Patents by Inventor Chuen-Jiunn Shyu

Chuen-Jiunn Shyu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230395698
    Abstract: Disclosed are a semiconductor structure and a manufacturing method thereof. The semiconductor structure includes a substrate, a first dielectric layer, a first gate, a second dielectric layer, and a second gate. The first dielectric layer is located on the substrate. The first gate is located on the first dielectric layer. The second dielectric layer is located on the substrate. The second gate is located on the second dielectric layer. A bottom surface of the second gate and a bottom surface of the first gate are located on different planes.
    Type: Application
    Filed: June 27, 2022
    Publication date: December 7, 2023
    Applicant: Powerchip Semiconductor Manufacturing Corporation
    Inventors: Tien-Lu Lin, Ying-Chia Lin, Chuen-Jiunn Shyu, Shou-Zen Chang