Abstract: A method, computer-readable medium, and semiconductor device for securing integrated engineering analysis are provided. A die ID is generated from a lot ID, wafer ID, die coordinates, or other product information. The die ID is encrypted with a key and written to the die. The encryption key and encrypted die ID may be stored in a secure storage. A die is fabricated with an encryption module and an unencrypted die ID. The encryption module is provided with an unencrypted die ID, encrypts the unencrypted die ID, and writes the encrypted die ID to a die fuse.

Abstract: A method, computer-readable medium, and semiconductor device for securing integrated engineering analysis are provided. A die ID is generated from a lot ID, wafer ID, die coordinates, or other product information. The die ID is encrypted with a key and written to the die. The encryption key and encrypted die ID may be stored in a secure storage. A die is fabricated with an encryption module and an unencrypted die ID. The encryption module is provided with an unencrypted die ID, encrypts the unencrypted die ID, and writes the encrypted die ID to a die fuse.

Abstract: A method of communicating semiconductor manufacturing information. The method includes providing, by a first service provider, a lot of semiconductor components to a second service provider for processing. The method also includes receiving from the second service provider, by the first service provider, first information associated with the processing. The method further includes outputting to a customer, by the first service provider, second information determined in response to the first information.

Abstract: A method of communicating semiconductor manufacturing information. The method includes providing, by a first service provider, a lot of semiconductor components to a second service provider for processing. The method also includes receiving from the second service provider, by the first service provider, first information associated with the processing. The method further includes outputting to a customer, by the first service provider, second information determined in response to the first information.

Abstract: A method of communicating semiconductor manufacturing information. The method includes providing, by a first service provider, a lot of semiconductor components to a second service provider for processing. The method also includes receiving from the second service provider, by the first service provider, first information associated with the processing. The method further includes outputting to a customer, by the first service provider, second information determined in response to the first information.

Abstract: A quality assurance system and method for use between a service provider having a sequence of process stages and a quality assurance stage, and a control center. The service provider performs a plurality of processes on goods at the process stages, transfers engineering data corresponding to the processes to the control center via Internet, and holds the goods at the quality assurance. The control center compares the engineering data with a standard specification, and transfers a confirmation message to the service provider if the engineering data conforms to the standard specification. The service provider may ship the goods to customers after the confirmation message is received.

Abstract: A quality assurance system and method for use between a service provider having a sequence of process stages and a quality assurance stage, and a control center. The service provider performs a plurality of processes on goods at the process stages, transfers engineering data corresponding to the processes to the control center via Internet, and holds the goods at the quality assurance. The control center compares the engineering data with a standard specification, and transfers a confirmation message to the service provider if the engineering data conforms to the standard specification. The service provider may ship the goods to customers after the confirmation message is received.