Patents by Inventor Chuck Edwards
Chuck Edwards has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240132614Abstract: Disclosed herein are antibodies directed against CRTAM, nucleic acids encoding such antibodies, host cells comprising such nucleic acids encoding the antibody, methods for preparing anti-CRTAM antibodies, and methods for the treatment of diseases, e.g., human cancers, including but not limited to small cell lung cancer, non-small cell lung cancer (including squamous carcinomas and adenocarcinomas) skin cancer including melanoma, breast cancer (including TNBC), colorectal cancer, gastric cancer, ovarian cancer, cervical cancer, prostate cancer, kidney cancer, liver cancer including hepatocellular carcinoma, pancreatic cancer, head and neck cancer, nasopharyngeal cancer, oesophageal cancer, bladder cancer and other uroepithelial cancers, stomach cancer, glioma, glioblastoma, testicular, thyroid, bone, gallbladder and bile ducts, uterine, adrenal cancers, sarcomas, GIST, neuroendocrine tumours, and haematological malignancies.Type: ApplicationFiled: April 27, 2023Publication date: April 25, 2024Inventors: Arnima BISHT, Rachel L. DUSEK, Haining HUANG, Chuck HANNUM, James Edward ACKROYD, Livija DEBAN
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Publication number: 20230378928Abstract: Assemblies including a bulk acoustic wave acoustic sensor die having a first and an opposing second major surface, the die including a piezoelectric structure, a first and a second electrode electrically connected to the piezoelectric structure, and an active surface on the first major surface of the die; a printed circuit board (PCB), the PCB having a first major surface and an opposing second major surface and including a slot spanning from the first major surface to the second major surface through the PCB; a first bond electrically and mechanically connecting the die to the PCB; and a second bond electrically and mechanically connecting the die to the PCB, wherein the first and the second bonds are located on either side of the slot through the PCB and the active surface of the die is above the slot in the PCB.Type: ApplicationFiled: October 29, 2021Publication date: November 23, 2023Inventors: Chuck Edward Carpenter, Rio Rivas, Buu Quoc Diep
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Publication number: 20200089679Abstract: Examples herein involve providing a first query to an optimizer; identifying a first execution plan selected by the optimizer based on the first query; generating an annotated query based on the selected first execution plan, the annotated query comprising hints for executing the selected first execution plan; and storing the annotated query in a database, the annotated query to cause the optimizer to generate a second execution plan corresponding to the first execution plan based on the hints.Type: ApplicationFiled: August 7, 2015Publication date: March 19, 2020Inventors: Alper Okcan, Thao Nguyen PHAM, Nga TRAN, Chuck Edward BEAR
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Patent number: 8668848Abstract: A composition for the fabrication of reflective features using a direct-write tool is disclosed. The composition comprises metal nanoparticles having an average particle size less than 300 nm and which carry thereon a polymer for substantially preventing agglomeration of the nanoparticles, wherein the nanoparticles exhibit a metal-polymer weight ratio of 100:1 to 10:1. The composition further includes a vehicle for forming a dispersion with the metal nanoparticles. A number of electronic devices comprising a reflective layer formed from the composition are also disclosed. One example case provides an electronic device having a reflective electrode. The reflective electrode comprises a percolation network of the metal nanoparticles embedded in a matrix of the polymer and having an average particle size of less than 300 nm, wherein the reflective electrode is reflective in the visible light range and does not diffract incident light.Type: GrantFiled: December 4, 2012Date of Patent: March 11, 2014Assignee: Cabot CorporationInventors: Karel Vanheusden, Klaus Kunze, Hyungrak Kim, Aaron D. Stump, Allen B. Schult, Mark J. Hampden-Smith, Chuck Edwards, Anthony R. James, James Caruso, Toivo T. Kodas, Scott Thomas Haubrich, Mark H. Kowalski
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Patent number: 8383014Abstract: A metal nanoparticle composition for the fabrication of conductive features. The metal nanoparticle composition advantageously has a low viscosity permitting deposition of the composition by direct-write tools. The metal nanoparticle composition advantageously also has a low conversion temperature, permitting its deposition and conversion to an electrical feature on polymeric substrates.Type: GrantFiled: June 15, 2010Date of Patent: February 26, 2013Assignee: Cabot CorporationInventors: Karel Vanheusden, Klaus Kunze, Hyungrak Kim, Aaron D. Stump, Allen B. Schult, Mark J. Hampden-Smith, Chuck Edwards, Anthony R. James, James Caruso, Toivo T. Kodas, Scott Thomas Haubrich, Mark H. Kowalski
