Abstract: Proposed is a filter fixing module mounted to a handpiece cooling device having a connecting unit such that a refrigerant supply unit is coupled thereto, the filter fixing module including a body having a support surface formed in a plate shape, and a receiving surface formed on an edge of the support surface and protruding in a first direction relative to the support surface so as to prevent removal of a filter received in the support surface, and a grip unit connected to the body, wherein the grip unit comprises a first grip member and a second grip member extending in directions opposite to the protruding direction of the receiving surface relative to the body.

Abstract: Disclosed herein is a system for providing a live commerce integrated solution comprising a broadcast terminal configured to film a live broadcast for product sales, a viewer terminal configured to stream the live broadcast, and a manager server configured to provide a live broadcast platform to be accessed by the broadcast terminal and the viewer terminal.

Abstract: An epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the epoxy resin composition, the epoxy resin composition including an epoxy resin; a curing agent; an inorganic filler; and a curing catalyst, the epoxy resin including an epoxy resin represented by Formula 1:

Abstract: One embodiment of a camera module includes: a lens barrel provided with at least one lens; and a lens holder having the lens barrel coupled thereto, wherein the lens barrel may have a first adhesive part formed thereon having the bottom surface thereof facing the top surface of the lens holder and adhered to the lens holder, the lens holder may have a second adhesive part formed thereon having the top surface thereof facing the bottom surface of the lens barrel and adhered to the lens barrel, and a first recessed groove having at least a portion of an adhesive deposited therein may be formed in the second adhesive part.