Abstract: Provided is an apparatus and method for treating a substrate, and more particularly, an apparatus and method for treating a substrate which performs a patterning process. The substrate treating apparatus includes a stage on which a substrate is placed, a discharge unit that discharges ink to form lines on the substrate placed on the stage, a solidifying unit that solidifies the discharged ink, and a transfer unit moving the stage or moving the discharge unit and the solidifying unit.

Abstract: Disclosed are a light emitting module and a light unit having the same. The light emitting module includes a plurality of light emitting devices, each light emitting device including a package body, a light emitting diode provided in the package body, and a plurality of lead electrodes electrically connected to the light emitting diode while protruding outwardly from the package body; and a board including at least one receiving groove, wherein the at least one of the light emitting devices is removably inserted into the at least one receiving groove.

Abstract: Disclosed is nanocoupling of a polymer onto a surface of a metal substrate for improving coating adhesion of the polymer on the metal substrate, and in vivo stability and durability of the polymer. In accordance with the present invention, the polymers can be grafted via a chemical bonding on the surface of the metal substrate by the nanocoupling, by which adhesion, biocompatibility and durability of a polymer-coated layer which is to be formed later on the metal substrate were remarkably improved; therefore, the nanocoupling according to the present invention can be applied to surface modification of a metal implant, such as stents, mechanical valves, and an articular, a spinal, a dental and an orthopedic implants.

Abstract: Disclosed are a light emitting module and a light unit having the same. The light emitting module includes a plurality of light emitting devices, each light emitting device including a package body, a light emitting diode provided in the package body, and a plurality of lead electrodes electrically connected to the light emitting diode while protruding outwardly from the package body; and a board including at least one receiving groove, wherein the at least one of the light emitting devices is removably inserted into the at least one receiving groove.

Abstract: Provided is a light emitting device. The light emitting device comprises a body, a light emitting diode on the body, a resin layer on the light emitting diode, and a primer layer containing a metal material on the resin layer.

Abstract: A light emitting apparatus including a first light emitting device including a first light emitting diode chip configured to emit light of a first rank included in a first color gamut, and a second light emitting device including a second light emitting diode chip configured to emit light of a second rank included in the first color gamut, in which the first rank is different than the second rank. In addition, the first and second light emitting devices are arranged in relation to each other such that the light emitted by the first emitting device mixes with light emitted by the second light emitting device to form light of a third rank different than the first and second ranks.

Abstract: A spacer, disposed between first and second substrates of an electron emission display, includes a main body, a resistive layer arranged on a side surface of the main body, a secondary electron emission preventing layer arranged on the resistive layer, and a diffusion preventing layer arranged between the resistive layer and the secondary electron emission layer. The diffusion preventing layer prevents interdiffusion between the resistive layer and the secondary electron emission preventing layer.

Abstract: A spacer, disposed between first and second substrates of an electron emission display, includes a main body, a resistive layer arranged on a side surface of the main body, a secondary electron emission preventing layer arranged on the resistive layer, and a diffusion preventing layer arranged between the resistive layer and the secondary electron emission layer. The diffusion preventing layer prevents interdiffusion between the resistive layer and the secondary electron emission preventing layer.

Abstract: An optical filter includes a support layer, absorption patterns on a first surface of the support layer, the absorption patterns having a predetermined interval therebetween, and adhesion members on the first surface of the support layer, the adhesion members being buried in the predetermined interval between the absorption patterns.

Abstract: In an embodiment of the present invention, a light emission device includes a vacuum vessel that includes first and second substrates facing each other and a sealing member for sealing the first and second substrates, an electron emission unit that is located on an inner surface of the first substrate and includes a plurality of electron emission regions and a plurality of driving electrodes for controlling the electron emission of the electron emission regions, a light emission unit that is located on an inner surface of the second substrate, and a heat dissipation layer that defines an uppermost layer of the electron emission unit and has a thermal conductivity of at least 2 W/cmK, a portion of the heat dissipation layer extending out of the vacuum vessel through a region between the sealing member and the first substrate.

Abstract: A solid state image pickup device includes a semiconductor substrate, a CCD channel region in the semiconductor substrate, a plurality of polygates over the CCD channel regions, and a photoelectric conversion region having a portion above an uppermost surface of the semiconductor substrate.

Abstract: A color charge-coupled device is disclosed including plural light detectors corresponding to first to third colors and plural charge transmission regions on a semiconductor substrate; a pad on one side of the substrate excluding a portion where the light detectors and charge transmission regions are formed; a planarizing film on the substrate excluding the pad; microlenses on the planarizing film above the light detectors; and first to third color filter layers on each microlens excluding the edge portion.

Abstract: A CCD and manufacturing method thereof is disclosed including: a first conductivity-type substrate having a convex portion; a first conductivity-type charge transmission domain formed on the substrate excluding the convex portion; a light detecting domain formed on the convex portion of the substrate and having a convex top surface; a second conductivity-type high-concentration impurity area formed on the top surface of the light detecting domain; a gate insulating layer formed on the substrate excluding the light detecting domain; a transmission gate formed on the gate insulating layer; a planarization layer formed on the substrate including the transmission gate; and a microlens formed on the planarization layer above a photodiode.

Abstract: A CCD and manufacturing method thereof is disclosed including: a first conductivity-type substrate having a convex portion; a first conductivity-type charge transmission domain formed on the substrate excluding the convex portion; a light detecting domain formed on the convex portion of the substrate and having a convex top surface; a second conductivity-type high-concentration impurity area formed on the top surface of the light detecting domain; a gate insulating layer formed on the substrate excluding the light detecting domain; a transmission gate formed on the gate insulating layer; a planarization layer formed on the substrate including the transmission gate; and a microlens formed on the planarization layer above a photodiode.

Abstract: A method of manufacturing a color charge-coupled device is disclosed including the steps of alternately forming a plurality of light detectors corresponding to first to third colors and a plurality of charge transmission regions on a semiconductor substrate; forming a pad on one side of the substrate excluding a portion where the light detectors and charge transmission regions are formed; forming a planarizing film on the substrate excluding the pad; coating a microlens material on the planarizing film and patterning the microlens material so as to be left only on the planarizing film above the light detectors; thermally flowing the microlens material, to thereby form microlenses on the planarizing film above the light detectors; and hard-baking first to third dyeing layer, to thereby form first to third color filter layers on each microlens excluding the edge portion.