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Patent number: 8334464Abstract: An apparatus and method for making a printed circuit board comprising a substrate and an electrical circuit is provided. The circuit is formed by deposition of a plurality of electronic inks onto the substrate and curing of each of the electronic inks. The deposition may be performed using an ink-jet printing process. The inkjet printing process may include the step of printing a plurality of layers, wherein a first layer includes at least one electronic ink deposited directly onto the substrate, and wherein each subsequent layer includes at least one electronic ink deposited on top of at least a portion of a previous layer when the previous layer has been cured. One or more of the layers may include at least two of the electronic inks.Type: GrantFiled: January 13, 2006Date of Patent: December 18, 2012Assignee: Cabot CorporationInventors: Chuck Edwards, James John Howarth, Karel Vanheusden
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Patent number: 8167393Abstract: A system and process for compensating for non-uniform surfaces of a substrate when direct printing traces is provided. The system and process provided herein measures the surface of a substrate and can determine whether the surface is substantially flat, rises or falls, or whether a mesa or valley is encountered. Depending on the surface feature (i.e., mesa, valley, falling or rising surface), the direct printing system can change the frequency of the printing timing signal, advance or retard the print timing signal, advance or retard the print data, or make repeated passes over certain areas. In addition, the process disclosed herein can determine whether two, three or all of the aforementioned steps for compensating for non-uniform substrates should be combined to most effectively and efficiently print on the non-uniform surface of the substrate as intended.Type: GrantFiled: January 13, 2006Date of Patent: May 1, 2012Assignee: Cabot CorporationInventors: Karel Vanheusden, Chuck Edwards
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Publication number: 20110303885Abstract: A metal nanoparticle composition for the fabrication of conductive features. The metal nanoparticle composition advantageously has a low viscosity permitting deposition of the composition by direct-write tools. The metal nanoparticle composition advantageously also has a low conversion temperature, permitting its deposition and conversion to an electrical feature on polymeric substrates.Type: ApplicationFiled: June 15, 2010Publication date: December 15, 2011Applicant: Cabot CorporationInventors: Karel Vanheusden, Klaus Kunze, Hyungrak Kim, Aaron D. Stump, Allen B. Schult, Mark J. Hampden-Smith, Chuck Edwards, Anthony R. James, James Caruso, Toivo T. Kodas, Scott Thomas Haubrich, Mark H. Kowalski
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Patent number: 7824466Abstract: Processes for the production of metal nanoparticles. In one aspect, the invention is to a process comprising the steps of mixing a heated first solution comprising a base and/or a reducing agent (e.g., a non-polyol reducing agent), a polyol, and a polymer of vinyl pyrrolidone with a second solution comprising a metal precursor that is capable of being reduced to a metal by the polyol. In another aspect, the invention is to a process that includes the steps of heating a powder of a polymer of vinyl pyrrolidone; forming a first solution comprising the powder and a polyol; and mixing the first solution with a second solution comprising a metal precursor capable of being reduced to a metal by the polyol.Type: GrantFiled: May 30, 2007Date of Patent: November 2, 2010Assignee: Cabot CorporationInventors: Karel Vanheusden, Klaus Kunze, Hyungrak Kim, Aaron D. Stump, Allen B. Schult, Mark J. Hampden-Smith, Chuck Edwards, Anthony R. James, James Caruso, Toivo T. Kodas, Scott T. Haubrich, Mark H. Kowalski, Nathan E. Stott
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Publication number: 20100269635Abstract: Processes for the production of metal nanoparticles. In one aspect, the invention is to a process comprising the steps of mixing a heated first solution comprising a base and/or a reducing agent (e.g., a non-polyol reducing agent), a polyol, and a polymer of vinyl pyrrolidone with a second solution comprising a metal precursor that is capable of being reduced to a metal by the polyol. In another aspect, the invention is to a process that includes the steps of heating a powder of a polymer of vinyl pyrrolidone; forming a first solution comprising the powder and a polyol; and mixing the first solution with a second solution comprising a metal precursor capable of being reduced to a metal by the polyol.Type: ApplicationFiled: July 2, 2010Publication date: October 28, 2010Applicant: CABOT CORPORATIONInventors: Karel VANHEUSDEN, Klaus KUNZE, Hyungrak KIM, Aaron D. STUMP, Allen B. Schult, Mark J. Hampden-Smith, Chuck EDWARDS, Anthony R. JAMES, James CARUSO, Toivo T. KODAS, Scott T. HAUBRICH, Mark H. KOWALSKI, Nathan E. STOTT
