Abstract: A verification request is received. In response to receiving the verification request, a first character string is obtained. The first character string comprises one or more variable characters. At least one of the one or more variable characters in the first character string is replaced with at least one backup character to generate a second character string based on multiple pre-established corresponding relationships. A verification code is generated based on the second character string. A user corresponding to the verification request is verified based on a user input corresponding to the verification code.

Abstract: A verification request is received. In response to receiving the verification request, a first character string is obtained. The first character string comprises one or more variable characters. At least one of the one or more variable characters in the first character string is replaced with at least one backup character to generate a second character string based on multiple pre-established corresponding relationships. A verification code is generated based on the second character string. A user corresponding to the verification request is verified based on a user input corresponding to the verification code.

Abstract: The present disclosure discloses a printed circuit board, a method for manufacturing the same and an electronic device. The PCB includes: a core board assembly including a first core board and a second core board which are stacked together, wherein the second core board includes a metal layer formed on a side of the second core board oriented towards the first core board, and the first core board defines a through slot extending through the first core board; a radiator, disposed in the through slot; and a conductive adhering layer, disposed between the metal layer of the second core board and the radiator, wherein the conductive adhering layer is configured to electrically connect the radiator and the metal layer. The present disclosure connects the radiator directly with the metal layer. The implementation of the present disclosure may help cooling the metal layer to improve the cooling performance of the PCB.

Abstract: The present disclosure discloses a printed circuit board, a method for manufacturing the same and an electronic device. The PCB includes: a core board assembly including a first core board and a second core board which are stacked together, wherein the second core board includes a metal layer formed on a side of the second core board oriented towards the first core board, and the first core board defines a through slot extending through the first core board; a radiator, disposed in the through slot; and a conductive adhering layer, disposed between the metal layer of the second core board and the radiator, wherein the conductive adhering layer is configured to electrically connect the radiator and the metal layer. The present disclosure connects the radiator directly with the metal layer. The implementation of the present disclosure may help cooling the metal layer to improve the cooling performance of the PCB.

Abstract: A verification request is received. In response to receiving the verification request, a first character string is obtained. The first character string comprises one or more variable characters. At least one of the one or more variable characters in the first character string is replaced with at least one backup character to generate a second character string based on multiple pre-established corresponding relationships. A verification code is generated based on the second character string. A user corresponding to the verification request is verified based on a user input corresponding to the verification code.

Abstract: A printed circuit board (PCB), a method for processing PCB and an electronic apparatus. The method for processing PCB may comprise: forming a hole in the PCB, wherein the PCB includes a metal matrix and at least two substrate layers, at least one of the at least two substrate layers has a geoelectric layer thereon; and the metal matrix is fixed in a slot provided in the substrate, the formed hole contacts both the geoelectric layer and the metal matrix; and providing conductive substances in the hole, with the conductive substances in the hole being in contact with the inner geoelectric layer and the metal matrix, so that the geoelectric layer and the metal matrix are in conduction with each other.

Abstract: A printed circuit board (PCB) a method for processing PCB and an electronic apparatus are provided. The method for processing PCB may include: forming a hole in the PCB, wherein the PCB includes a metal matrix and at least two substrate layers, at least one of the at least two substrate layers has an geoelectric layer thereon; the metal matrix is fixed in a slot provided its the substrate, the formed hole contacts with both the geoelectric layer and the metal matrix; and providing conductive substances in the hole, with the conductive substances in the hole being in contact with the inner geoelectric layer and the metal matrix, so that the inner geoelectric layer and the metal matrix are in conduction with each other. The solutions of the embodiments of the application are beneficial to improve reliability of connection between the geoelectric layer and the metal matrix of the PCB, and improve transmission performance of a high frequency signal.