Patents by Inventor Chuen-Lin Tien

Chuen-Lin Tien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10697841
    Abstract: Conventional optical-transmission-type residual stress measuring apparatus cannot be used for completing the measurement of residual stress in an optical film having light reflective property, and conventional optical-reflection-type residual stress measuring apparatus is known failing to achieving the measurement of residual stress in an optical thin film having transparent or translucent property. In view of that, the present invention discloses a system for measuring residual stress in optical thin films, which is able to be utilized for achieving the residual stress measurement of respective optical thin film having transparent or translucent property and that of respective optical thin film having light reflective property.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: June 30, 2020
    Assignee: FENG CHIA UNIVERSITY
    Inventor: Chuen-Lin Tien
  • Publication number: 20200166419
    Abstract: Conventional optical-transmission-type residual stress measuring apparatus cannot be used for completing the measurement of residual stress in an optical film having light reflective property, and conventional optical-reflection-type residual stress measuring apparatus is known failing to achieving the measurement of residual stress in an optical thin film having transparent or translucent property. In view of that, the present invention discloses a system for measuring residual stress in optical thin films, which is able to be utilized for achieving the residual stress measurement of respective optical thin film having transparent or translucent property and that of respective optical thin film having light reflective property.
    Type: Application
    Filed: November 28, 2018
    Publication date: May 28, 2020
    Inventor: Chuen-Lin Tien
  • Patent number: 6466308
    Abstract: The present invention disclose a method for measuring a thermal expansion coefficient of a thin film, in which the thin film is first deposited on two substrates having different thermal expansion coefficients under the same conditions. For each of the two deposited substrates, a relationship between the thin film stresses and the measuring temperatures is established by using a phase shifting interferometry technique, in which the stresses in the thin films are derived by comparing the deflections of the substrates prior to and after the deposition. Based on the two relationships the thermal expansion coefficient, and elastic modulus, E f ( 1 - v f ) , can be calculated, wherein Ef and &ngr;f are the Young's modulus and Poisson's ratio of the thin film, respectively.
    Type: Grant
    Filed: April 12, 2000
    Date of Patent: October 15, 2002
    Assignee: Precision Instrument Development Center, National Science Council
    Inventors: Cheng-Chung Jaing, Cheng-Chung Lee, Chuen-Lin Tien, Ing-Jer Ho