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Publication number: 20100269634Abstract: A process for the production of metal nanoparticles. The process comprises a rapid mixing of a solution of at least about 0.1 mole of a metal compound that is capable of being reduced to a metal by a polyol with a heated solution of a polyol and a substance that is capable of being adsorbed on the nanoparticles.Type: ApplicationFiled: July 2, 2010Publication date: October 28, 2010Applicant: CABOT CORPORATIONInventors: Karel Vanheusden, Klaus Kunze, Hyungrak Kim, Aaron D. Stump, Allen B. Schult, Mark J. Hampden-Smith, Chuck Edwards, Anthony R. James, James Caruso, Toivo T. Kodas, Scott Thomas Haubrich, Mark H. Kowalski
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Patent number: 7749299Abstract: A process for the production of metal nanoparticles. The process comprises a rapid mixing of a solution of at least about 0.1 mole of a metal compound that is capable of being reduced to a metal by a polyol with a heated solution of a polyol and a substance that is capable of being adsorbed on the nanoparticles.Type: GrantFiled: January 13, 2006Date of Patent: July 6, 2010Assignee: Cabot CorporationInventors: Karel Vanheusden, Klaus Kunze, Hyungrak Kiim, Aaron D. Stump, Allen B. Schult, Mark J. Hampden-Smith, Chuck Edwards, Anthony R. James, James Caruso, Toivo T. Kodas, Scott Thomas Haubrich, Mark H. Kowalski
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Patent number: 7575621Abstract: A process for the production of metal nanoparticles. Nanoparticles are formed by combining a metal compound with a solution that comprises a polyol and a substance that is capable of being adsorbed on the nanoparticles. The nanoparticles are precipitated by adding a nanoparticle-precipitating liquid in a sufficient amount to precipitate at least a substantial portion of the nanoparticles and of a protic solvent in a sufficient amount to improve the separation of the nanoparticles from the liquid phase.Type: GrantFiled: January 13, 2006Date of Patent: August 18, 2009Assignee: Cabot CorporationInventors: Karel Vanheusden, Hyungrak Kiim, Aaron D. Stump, Allen B. Schult, Mark J. Hampden-Smith, Chuck Edwards, Anthony R. James, James Caruso, Toivo T. Kodas, Scott Thomas Haubrich, Mark H. Kowalski
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Patent number: 7533361Abstract: A system and process for manufacturing custom printed circuit boards on pre-provided substrates, wherein the substrate is pre-provided with standard integrated circuits. The standard integrated circuits are pre-provided on the substrate in a conventional manner, such as by standard integrated circuit technologies, in many different packing technologies. The user designs the custom printed circuit board using a design tool to perform one or more specific electronic functions, based on the pre-provided electronic devices, and/or custom designed and direct printed electronic devices. The electronic devices includes transistors, resistors, capacitors, among other types of devices. The system and process allows users to customize standard “generic” circuit boards with some known electronic functions for their own particular application. Examples of such uses include displays, the automotive industry and many others.Type: GrantFiled: January 13, 2006Date of Patent: May 12, 2009Inventor: Chuck Edwards
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Publication number: 20080034921Abstract: Processes for the production of metal nanoparticles. In one aspect, the invention is to a process comprising the steps of mixing a heated first solution comprising a base and/or a reducing agent (e.g., a non-polyol reducing agent), a polyol, and a polymer of vinyl pyrrolidone with a second solution comprising a metal precursor that is capable of being reduced to a metal by the polyol. In another aspect, the invention is to a process that includes the steps of heating a powder of a polymer of vinyl pyrrolidone; forming a first solution comprising the powder and a polyol; and mixing the first solution with a second solution comprising a metal precursor capable of being reduced to a metal by the polyol.Type: ApplicationFiled: May 30, 2007Publication date: February 14, 2008Applicant: Cabot CorporationInventors: Karel Vanheusden, Klaus Kunze, Hyungrak Kim, Aaron Stump, Allen Schult, Mark Hampden-Smith, Chuck Edwards, Anthony James, James Caruso, Toivo Kodas, Scott Haubrich, Mark Kowalski, Nathan Stott
