Abstract: Methods and apparatuses of boundary refinement for instance segmentation. The methods for instance segmentation include receiving an image and an instance mask identifying an instance in the image; extracting a set of image patches from the image based on a boundary of the instance mask; generating a refined mask patch for each of the set of image patches based on at least a part of the instance mask corresponding to the each of the set of image patches; and refining the boundary of the instance mask based on the refined mask patch for each of the set of image patches.

Abstract: Provided are a patterned adhesive film and a photovoltaic assembly. The patterned adhesive film includes a bottom-layer adhesive film and a patterned coating layer arranged on the surface of the bottom-layer adhesive film, the minimum torque value ML of the bottom-layer adhesive film at 100° C. is 0.2-2.5 dN·m, and the elongation at break of the patterned coating layer is ?20%. Therefore, while laminating is performed on the photovoltaic assembly including the patterned adhesive film, the bottom-layer adhesive film has relatively low fluidity, and the elongation at break of the patterned coating layer may be matched with the bottom-layer adhesive film having the relatively low fluidity, such that the cracking problem of the patterned adhesive film is avoided in the laminating process of the photovoltaic assembly.

Abstract: The present disclosure provides an anti-PID encapsulation adhesive film, a photovoltaic module, and a photovoltaic module manufacturing method. The anti-PID encapsulation adhesive film includes a base adhesive film layer, an insulating layer, and a conductive layer. The insulating layer is located on one side surface of the base adhesive film layer. The insulating layer has a grid structure. The grid structure includes grid lines and a plurality of hollow portions defined by the grid lines. The grid lines have a structure corresponding to gaps between cell pieces. The conductive layer includes a plurality of conductive portions. The conductive portions are arranged in the hollow portions in one-to-one correspondence. The volume resistivity of the conductive portions is less than 100 ?·cm.