Abstract: A fuse latch of a semiconductor device including PMOS transistors and NMOS transistors includes a data transmission circuit configured to transmit data to a first node and a second node in response to a first control signal, a latch circuit configured to latch the data received from the data transmission circuit through the first node and the second node, and a data output circuit configured to output the data latched by the latch circuit in response to a second control signal. NMOS transistors contained in the data transmission circuit, the latch circuit, and the data output circuit may be formed in first, fourth, and fifth active regions, PMOS transistors are formed in second and third active regions, and the first to fifth active regions are sequentially arranged in a first direction.

Abstract: A display device includes a substrate, a display area disposed on the substrate and including a plurality of pixels and data lines, a peripheral area disposed outside the display area of the substrate, a pad portion disposed in the peripheral area, an encapsulation layer disposed in the peripheral area and the display area, and disposed on the plurality of pixels of the display area, a crack detection circuit disposed in the peripheral area, and a first crack detection line connected with the pad portion and the crack detection circuit. The first crack detection line is disposed on the encapsulation layer.

Abstract: A naming support system is provided that includes a processing unit that receives first language name information input from a user, determines name evaluation's basic information about the first language name information, and generates and transmits name's evaluation information to an output unit based on a target language which includes at least one of a plurality of languages for the name evaluation's basic information, wherein the first language name information includes at least one of character notation information of a first language name, pronunciation information of a first language name, or desired information for a first language name, and the name evaluation's basic information includes the first language name information.

Abstract: An electronic device module includes a first substrate, at least one electronic device mounted on a lower surface of the first substrate, a second substrate mounted on a lower surface of the first substrate to electrically connect the first substrate to an external source of power, a connecting conductor bonded to a lower surface of the second substrate, and a sealing portion sealing the electronic device, the second substrate, and the connecting conductor, wherein a mounting height of the second substrate is configured to be lower than a mounting height of the electronic device.

Abstract: A naming support system is provided that includes a processing unit that receives first language name information input from a user, determines name evaluation's basic information about the first language name information, and generates and transmits name's evaluation information to an output unit based on a target language which includes at least one of a plurality of languages for the name evaluation's basic information, wherein the first language name information includes at least one of character notation information of a first language name, pronunciation information of a first language name, or desired information for a first language name, and the name evaluation's basic information includes the first language name information.

Abstract: An electronic device module includes a first substrate, at least one electronic device mounted on a lower surface of the first substrate, a second substrate mounted on a lower surface of the first substrate to electrically connect the first substrate to an external source of power, a connecting conductor bonded to a lower surface of the second substrate, and a sealing portion sealing the electronic device, the second substrate, and the connecting conductor, wherein a mounting height of the second substrate is configured to be lower than a mounting height of the electronic device.

Abstract: An electronic device module includes a first substrate, at least one electronic device mounted on a lower surface of the first substrate, a second substrate mounted on a lower surface of the first substrate to electrically connect the first substrate to an external source of power, a connecting conductor bonded to a lower surface of the second substrate, and a sealing portion sealing the electronic device, the second substrate, and the connecting conductor, wherein a mounting height of the second substrate is configured to be lower than a mounting height of the electronic device.

Abstract: An electronic device module includes a first substrate, at least one electronic device mounted on a lower surface of the first substrate, a second substrate mounted on a lower surface of the first substrate to electrically connect the first substrate to an external source of power, a connecting conductor bonded to a lower surface of the second substrate, and a sealing portion sealing the electronic device, the second substrate, and the connecting conductor, wherein a mounting height of the second substrate is configured to be lower than a mounting height of the electronic device.

Abstract: The invention relates to a method of manufacturing an FBAR having a cap made of solid metal. The method includes preparing a substrate and stacking a lower electrode, a piezoelectric film and an upper electrode on the substrate to form a resonance region. The method also includes forming a passivation layer above substantially an entire area of the resonance region and its adjacent region to protect the resonance region and forming a first photoresist layer on the passivation layer. The first photoresist layer exposes a sidewall region which surrounds the resonance region. The method further includes filling in the sidewall region with metal and forming a roof with the same metal on the resonance region surrounded by the sidewall region, thereby forming a cap composed of the sidewall and the roof.