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Publication number: 20070281091Abstract: Processes for forming polyimide coatings during the formation of printed electronic features. In various embodiments, the processes include the steps of: (a) applying a polyimide precursor ink comprising a polyimide precursor onto a substrate or to an electronic feature disposed thereon, preferably through a direct write printing process, e.g., ink-jet printing, (b) converting the polyimide precursor to a polyimide coating; and (c) optionally forming an electronic feature on the polyimide coating.Type: ApplicationFiled: May 31, 2006Publication date: December 6, 2007Applicant: Cabot CorporationInventors: Mark H. Kowalski, Chuck Edwards
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Publication number: 20070279182Abstract: The invention is to printed resistors and processes for forming same. The resistors comprise a conductive phase, preferably comprising conductive nanoparticles, and a resistive phase. In the processes of the invention, a resistor may be formed from a single ink or a plurality of inks. In the single ink embodiment, an ink is deposited which comprises a conductive phase precursor, a resistive phase precursor and a vehicle. The vehicle in removed and the conductive and resistive phase precursors are converted to a conductive phase and a resistive phase, respectively. In the multiple ink embodiment, a first ink comprising the conductive phase precursor and a first vehicle and a second ink comprising the resistive phase precursor and a second vehicle are deposited on the substrate. The vehicles are removed and the conductive and resistive phase precursors are converted to a conductive phase and a resistive phase, respectively.Type: ApplicationFiled: May 31, 2006Publication date: December 6, 2007Applicant: Cabot CorporationInventors: Toivo T. Kodas, Chuck Edwards, Klaus Kunze, Hyungrak Kim, Ned Jay Hardman
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Publication number: 20070215039Abstract: An apparatus and a method for manufacturing electrical and optical materials by ink-jet printing of electronic ink(s) onto a flexible substrate are provided. The apparatus includes a flexible substrate, a first roll and a second roll, a printing head for depositing a electronic ink onto the substrate according to a predetermined pattern, and a drying station for drying an amount of deposited electronic ink. Each roll is reversibly configured for feed or takeup of the substrate. When dry, the deposited electronic ink forms one of an electronic material, an optical material, a display, and a fuel cell electrode. The apparatus may also include a second printing head configured for depositing a second electronic ink onto the substrate after the first ink has dried. The apparatus may be configured to rewind the substrate prior to deposition of the second ink, or to reverse the feed/takeup direction of the rolls.Type: ApplicationFiled: March 7, 2007Publication date: September 20, 2007Inventors: Chuck Edwards, Karel Vanheusden, Mark Kowalski, James Caruso
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Publication number: 20070034052Abstract: A process for the production of metal nanoparticles. The process comprises a rapid mixing of a solution of at least about 0.1 mole of a metal compound that is capable of being reduced to a metal by a polyol with a heated solution of a polyol and a substance that is capable of being adsorbed on the nanoparticles.Type: ApplicationFiled: January 13, 2006Publication date: February 15, 2007Applicant: Cabot CorporationInventors: Karel Vanheusden, Klaus Kunze, Hyungrak Kim, Aaron Stump, Allen Schult, Mark Hampden-Smith, Chuck Edwards, Anthony James, James Caruso, Toivo Kodas, Scott Haubrich, Mark Kowalski
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Publication number: 20060190918Abstract: A system and process for manufacturing custom printed circuit boards on pre-provided substrates, wherein the substrate is pre-provided with standard integrated circuits. The standard integrated circuits are pre-provided on the substrate in a conventional manner, such as by standard integrated circuit technologies, in many different packing technologies. The user designs the custom printed circuit board using a design tool to perform one or more specific electronic functions, based on the pre-provided electronic devices, and/or custom designed and direct printed electronic devices. The electronic devices includes transistors, resistors, capacitors, among other types of devices. The system and process allows users to customize standard “generic” circuit boards with some known electronic functions for their own particular application. Examples of such uses include displays, the automotive industry and many others.Type: ApplicationFiled: January 13, 2006Publication date: August 24, 2006Applicant: Cabot CorporationInventor: Chuck Edwards