Patents by Inventor Chuanzhuang YANG

Chuanzhuang YANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12090648
    Abstract: A bionic sweat gland and a bionic skin include a shell and a porous medium. A heat dissipation pipe is arranged inside the shell, that is filled with porous media. The pores formed by the porous medium in the heat dissipation pipe gradually decrease along the evaporation flow direction and the gap of the porous medium is filled with evaporation liquid. The shell is a permeable structure, which is used to absorb evaporation liquid from the environment. The top of the shell is provided with a number of through holes connected with the heat dissipation pipe for discharging evaporation liquid to the outside. The bionic sweat gland and the bionic skin can adapt to the effect of tensile and shear forces generated on the surface of flexible materials such as electronic skin during use.
    Type: Grant
    Filed: September 15, 2021
    Date of Patent: September 17, 2024
    Assignee: JIANGSU UNIVERSITY
    Inventors: Si Chen, Lin Xu, Jian Qu, Chuanzhuang Yang, Zhiheng Yang, Kuo Li, Weimin Ru
  • Publication number: 20240009869
    Abstract: A bionic sweat gland and a bionic skin include a shell and a porous medium. A heat dissipation pipe is arranged inside the shell, that is filled with porous media. The pores formed by the porous medium in the heat dissipation pipe gradually decrease along the evaporation flow direction and the gap of the porous medium is filled with evaporation liquid. The shell is a permeable structure, which is used to absorb evaporation liquid from the environment. The top of the shell is provided with a number of through holes connected with the heat dissipation pipe for discharging evaporation liquid to the outside. The bionic sweat gland and the bionic skin can adapt to the effect of tensile and shear forces generated on the surface of flexible materials such as electronic skin during use.
    Type: Application
    Filed: September 15, 2021
    Publication date: January 11, 2024
    Applicant: JIANGSU UNIVERSITY
    Inventors: Si CHEN, Lin XU, Jian QU, Chuanzhuang YANG, Zhiheng YANG, Kuo LI, Weimin RU