jet device thereof are disclosed. The makeup device includes a platform, at least one rotating board, at least one rotating axle, at least one gear, a driving source, at least one substrate, at least one actuated jet head and a controller combined with each other. The actuated jet head includes first nozzle sets, second nozzle sets, first passages accommodating color cosmetic materials and second passages accommodating at least one of a moisturizer and a foundation. The first nozzle sets respectively connect with the first passages, and the second nozzle sets respectively connect with the second passages. The first nozzle sets and the second nozzle sets are arranged toward skin of a body part of a user, wherein the nozzle size of the first nozzle set is less than that of the second nozzle set.

Abstract: The present invention discloses a Micro-Electro-Mechanical System (MEMS) acoustic pressure sensor device and a method for making same. The MEMS device includes: a substrate; a fixed electrode provided on the substrate; and a multilayer structure, which includes multiple metal layers and multiple metal plugs, wherein the multiple metal layers are connected by the multiple metal plugs. A cavity is formed between the multilayer structure and the fixed electrode. Each metal layer in the multilayer structure includes multiple metal sections. The multiple metal sections of one metal layer and those of at least another metal layer are staggered to form a substantially blanket surface as viewed from a moving direction of an acoustic wave.

Abstract: An abnormal status monitoring system includes a monitored side and a monitoring side. The monitored side includes a first status sensing unit for generating status information of the monitored side and a signal transmission unit for transmitting a wireless signal which includes the status information of the monitored side. The monitoring side includes a second status sensing unit for generating status information of the monitoring side, a signal receiving unit for receiving the wireless signal, and a control unit. When the received signal strength index of the wireless signal is higher than a first threshold value, the control unit compares the status information of the monitored side and the status information of the monitoring side. When a difference between the status information of the monitored side and the status information of the monitoring side is larger than a second threshold value, the control unit generates an alarm.

Abstract: A light source is used for emitting an invisible light toward an object. The object reflects the invisible light and reflected light is formed, and a sensor is used for receiving the reflected light. A processor is coupled to the sensor for recording a time interval of the invisible light traveling from the light source to the object and reflected from the object to the sensor. Then, the processor estimates a measurement distance of the object according to the time interval, and adjusts an emission period of the light source, an exposure period of the sensor, intensity of the invisible light, and/or main sensing range of the sensor according to the measurement distance.

Abstract: A microphone device includes a carrier board, a micro electro-mechanical system unit, an integrated circuit and an upper cover. The micro electro-mechanical system unit includes a substrate, a cap and a capacitive microphone. The cap is installed on the substrate, and is composed of electrically conductive material. The capacitive microphone is positioned between the cap and the carrier board, wherein the capacitive microphone and the cap form a resonant cavity. The integrated circuit is installed on the carrier board, and arranged to control the capacitive microphone. The upper cover is connected to the carrier board, wherein the micro-electro mechanical system unit and the integrated circuit are both positioned inside a space formed by the carrier board and the upper cover.

Abstract: A microphone device includes a carrier board, a micro electro-mechanical system unit, an integrated circuit and an upper cover. The micro electro-mechanical system unit includes a substrate, a cap and a capacitive microphone. The cap is installed on the substrate, and is composed of electrically conductive material. The capacitive microphone is positioned between the cap and the carrier board, wherein the capacitive microphone and the cap form a resonant cavity. The integrated circuit is installed on the carrier board, and arranged to control the capacitive microphone. The upper cover is connected to the carrier board, wherein the micro-electro mechanical system unit and the integrated circuit are both positioned inside a space formed by the carrier board and the upper cover.

Abstract: A microphone structure is disclosed. The microphone structure comprises a substrate penetrated with at least one opening chamber and having an insulation surface. A conduction layer is arranged on the insulation surface and arranged over the opening chamber. An insulation layer is arranged on the conduction layer and having a opening to expose a part of the conduction layer as a vibration block arranged over the opening chamber. At least two first patterned electrodes are arranged on the insulation layer and arranged over the vibration block. At least two second patterned electrodes are arranged over the opening chamber, arranged on the vibration block and separated from the first patterned electrodes by at least two first gaps. When the vibration block vibrates, the vibration block moves the second patterned electrodes whereby the second patterned electrodes and the first patterned electrodes perform differential sensing.

Abstract: The present invention discloses a MEMS microphone device and its manufacturing method. The MEMS microphone device includes: a substrate including a first cavity; a MEMS device region above the substrate, wherein the MEMS device region includes a metal layer, a via layer, an insulating material region and a second cavity; a mask layer above the MEMS device region; a first lid having at least one opening communicating with the second cavity, the first lid being fixed above the mask layer; and a second lid fixed under the substrate.

Abstract: A MEMS package structure, including a substrate, an interconnecting structure, an upper metallic layer, a deposition element and a packaging element is provided. The interconnecting structure is disposed on the substrate. The MEMS structure is disposed on the substrate and within a first cavity. The upper metallic layer is disposed above the MEMS structure and the interconnecting structure, so as to form a second cavity located between the upper metallic layer and the interconnecting structure and communicates with the first cavity. The upper metallic layer has at least a first opening located above the interconnecting structure and at least a second opening located above the MEMS structure. Area of the first opening is greater than that of the second opening. The deposition element is disposed above the upper metallic layer to seal the second opening. The packaging element is disposed above the upper metallic layer to seal the first opening.

Abstract: A MEMS (Micro-Electro-Mechanical-System) structure preventing stiction, comprising: a substrate; and at least two structural layers above the substrate, wherein at least one of the at least two structural layers is a movable part, and anyone or more of the at least two structural layers is provided with at least one bump to prevent the movable part from sticking to another portion of the MEMS structure.

Abstract: A MEMS package structure, including a substrate, an interconnecting structure, an upper metallic layer, a deposition element and a packaging element is provided. The interconnecting structure is disposed on the substrate. The MEMS structure is disposed on the substrate and within a first cavity. The upper metallic layer is disposed above the MEMS structure and the interconnecting structure, so as to form a second cavity located between the upper metallic layer and the interconnecting structure and communicates with the first cavity. The upper metallic layer has at least a first opening located above the interconnecting structure and at least a second opening located above the MEMS structure. Area of the first opening is greater than that of the second opening. The deposition element is disposed above the upper metallic layer to seal the second opening. The packaging element is disposed above the upper metallic layer to seal the first opening.

Abstract: The present invention discloses a 3D information generator for use in an interactive interface. The 3D information generator includes: a MEMS light beam generator having at least one light source for providing a dot light beam and a MEMS mirror for projecting a movable scanning light beam according to the dot light beam to an object; an image sensor for sensing an image of the object to generate a 2D image information; and a processor for generating a distance information by triangulation method according to a reflection result of the scanning light beam scanning on the object, wherein the distance information is combined with the 2D image information to generate a 3D information.

Abstract: A MEMS package structure, including a substrate, an interconnecting structure, an upper metallic layer, a deposition element and a packaging element is provided. The interconnecting structure is disposed on the substrate. The MEMS structure is disposed on the substrate and within a first cavity. The upper metallic layer is disposed above the MEMS structure and the interconnecting structure, so as to form a second cavity located between the upper metallic layer and the interconnecting structure and communicates with the first cavity. The upper metallic layer has at least a first opening located above the interconnecting structure and at least a second opening located above the MEMS structure. Area of the first opening is greater than that of the second opening. The deposition element is disposed above the upper metallic layer to seal the second opening. The packaging element is disposed above the upper metallic layer to seal the first opening.