Abstract: A white LED module includes a circuit board, a blue LED chip disposed on the circuit board, a green light source of an LED chip or phosphor disposed on the circuit board, and a red light source of an LED chip or phosphor disposed on the circuit board. At least one of the green and red light sources is a phosphor, which is excited by the blue LED chip to radiate. The blue LED chip emits light in a triangular region defined by color coordinates (0.0123, 0.5346), (0.0676, 0.4633) and (0.17319, 0.0048), the green light source emits light in a triangular region defined by color coordinates (0.025, 0.5203), (0.4479, 0.541) and (0.0722, 0.7894), and the red light source emits light in a triangular region defined by color coordinates (0.556, 0.4408), (0.6253, 0.3741) and (0.7346, 0.2654).

Abstract: A backlight unit for a liquid crystal device capable of obtaining a high-quality image and reduced in thinness. The backlight unit is disposed below a liquid crystal panel to irradiate light thereoto. A plurality of separate light guide plates define respective blocks. Groups of LEDs each are disposed along an edge of each of the light guiding plates, each of the LED groups emitting light toward a corresponding one of the light guide plates. The each LED group is turned on and off according to the corresponding block.

Abstract: A backlight unit suitable for realizing a high-quality image. The backlight unit according to the present invention is a direct type, which is disposed under a liquid crystal panel to irradiate light to a back surface of the liquid crystal panel. The backlight unit includes a light source unit having a plurality of light source regions formed on a substrate, each of the light source regions driven separately and having at least one light emitting diode. The backlight unit also includes partitions provided on the substrate and disposed between the light source regions of the light source unit, and a circuit for controlling and driving the light source unit.

Abstract: In an LCD backlight unit using a light emitting diode, a double-sided printed circuit board includes a plurality of divided areas and conductive vias. A plurality of light emitting diodes are disposed on a top surface of the double-sided printed circuit board. A plurality of driving circuit connectors are disposed at a portion of the double-sided printed circuit board. A plurality of first lead patterns are formed on the top surface of the printed circuit board, each of the first lead patterns electrically connecting the light emitting diodes in each of the divided areas with one another. Also, a plurality of second lead patterns are formed on an underside surface of the double-sided printed circuit board to electrically connect the first lead patterns with the connectors through the conductive vias.

Abstract: A dimming structure for an image display device further includes a contrast panel for altering contrast differences in a portion around an outputted image to achieve dimming effects on an image smaller than a light emitting lamp. In the dimming structure, a backlight unit has a plurality of light sources disposed therein. A display panel displays an image while the backlight unit is disposed to light the display panel. A contrast panel is disposed between the backlight unit and the display panel. The contrast panel has a light emitting window formed in a portion thereof corresponding to the image of the display panel to transmit light emitted from the backlight unit therethrough. The dimming structure assures uniform dimming effects on the portion around the image despite use of a light source bigger than the image to be outputted.

Abstract: A backlight unit of the invention is reduced in thickness, weight and manufacturing costs but improved in heat releasing efficiency. In the backlight unit, a flexible printed circuit board has at least one through hole perforated therein. An LED package is disposed on a top portion of the flexible printed circuit board corresponding to the through hole. The backlight unit of the invention employs the flexible printed circuit board in place of a metal printed circuit board as a means to conduct current to the LED package. This produces a slimmer and lighter backlight unit and also saves manufacturing costs. In addition, the LED package is directly bonded onto a bottom plate by a heat conducting adhesive, thereby ensuring heat generated from the LED package to be released more quickly.