Patents by Inventor Chul Gyun Baik

Chul Gyun Baik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11887883
    Abstract: A heterogeneous composite material and a method for manufacturing the heterogeneous composite material are provided. The heterogeneous composite material includes a first compression structure formed by compressing a first material, and a second compression structure formed by compressing a second material different from the first material, and disposed in close contact with the first compression structure, wherein at least a portion of the first compression structure and at least a portion of the second compression structure are disposed on both sides of a boundary surface existing in a circular shape with a predetermined radius with respect to a central axis in a state in contact with each other at the boundary surface.
    Type: Grant
    Filed: June 8, 2021
    Date of Patent: January 30, 2024
    Assignee: Semes Co., Ltd.
    Inventors: Do Yeon Kim, Pil Kyun Heo, Ho Jong Hwang, Hyun Yoon, Jong Min Lee, Chul Gyun Baik
  • Publication number: 20210384064
    Abstract: A heterogeneous composite material and a method for manufacturing the heterogeneous composite material are provided. The heterogeneous composite material includes a first compression structure formed by compressing a first material, and a second compression structure formed by compressing a second material different from the first material, and disposed in close contact with the first compression structure, wherein at least a portion of the first compression structure and at least a portion of the second compression structure are disposed on both sides of a boundary surface existing in a circular shape with a predetermined radius with respect to a central axis in a state in contact with each other at the boundary surface.
    Type: Application
    Filed: June 8, 2021
    Publication date: December 9, 2021
    Inventors: Do Yeon Kim, Pil Kyun Heo, Ho Jong Hwang, Hyun Yoon, Jong Min Lee, Chul Gyun Baik