Patents by Inventor Chui-Ling YIP

Chui-Ling YIP has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130014821
    Abstract: Disclosed herein is a photovoltaic module, which includes a photovoltaic member, a moisture-resistant layer, a mounting frame covering and a buffer layer. The buffer layer disposed between the moisture-resistant layer and the mounting frame, where the buffer layer is made of a material selected from the group consisting of polypropylene-based polymer, polyethylene-based polymer, polyurethane-based polymer, ethylene-vinyl acetate-based resin and a combination thereof.
    Type: Application
    Filed: July 14, 2011
    Publication date: January 17, 2013
    Applicant: Du Pont Apollo Limited
    Inventors: Stephen Yau-Sang CHENG, Chui-Ling Yip
  • Publication number: 20120171800
    Abstract: A method of sealing an electronic device is disclosed, comprising providing an assembly comprising first and second substrates in an opposed relationship, and an electronic device positioned between the first and second substrates; positioning a glass rod against or on the edge of the first and/or second substrate; and heating and softening the glass rod to form a hermetic seal between the first and second substrates and form a hermetically sealed electronic device.
    Type: Application
    Filed: December 30, 2010
    Publication date: July 5, 2012
    Applicant: DU PONT APOLLO Ltd.
    Inventors: Stephen Yau Sang Cheng, Chui-Ling Yip, Chung-Pui Chan
  • Publication number: 20120000508
    Abstract: Disclosed herein are a thermal device and a photovoltaic module having the same. The photovoltaic module includes a photovoltaic device, a thermal device, and an adhesive layer. The photovoltaic device includes a front substrate, a back substrate and a photovoltaic cell disposed between the two substrates. The thermal device is disposed adjacent to the back substrate for dissipating heat away from the photovoltaic device, and includes a chassis, several pipes and a thermal carrier. The chassis having several depressed channels is disposed adjacent to the back substrate. The pipes are disposed in the depressed channels and a coolant runs through the pipes to take away heat. The thermal carrier is used to fill the depressed channels and fully covers the pipes. The adhesive layer is disposed on the chassis for adhering the chassis and the back substrate.
    Type: Application
    Filed: June 28, 2011
    Publication date: January 5, 2012
    Applicant: Du Pont Apollo Limited
    Inventor: Chui-Ling YIP
  • Publication number: 20110300660
    Abstract: Disclosed herein is a method of manufacturing a photovoltaic device. The method includes the steps of providing a front substrate and a back substrate, forming a photovoltaic cell on the front substrate, encapsulating the photovoltaic cell by an encapsulant, attaching a solid state sealant tape on one of the two substrates, and adhering the two substrates through the solid state sealant tape and the encapsulant. The solid state sealant tape is in solid state at room temperature. The photovoltaic cell and the encapsulant are situated within an enclosed space formed by the two substrates and the solid state sealant tape.
    Type: Application
    Filed: May 25, 2011
    Publication date: December 8, 2011
    Applicant: Du Pont Apollo Limited
    Inventor: Chui-Ling YIP