Abstract: A partially sulfonated polybenzimidazole based polymer for fuel cell membrane is prepared by copolymerizing monomers of 3,3?-diaminobenzidine, isophthalic acid and 5-sulfoisophthalic acid to obtain a partially sulfonated polybenzimidazole, and doping the partially sulfonated polybenzimidazole with inorganic acid.

Abstract: A direct internal reforming system of ethanol for a molten carbonate fuel cell (MCFC) is provided. An MCFC anode for a direct internal reforming of ethanol, a manufacturing process thereof, and a direct internal reforming method in MCFC where an ethanol solution is injected into the anode are provided. by the simple process of coating the surface of the anode with small quantity of catalyst, the drawback in that the performance of MCFC is degraded when the ethanol is directly used as a fuel is overcome. Further, an additional apparatus such as an external reforming apparatus and additional cost for pelletizing the catalyst powders are not required, which is economical. Furthermore, the performance improvement enables long-term operation, which contributes to commercialization of MCFC.

Abstract: A separator for cooling an MCFC has a cooling gas flow path provided in the separator, a cooling anode gas or a cooling cathode gas flowing through the cooling gas flow path, the cooling anode gas or the cooling cathode gas having a temperature lower than that of a general anode gas or a general cathode gas which is supplied to an anode or a cathode of the MCFC.

Abstract: A handler for testing semiconductor devices is disclosed which is capable of simplifying the process carried out in an exchanging station, namely, the process of loading/unloading semiconductor devices in/from test trays, and greatly increasing the number of simultaneously testable semiconductor devices.

Abstract: A test tray for a handler for testing semiconductor devices is disclosed which is capable of reducing the costs and time taken for replacement of carrier modules, and achieving an enhancement in workability.

Abstract: The present invention relates to a socket assembly for testing semiconductor device comprising a socket board electrically connected to an outside testing device wherein a plurality of connection pins connected to leads of a semiconductor is provided; a socket guide mounted to cover the socket board, with an open part formed so that the semiconductor may in/out, thereby connecting the semiconductor to the connection pins of the socket board; and a spacer interposed between the socket board and the socket guide for maintaining a predetermined distance between the semiconductor and the socket board by touching an surface of the semiconductor having moved into an inside of the socket guide before a surface of each carrier touches the socket guide. According to the present invention, the balls or the leads of each semiconductor may be pressed to the connection pins of the socket in a predetermined depth without replacing the carriers though the semiconductors have the different thicknesses.

Abstract: The present invention relates to a transfer device of a handler for testing semiconductor device in which a pitch between each head of picker heads may be adjusted to the discretionary one as wanted without replacing a cam plate. The transfer device of a handler for testing semiconductor device comprises a base part, a plurality of picker heads mounted movable horizontally on the base part for securing/detaching the semiconductors, a cam plate movably mounted on the base part, a plurality of cam grooves formed inclined therein, connection parts, wherein each first side thereof is secured to each picker head and each second side thereof is relative-movably connected to each cam groove, thereby connecting each picker head with each cam groove, and a driving unit for reciprocating the cam plate so as that the picker heads may be varied to a discretionary position of the base part.

Abstract: Carrier module including a carrier module body for seating a semiconductor device on an underside thereof, having a pass through hole from an upper part to the underside the semiconductor device is seated thereon, a housing over the carrier module body, a supplementary housing fitted in a lower part of the housing to be movable in up/down directions, for elastic contact with the carrier module body by a first elastic member fitted inside of the housing, a vacuum tube in the supplementary housing so as to be in communication with the pass through hole in the carrier module body, at least one pair of latches in a lower part of the carrier module body to move apart or close in an outer or inner side, for holding or releasing the semiconductor device seated on the carrier module body, a latch button fitted in an upper part of the carrier module body so as to be movable in up/down directions, and coupled to the latch with a connection pin for moving in up/down directions by an external force, to making the latch t