Abstract: Provided are a Polyhedral Oligomeric Silsesquioxane (POSS) structure-containing ink composition and an application thereof. The ink composition includes, by weight percentage, 20-40% of a POSS structure-containing monomer, 50-70% of a photocuring monomer, and 1-10% of a photoinitiator; and the POSS structure-containing monomer includes a repeating unit as shown in a general formula (R—SiO1.5)n, where at least one R group is selected from a structure having acryloyloxy or methacryloyloxy. By introducing the POSS structure into the ink composition for Organic Light-Emitting Diode (OLED) packaging, the ink composition has a better packaging effect, and an organic packaging layer prepared by the ink has a good and extremely-low Water Vapor Transmission Rate (WVTR) and Oxygen Transmission Rate (OTR), such that the service life of an OLED device can be effectively prolonged. In addition, the ink composition can effectively reduce the preparation cost and process difficulty of an OLED packaging thin film.

Abstract: The present disclosure provides an anti-PID encapsulation adhesive film, a photovoltaic module, and a photovoltaic module manufacturing method. The anti-PID encapsulation adhesive film includes a base adhesive film layer, an insulating layer, and a conductive layer. The insulating layer is located on one side surface of the base adhesive film layer. The insulating layer has a grid structure. The grid structure includes grid lines and a plurality of hollow portions defined by the grid lines. The grid lines have a structure corresponding to gaps between cell pieces. The conductive layer includes a plurality of conductive portions. The conductive portions are arranged in the hollow portions in one-to-one correspondence. The volume resistivity of the conductive portions is less than 100 ?·cm.

Abstract: Provided are a patterned adhesive film and a photovoltaic assembly. The patterned adhesive film includes a bottom-layer adhesive film and a patterned coating layer arranged on the surface of the bottom-layer adhesive film, the minimum torque value ML of the bottom-layer adhesive film at 100° C. is 0.2-2.5 dN·m, and the elongation at break of the patterned coating layer is ?20%. Therefore, while laminating is performed on the photovoltaic assembly including the patterned adhesive film, the bottom-layer adhesive film has relatively low fluidity, and the elongation at break of the patterned coating layer may be matched with the bottom-layer adhesive film having the relatively low fluidity, such that the cracking problem of the patterned adhesive film is avoided in the laminating process of the photovoltaic assembly.

Abstract: The present disclosure provides an anti-PID encapsulation adhesive film, a photovoltaic module, and a photovoltaic module manufacturing method. The anti-PID encapsulation adhesive film includes a base adhesive film layer, an insulating layer, and a conductive layer. The insulating layer is located on one side surface of the base adhesive film layer. The insulating layer has a grid structure. The grid structure includes grid lines and a plurality of hollow portions defined by the grid lines. The grid lines have a structure corresponding to gaps between cell pieces. The conductive layer includes a plurality of conductive portions. The conductive portions are arranged in the hollow portions in one-to-one correspondence. The volume resistivity of the conductive portions is less than 100 ?·cm.