Abstract: An exemplary electronic device includes a base, a cover, side plates, a heat conduct plate, a wick structure, a working medium and at least one electronic element. The cover and the base cooperatively define a cavity. The at least one side plate extends from the cover and receives in the cavity. The heat conduct plate and the at least side plate and the cover cooperatively defines a sealed chamber. The wick structure is attached to an inner surface of the sealed chamber. The working medium is received in the wick structure. The at least one electronic element is received in the cavity and thermally connected to the heat conduct plate.

Abstract: An exemplary loop heat pipe includes a plate-type evaporator, a pipe, a condenser thermally connected with the pipe and a working medium contained in the closed loop. The plate-type evaporator defines an exit for vapor in a lateral portion thereof and an entrance for liquid in a top portion thereof. The pipe connects the exit and the entrance to form a closed loop. A first wick structure has a lower end thereof attached to a bottom portion of the evaporator and has an upper end thereof attached to the top portion of the evaporator. The entrance for liquid corresponds to the upper end of the wick structure.

Abstract: An exemplary electronic device includes a base, a cover, side plates, a heat conduct plate, a wick structure, a working medium and at least one electronic element. The cover and the base cooperatively define a cavity. The at least one side plate extends from the cover and receives in the cavity. The heat conduct plate and the at least side plate and the cover cooperatively defines a sealed chamber. The wick structure is attached to an inner surface of the sealed chamber. The working medium is received in the wick structure. The at least one electronic element is received in the cavity and thermally connected to the heat conduct plate.

Abstract: An exemplary portable electronic device includes a printed circuit board, a heat generating electronic component mounted on the printed circuit board, a shell housing the printed circuit board, the heat generating electronic component and a heat pipe therein. The heat pipe includes an evaporating side and a condensing side. The evaporating side thermally contacts the heat generating electronic component, and the condensing side thermally contacts the shell.

Abstract: A heat sink includes a fin assembly including a plurality of fins and a plate type heat pipe attached to the fin assembly. The plate type heat pipe includes a sealed shell in which a working fluid is filled, a wick layer formed on an inner face of the shell and a supporting member disposed in the shell. The supporting member includes a plurality of supporting portions and a plurality of bodies connecting the supporting portions. Each supporting portion includes a plurality of convex portions contacting a top of the wick layer and a plurality of concave portions contacting a bottom of the wick layer. The convex portions and the concave portions of each supporting portion are alternately arranged. Each convex portion and an adjacent concave portion cooperatively enclose a first through hole for the working fluid flowing therethrough.

Abstract: A method for manufacturing a plate-type heat pipe includes providing a mold including a first cavity and a plurality of second cavities and depositing cores into the mold. Each core has a first portion in the first cavity and a second portion in a corresponding second cavity. First and second metal powder are filled into the mold. The cores are then removed from the mold to form a green piece by the first and second metal powder, which has first and second chambers therein. The green piece is sintered, whereby the first metal powder forms an outer wall of the heat pipe and the second metal powder forms a wick structure. The heat pipe has a heat absorbing portion having the first chambers and fins having the second chambers communicating with the first chambers.

Abstract: A loop heat pipe includes an evaporator, a condenser, and a vapor line and a liquid line each connecting the evaporator with the condenser to form a closed loop. A predetermined quantity of bi-phase working medium is contained in the closed loop. A separator connects the liquid line. A cross section of the separator is larger than a cross section of the liquid line. The separator separates the liquid state working medium from the vapor state working medium when the working medium flows therethrough.

Abstract: A method for manufacturing a hydrodynamic bearing (30) comprises steps of: step (201): providing a substrate (10) with a plurality of protrusions (14) formed on a periphery thereof; step (202): placing the substrate in a middle of a hollow mold, then injecting a feedstock of powder and molten binder into the mold to surround the substrate under pressure, thus forming a desired bearing preform (20); step (203): separating the substrate from the bearing preform by means of catalytic debinding; step (204): separating the binder from the bearing preform; step (205): sintering the bearing preform; step (206): precision machining the bearing preform to form the desired hydrodynamic bearing.

Abstract: An exemplary plate-type heat pipe includes a hermetic container, working fluid contained in the container, a first wick portion and two second wick portions formed on inner surfaces of the container. The container includes an evaporating plate and a condensing plate facing each other. The evaporating plate includes a heat absorbing portion, two transition portions extending outwardly and upwardly from opposite ends of the heat absorbing portion, respectively, and two extending portions extending outwardly from outer ends of the transition portions, respectively. The first wick portion is formed on an inner surface of the heat absorbing portion. The second wick portions are formed on inner surfaces of the transition portions, respectively. The third wick portions are formed on inner surfaces of the extending portions, respectively. The third wick portions define capillary pores and a plurality of holes therein.

Abstract: An exemplary plate-type heat pipe includes a condensing plate, an evaporating plate and a first wick portion. The evaporating plate cooperates with the condensing plate to define a hermetic container. Working fluid is contained in the container. The first wick portion is formed on an inner surface of the evaporating plate. The first wick portion defines through holes therein.

