Patents by Inventor Chuek Wah TANG

Chuek Wah TANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bond head cooling apparatus
    Patent number: 10622329
    Abstract: A cooling apparatus is provided for a bond head which has a collet to hold a semiconductor die and a heater to heat the semiconductor die held by the collet. The cooling apparatus includes a dielectric liquid supply for supplying a dielectric liquid and a gas supply for supplying a gas. A spray nozzle is located next to a surface of the heater, and is connected to both the dielectric liquid supply and the gas supply. In order to cool the heater, the spray nozzle sprays a liquid-gas mixture of the dielectric liquid and the gas towards the surface of the heater.
    Type: Grant
    Filed: October 27, 2014
    Date of Patent: April 14, 2020
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Yi Kei Law, Pak Kin Leung, Chuek Wah Tang, Gary Peter Widdowson
  • Atomization mechanism for cooling a bond head
    Patent number: 10312214
    Abstract: An atomization mechanism for cooling a bond head comprises an atomization module and a conduit. In use, the atomization module receives gas and liquid from a gas supply and a liquid supply respectively to form an atomized spray and the conduit conveys the atomized spray from the atomization module to a spray inlet located at the bond head to receive the atomized spray into the bond head for cooling the bond head.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: June 4, 2019
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Yi Kei Law, Chuek Wah Tang, Pak Kin Leung, Gary Peter Widdowson, Wing Chiu Lai, Kin Fung Yu, Jiang Wen Deng
  • ATOMIZATION MECHANISM FOR COOLING A BOND HEAD
    Publication number: 20180068973
    Abstract: An atomization mechanism for cooling a bond head comprises an atomization module and a conduit. In use, the atomization module receives gas and liquid from a gas supply and a liquid supply respectively to form an atomized spray and the conduit conveys the atomized spray from the atomization module to a spray inlet located at the bond head to receive the atomized spray into the bond head for cooling the bond head.
    Type: Application
    Filed: September 8, 2016
    Publication date: March 8, 2018
    Inventors: Yi Kei LAW, Chuek Wah TANG, Pak Kin LEUNG, Gary Peter WIDDOWSON, Wing Chiu LAI, Kin Fung YU, Jiang Wen DENG
  • BOND HEAD COOLING APPARATUS
    Publication number: 20160116217
    Abstract: A cooling apparatus is provided for a bond head which has a collet adapted to hold a semiconductor die and a heater which is adapted to heat the semiconductor die held by the collet. The cooling apparatus comprises a dielectric liquid supply for supplying a dielectric liquid and a gas supply for supplying a gas. A spray nozzle is located next to a surface of the heater, and is operatively connected to both the dielectric liquid supply and the gas supply. In order to cool the heater, the spray nozzle is operative to spray a liquid-gas mixture comprising the dielectric liquid and the gas towards the surface of the heater.
    Type: Application
    Filed: October 27, 2014
    Publication date: April 28, 2016
    Inventors: Yi Kei LAW, Pak Kin LEUNG, Chuek Wah TANG, Gary Peter WIDDOWSON