Patents by Inventor Chuen-Sheng Lin

Chuen-Sheng Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5684676
    Abstract: A clip for securing a heat dissipator to a computer central processing unit is disclosed, including an elongated body made of an elastically deformable material, having a central section to be placed on a top surface of the heat dissipator and two end sections extending from the central section and inclined relative to the top surface of the heat dissipator to define therebetween gaps for accommodating elastic deformation thereof. A vertical extension is provided on the first end section, having a side cutout to define a hook having a side opening for laterally moving into engagement with a first sideways projection on a socket to which the central processing unit is mounted.
    Type: Grant
    Filed: December 6, 1995
    Date of Patent: November 4, 1997
    Inventor: Chuen-Sheng Lin
  • Patent number: 5660562
    Abstract: The present invention is to provide a CPU heat dissipator hook-up structure having a metal pressing board and a metal hook-up board. The two sides of the metal pressing board stretch upward and formed an elastic tilt angle. There, on one side of the metal pressing board is bent downward and form an open, while the other side of the metal pressing board is formed two separate recesses. The top end of the metal hook-up board formed a flat surface as the force applied to when hooking up downward with the ZIF socket. Also on the two sides of the metal hook-up board formed a recess separately to be inserted by the protrusion formed because of the recess of the metal pressing board while being assembled. On the bottom of the metal hook-up board there is an open formed to be hooked by the hook formed on the side of the ZIF socket. Thus, using the upward elasticity of the metal pressing board, the dissipator board and he CPU can be fixed together tightly and achieve the purpose of ventilation.
    Type: Grant
    Filed: June 28, 1995
    Date of Patent: August 26, 1997
    Inventor: Chuen-Sheng Lin
  • Patent number: 5651688
    Abstract: The present invention is to provide a heat dissipator mounting apparatus having a rigid plate, a pressing plate and a snapping plate wherein; both the rigid plate and the pressing plate are bent upward, hence providing a resilient force. One side of the rigid plate is provided with an opening and the other side a downward bending inclined surface; one side of the pressing plate is provided with a downward bending inclined surface and the other side with a positioning recess; a plane surface formed on top of the snapping plate is provided as the applied place where external force applies, whose both sides are provided with a recess for connecting with the positioning recess of the snapping plate. Consequently, using the upward resilience of the pressing plate, the heat dissipator and the CPU are thus firmly connected together.
    Type: Grant
    Filed: December 20, 1995
    Date of Patent: July 29, 1997
    Inventor: Chuen-Sheng Lin
  • Patent number: 5542468
    Abstract: A dissipator hook-up apparatus has a metal pressing board and a metal hook-up board. The two sides of the metal pressing board stretch upward and formed an elastic tilt angle. On one upward-tilting side of the metal pressing board is bent downward and form an opening, while the other side of the metal pressing board has separate holes. The top end of the metal hook-up board forms a flat surface where force is applied when hooking up with the ZIF socket. On the two sides of the metal hook-up board are protrusions separately to be inserted into the holes of the metal pressing board. On the bottom of the metal hook-up board there is an opening to be hooked by the hook on the side of the ZIF socket. Thus, using the upward elasticity of the metal pressing board, the dissipator board and the CPU can be fixed together tightly and achieve ventilation.
    Type: Grant
    Filed: June 28, 1995
    Date of Patent: August 6, 1996
    Inventor: Chuen-Sheng Lin
  • Patent number: 5421402
    Abstract: A heat sink apparatus includes a heat dissipation base made of material of high heat conductivity having a plate portion in tight contact engagement with a surface of an electronic device for conducting away heat generated by the electronic device. The plate portion has a number of spaced fins extending therefrom to surround a non-finned zone on the top surface of the plate portion. A retainer in the form of a hollow frame having an inner shoulder fit over a circumferential edge of the plate portion serves to fix the heat dissipation base to the electronic device by having resilient hooks of the retainer engage with a bottom edge of the electronic device. A fan assembly has a support plate with a central opening to be supported on the fins with the opening opposing the non-finned zone.
    Type: Grant
    Filed: November 22, 1994
    Date of Patent: June 6, 1995
    Inventor: Chuen-Sheng Lin