Abstract: A plate-type heat pipe includes a condensing plate, an evaporating plate and a first wick member. The evaporating plate cooperates with the condensing plate to define a hermetic container. Working fluid is contained in the container. The first wick member is formed on an inner surface of the condensing plate. The first wick member defines a plurality of through holes therein.

Abstract: An exemplary loop heat pipe includes a plate-type evaporator, a pipe, a condenser thermally connected with the pipe and a working medium contained in the closed loop. The plate-type evaporator defines an exit for vapor in a lateral portion thereof and an entrance for liquid in a top portion thereof. The pipe connects the exit and the entrance to form a closed loop. A first wick structure has a lower end thereof attached to a bottom portion of the evaporator and has an upper end thereof attached to the top portion of the evaporator. The entrance for liquid corresponds to the upper end of the wick structure.

Abstract: A method for manufacturing a hydrodynamic bearing with hydrodynamic pressure generating grooves comprises steps of: step 201: providing a substrate with a first annular protrusion and a plurality of projections formed on a periphery thereof, the projections being in a side of the first annular protrusion; step 202: placing the substrate in a middle of a hollow mold, then injecting a feedstock of powder and molten binder under pressure into the mold to surround the substrate, thus forming a desired bearing preform; step 203: separating the substrate from the bearing preform by means of catalytic debinding; step 204: separating the molten binder from the bearing preform; step 205: sintering the bearing preform to thereby form the hydrodynamic bearing.

Abstract: A plate-type heat pipe includes a top cover, a bottom cover, a first wick structure and a second wick structure. The bottom cover hermetically contacts with the top cover to form a container. A plurality of working fluid is contained in the container. The bottom cover has a heat absorbing plate. The first wick structure is adhered to inner surfaces of the top and bottom covers. The second wick structure is sandwiched between the top and bottom covers. Top and bottom ends of the second wick structure abut against the inner surface of the top cover and a central portion of the heat absorbing plate of the bottom cover. An area of the bottom end is smaller than that of the heat absorbing plate.

Abstract: A heat pipe includes a shell containing a working fluid therein, a capillary wick arranged within the shell and a vapor channel. The shell includes an evaporating section, a condensing section and an adiabatic section located between the evaporating section and the condensing section. The capillary wick includes a first segment occupying the whole of the evaporating section, a second segment and a third segment received in the condensing section and connected to the first segment by the second segment. The vapor channel is defined between the second segment of the capillary wick and the shell.

Abstract: A plate-type heat pipe includes a container, a wick structure and a plurality of supporting plates. The wick structure is adhered to an inner surface of the container. The supporting plates are received in the container and abut against opposite sidewalls of the container. Each of the supporting plates includes a connecting plate and a plurality of protruded portions extending from the connecting portion. A number of through holes are defined in the protruded portion. The supporting plates are arranged in tiers in a manner such that the protrude portions of a lower supporting plate abut against the connecting portion of an upper supporting plate, and the through holes of the supporting plates communicate with each other.

Abstract: A heat sink includes a fin assembly including a plurality of fins and a plate type heat pipe attached to the fin assembly. The plate type heat pipe includes a sealed shell in which a working fluid is filled, a wick layer formed on an inner face of the shell and a supporting member disposed in the shell. The supporting member includes a plurality of supporting portions and a plurality of bodies connecting the supporting portions. Each supporting portion includes a plurality of convex portions contacting a top of the wick layer and a plurality of concave portions contacting a bottom of the wick layer. The convex portions and the concave portions of each supporting portion are alternately arranged. Each convex portion and an adjacent concave portion cooperatively enclose a first through hole for the working fluid flowing therethrough.

Abstract: A method for manufacturing a plate-type heat pipe includes providing a mold including a first cavity and a plurality of second cavities and depositing cores into the mold. Each core has a first portion in the first cavity and a second portion in a corresponding second cavity. First and second metal powder are filled into the mold. The cores are then removed from the mold to form a green piece by the first and second metal powder, which has first and second chambers therein. The green piece is sintered, whereby the first metal powder forms an outer wall of the heat pipe and the second metal powder forms a wick structure. The heat pipe has a heat absorbing portion having the first chambers and fins having the second chambers communicating with the first chambers.

Abstract: A heat pipe includes a cylinder-shaped casing (100) containing a working fluid therein and a capillary wick (200) arranged on an inner wall of the casing. The capillary wick encloses a vapor passage (300) in a center of the casing. The capillary wick includes a plurality of shaped foils stacked on the inner wall of the casing along a radial direction thereof. The foils are sintered to the inner wall of the casing and define a multi-channel structure for the working fluid to flow from a condensing section to an evaporating section of the heat pipe.

Abstract: A heat pipe includes a metal casing (10) filled with a working fluid therein, a capillary wick (20) provided inside of the metal casing and a tube (30) contacting with a surface of the capillary wick. The metal casing includes an evaporating section (40), a condensing section (60) and an adiabatic section (50) between the evaporating section and the condensing section. A vapor passage (70) is formed inside of the casing and a liquid channel (80) is defined by the capillary wick. The working fluid in vapor state flows from the evaporating section towards the condensing section along the vapor passage and the working fluid in liquid state returns to the evaporating section from the condensing section along the liquid channel. The tube separates the vapor from the liquid at a place where the tube is located.