Patents by Inventor Chuanwu Liao

Chuanwu Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible printed circuit board
    Patent number: 10687415
    Abstract: A flexible printed circuit board is disclosed, which includes a pad portion, wherein the pad portion includes a pair of first signal pads formed in a first conductor layer and respectively connected with a pair of signal wires, a pair of second signal pads formed in a second conductor layer and electrically separated from a grounding layer; a pair of first grounding pads formed in the first conductor layer and electrically separated from the pair of signal wires, wherein: the pair of first signal pads is sandwiched between the pair of first grounding pads, and a pair of second grounding pads formed in the second conductor layer and connected with the grounding layer, wherein the pair of second signal pads are sandwiched between the pair of second grounding pads. A width of the first and the second signal pads is larger than that of the signal wires.
    Type: Grant
    Filed: June 5, 2017
    Date of Patent: June 16, 2020
    Assignee: DALIAN CANGLONG OPTOELECTRONICS TECHNOLOGIES CO., LTD
    Inventors: Hao Wang, Shun Zhang, Lin Cui, Wenchen Zhang, Chuanwu Liao
  • Flexible printed circuit board
    Publication number: 20190387614
    Abstract: A flexible printed circuit board is disclosed, which includes a pad portion, wherein the pad portion includes a pair of first signal pads formed in a first conductor layer and respectively connected with a pair of signal wires, a pair of second signal pads formed in a second conductor layer and electrically separated from a grounding layer; a pair of first grounding pads formed in the first conductor layer and electrically separated from the pair of signal wires, wherein: the pair of first signal pads is sandwiched between the pair of first grounding pads, and a pair of second grounding pads formed in the second conductor layer and connected with the grounding layer, wherein the pair of second signal pads are sandwiched between the pair of second grounding pads. A width of the first and the second signal pads is larger than that of the signal wires.
    Type: Application
    Filed: June 5, 2017
    Publication date: December 19, 2019
    Inventors: Hao Wang, Shun Zhang, Lin Cui, Wenchen Zhang, Chuanwu Liao