Abstract: A naming support system is provided that includes a processing unit that receives first language name information input from a user, determines name evaluation's basic information about the first language name information, and generates and transmits name's evaluation information to an output unit based on a target language which includes at least one of a plurality of languages for the name evaluation's basic information, wherein the first language name information includes at least one of character notation information of a first language name, pronunciation information of a first language name, or desired information for a first language name, and the name evaluation's basic information includes the first language name information.

Abstract: An electronic device module includes a first substrate, at least one electronic device mounted on a lower surface of the first substrate, a second substrate mounted on a lower surface of the first substrate to electrically connect the first substrate to an external source of power, a connecting conductor bonded to a lower surface of the second substrate, and a sealing portion sealing the electronic device, the second substrate, and the connecting conductor, wherein a mounting height of the second substrate is configured to be lower than a mounting height of the electronic device.

Abstract: A naming support system is provided that includes a processing unit that receives first language name information input from a user, determines name evaluation's basic information about the first language name information, and generates and transmits name's evaluation information to an output unit based on a target language which includes at least one of a plurality of languages for the name evaluation's basic information, wherein the first language name information includes at least one of character notation information of a first language name, pronunciation information of a first language name, or desired information for a first language name, and the name evaluation's basic information includes the first language name information.

Abstract: An electronic device module includes a first substrate, at least one electronic device mounted on a lower surface of the first substrate, a second substrate mounted on a lower surface of the first substrate to electrically connect the first substrate to an external source of power, a connecting conductor bonded to a lower surface of the second substrate, and a sealing portion sealing the electronic device, the second substrate, and the connecting conductor, wherein a mounting height of the second substrate is configured to be lower than a mounting height of the electronic device.

Abstract: An electronic device module includes a first substrate, at least one electronic device mounted on a lower surface of the first substrate, a second substrate mounted on a lower surface of the first substrate to electrically connect the first substrate to an external source of power, a connecting conductor bonded to a lower surface of the second substrate, and a sealing portion sealing the electronic device, the second substrate, and the connecting conductor, wherein a mounting height of the second substrate is configured to be lower than a mounting height of the electronic device.

Abstract: An electronic device module includes a first substrate, at least one electronic device mounted on a lower surface of the first substrate, a second substrate mounted on a lower surface of the first substrate to electrically connect the first substrate to an external source of power, a connecting conductor bonded to a lower surface of the second substrate, and a sealing portion sealing the electronic device, the second substrate, and the connecting conductor, wherein a mounting height of the second substrate is configured to be lower than a mounting height of the electronic device.

Abstract: The invention relates to a method of manufacturing an FBAR having a cap made of solid metal. The method includes preparing a substrate and stacking a lower electrode, a piezoelectric film and an upper electrode on the substrate to form a resonance region. The method also includes forming a passivation layer above substantially an entire area of the resonance region and its adjacent region to protect the resonance region and forming a first photoresist layer on the passivation layer. The first photoresist layer exposes a sidewall region which surrounds the resonance region. The method further includes filling in the sidewall region with metal and forming a roof with the same metal on the resonance region surrounded by the sidewall region, thereby forming a cap composed of the sidewall and the roof.