Patents by Inventor Chuiwah Alice Cheung

Chuiwah Alice Cheung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210009869
    Abstract: The present invention provides pre-applied contact adhesives that maintains strong cohesiveness over extended time and varied temperature conditions, while balancing low adhesiveness to other substrates. The pre-applied adhesives are applied onto paperboard, corrugated board, Kraft paper, paper, plastic film, glass, and are suitable as label, package, envelope, carton, case, box, label, bag, multilayer film, foil bag, bottle or band.
    Type: Application
    Filed: September 25, 2020
    Publication date: January 14, 2021
    Inventor: Chuiwah Alice CHEUNG
  • Publication number: 20190382620
    Abstract: A high performance hot melt adhesive composition with higher heat stress and higher adhesion values at lower temperatures than a conventional hot melt adhesive is provided. Smaller quantities of the high performance hot melt may be used to provide similar performances as conventional hot melt adhesives.
    Type: Application
    Filed: August 30, 2019
    Publication date: December 19, 2019
    Inventors: Chuiwah Alice Cheung, Michael Harwell, Andrea Maria Paredes Torres
  • Patent number: 10494551
    Abstract: The invention provides a hot melt adhesive comprising a polymer mixture of an ethylene vinyl acetate polymer with low vinyl acetate content and a functionalized metallocene catalyzed polyethylene copolymer. The hot melt adhesive has wide service temperature ranges for bonding cellulosic substrates together. The adhesive is well suited for case, tray, carton and bag sealing applications.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: December 3, 2019
    Assignee: HENKEL IP & HOLDING GMBH
    Inventors: Chuiwah Alice Cheung, Stephane Belmudes
  • Publication number: 20190023952
    Abstract: The invention provides hot melt adhesive with wide service temperature ranges, methods of using the adhesive to bond substrates together, to close/seal cases and cartons and the like, and to articles of manufacture comprising the adhesive. The hot melt adhesive comprises a metallocene catalyzed polyethylene copolymer, less than 10 wt % of a functionalized metallocene catalyzed polyethylene copolymer, greater than 22 wt % of a wax, a tackifier and optionally, additives.
    Type: Application
    Filed: September 27, 2018
    Publication date: January 24, 2019
    Inventors: Chuiwah Alice Cheung, Patrick James Hayes, Stephane Belmudes
  • Publication number: 20140272219
    Abstract: The invention provides a hot melt adhesive comprising a polymer mixture of an ethylene vinyl acetate polymer with low vinyl acetate content and a functionalized metallocene catalyzed polyethylene copolymer. The hot melt adhesive has wide service temperature ranges for bonding cellulosic substrates together. The adhesive is well suited for case, tray, carton and bag sealing applications.
    Type: Application
    Filed: March 12, 2013
    Publication date: September 18, 2014
    Applicant: HENKEL CORPORATION
    Inventors: Chuiwah Alice Cheung, Stephane Belmudes
  • Publication number: 20140079897
    Abstract: The invention provides hot melt adhesive with wide service temperature ranges, methods of using the adhesive to bond substrates together, to close/seal cases and cartons and the like, and to articles of manufacture comprising the adhesive. The hot melt adhesive comprises a metallocene catalyzed polyethylene copolymer, less than 10 wt % of a functionalized metallocene catalyzed polyethylene copolymer, greater than 22 wt % of a wax, a tackifier and optionally, additives.
    Type: Application
    Filed: September 14, 2012
    Publication date: March 20, 2014
    Applicant: Henkel Corporation
    Inventors: Chuiwah Alice Cheung, Patrick James Hayes, Stephane Belmudes