Abstract: A backlight unit is provided which includes: a bottom chassis; a light source on the bottom chassis; an optical sheet over the light source; and a support between the bottom chassis and the optical sheet, and configured to support the optical sheet. The support includes: a fastening portion fastened to the bottom chassis, a support portion contacting the optical sheet, and a body portion between the fastening portion and the support portion. The body portion includes: a first portion extending in a first direction; a second portion extending in the first direction and is between the first portion and the fastening portion; and a third portion which connects the first portion and the second portion. The first portion and the second portion are spaced apart from each other.

Abstract: Embodiments relate to a light-emitting diode package and a manufacturing method thereof and a light emitting device. The light-emitting diode package includes a lead frame comprising a substrate and leads formed on the substrate, a light-emitting diode chip mounted on the lead frame and electrically connected to the lead frame, an electrostatic discharge protection member mounted on the lead frame and electrically connected to the lead frame, a molding member comprising a wall surrounding components of the light-emitting diode package, the wall attached to the outer periphery of the lead frame, and the wall defining a cavity together with the lead frame, and a bead member covering a surface of the electrostatic discharge protection member, wherein the bead member comprising beads inducing diffuse reflection of light emitted from the light-emitting diode chip and incident on the electrostatic discharge protection member.

Abstract: A complex sheet, a method for producing the complex sheet, and a display panel including the complex sheet is disclosed. The complex sheet reduces moisture penetration by forming a side cover that covers an opening included in an edge of a light refracting layer that is included in the complex sheet.