Abstract: A folded module includes a housing having an internal space and including a protruding wall protruding in a direction perpendicular to an optical axis direction; a rotation holder including a reflective member, and supported by an internal wall of the housing with a rotation plate interposed therebetween to be disposed in the internal space; and a stopper coupled to the protruding wall of the housing, and limiting movement of the rotation holder in an optical axis direction, and the stopper includes a separation prevention structure.

Abstract: A semiconductor package includes a frame having a through-hole, and a first semiconductor chip disposed in the through-hole of the frame and having an active surface on which a connection pad is disposed, an inactive surface opposing the active surface, and a side surface connecting the active and inactive surfaces. A first encapsulant covers at least a portion of each of the inactive surface and the side surface of the first semiconductor chip. A connection structure has a first surface having disposed thereon the active surface of the first semiconductor chip, and includes a redistribution layer electrically connected to the connection pad of the first semiconductor chip. A first passive component is disposed on a second surface of the connection structure opposing the first surface, the first passive component being electrically connected to the redistribution layer and having a thickness greater than a thickness of the first semiconductor chip.