Abstract: A pigtail attach system that exhibits little degradation or change in the coupling during curing and minimizes the impact of different thermal expansion coefficients between the fiber and the substrate. It also isolates the fiber-chip connection from external forces transmitted through the fiber by providing a low-moment fiber stake. A cantilever is formed by pigtailing a V-groove fiber array to an optical waveguide chip using index-matched epoxy. Only the endface of the fiber-array and the sidewall of the waveguide chip are involved in the epoxy-bond. The fiber ribbon is staked away from the cantilever to a pedestal structure, which can comprise silicon and/or glass. The fiber ribbon and the layers of the pedestal are attached together using a low-modulus pedestal epoxy.