Abstract: A semiconductor package is provided. The semiconductor package comprises a package substrate, a first semiconductor chip on the package substrate, a second semiconductor chip spaced apart from the first semiconductor chip on the package substrate, and a bridge die placed below the first semiconductor chip and the second semiconductor chip on the package substrate, wherein the bridge die includes a first face that faces the first semiconductor chip and the second semiconductor chip, a second face that faces the package substrate, a connection wiring structure which is placed on the first face, and connects the first semiconductor chip and the second semiconductor chip, and a power wiring structure which is placed on the second face, and provides power to the first semiconductor chip and the second semiconductor chip.

Abstract: A semiconductor memory device and electronic system including the same are provided. The semiconductor memory device may include a first stacked structure including a plurality of first interlayer insulating films, a second stacked structure including a plurality of second interlayer insulating films on the first stacked structure, and a hole that extends into the first stacked structure and the second stacked structure. The plurality of second interlayer insulating films may include a plurality of first films that include first impurities, and a plurality of second films that are free of the first impurities.

Abstract: An organic light emitting diode display including a first substrate, a plurality of electrodes on the first substrate and spaced apart from each other, a pixel defining layer on the plurality of electrodes, spacers on the pixel defining layer, and a second substrate on the spacers. The pixel defining layer includes a plurality of openings spaced apart from each other and respectively open to the plurality of electrodes. The spacers on the pixel defining layer are at crossing points of a plurality of virtual lines, the spacers crossing spaces between adjacent openings of the plurality of openings.

Abstract: A method includes obtaining, using a stationary sensor of an electronic device, multiple image frames including first and second image frames. The method also includes generating, using multiple previously generated motion vectors, a first motion-distorted image frame using the first image frame and a second motion-distorted image frame using the second image frame. The method further includes adding noise to the motion-distorted image frames to generate first and second noisy motion-distorted image frames. The method also includes performing (i) a first multi-frame processing (MFP) operation to generate a ground truth image using the motion-distorted image frames and (ii) a second MFP operation to generate an input image using the noisy motion-distorted image frames.

Abstract: An organic light emitting diode display including a first substrate, a plurality of electrodes on the first substrate and spaced apart from each other, a pixel defining layer on the plurality of electrodes, spacers on the pixel defining layer, and a second substrate on the spacers. The pixel defining layer includes a plurality of openings spaced apart from each other and respectively open to the plurality of electrodes. The spacers on the pixel defining layer are at crossing points of a plurality of virtual lines, the spacers crossing spaces between adjacent openings of the plurality of openings.

Abstract: The present disclosure relates to a semiconductor device, and a test apparatus and method thereof, capable of accurately detecting a defect by using a plurality of resistor circuits in a test process. The test apparatus of a semiconductor device according to an aspect of the present disclosure may include semiconductor chips each including an external resistor circuit disposed to be dispersed along an outer region of a chip and an internal resistor circuit disposed in an inner region of the chip in order to test cracks, and test equipment that drives the external resistor circuit and the internal resistor circuit and compares an output of the external resistor circuit with an output of the internal resistor circuit to detect whether a defect occurs in each of the semiconductor chips.

Abstract: A system and a method of connecting devices via a Wireless-Fidelity (Wi-Fi) network are provided. The method of communication-connecting an external device to an Access Point (AP) via a Wi-Fi network is performed by a device and includes operations of receiving device information of the external device from the external device that operates in an AP mode, accessing the external device that operates in the AP mode, by using the device information, and providing connection information relating to the AP to the external device, and wherein, when the connection information is provided to the external device, the external device terminates operating in the AP mode, and the external device then accesses the AP based on the connection information.

Abstract: An apparatus and method for applying a multi-component curable composition is disclosed. The method for applying a multi-component curable composition includes a) applying a plurality of fluids constituting the multi-component curable composition to a surface of a bonding target object layer by layer, b) acquiring a two-dimensional image of all the fluids applied layer by layer using an image sensor, c) measuring a height of all the fluids applied layer by layer using a distance sensor, and d) calculating a total volume of the multi-component curable composition by using the two-dimensional image and height of the fluids obtained in b) and c).

Abstract: A method and system for providing information that enables easier and quicker access to an item related to a context of a device, and a computer-readable recording medium thereof are provided. The method includes detecting a context of a device, and displaying at least one virtual space corresponding to the detected context on a screen of the device. The virtual space is a Graphic User Interface (GUI) that is configured to register the detected context and information related to at least one item.

Abstract: A method for training data generation includes obtaining a first set of image frames of a scene and a second set of image frames of the scene using multiple exposure settings. The method also includes generating an alignment map, a blending map, and an input image using the first set of image frames. The method further includes generating a ground truth image using the alignment map, the blending map, and the second set of image frames. In addition, the method includes using the ground truth image and the input image as an image pair in a training dataset when training a machine learning model to reduce image distortion and noise.

Abstract: A method includes obtaining, using a stationary sensor of an electronic device, multiple image frames including first and second image frames. The method also includes generating, using multiple previously generated motion vectors, a first motion-distorted image frame using the first image frame and a second motion-distorted image frame using the second image frame. The method further includes adding noise to the motion-distorted image frames to generate first and second noisy motion-distorted image frames. The method also includes performing (i) a first multi-frame processing (MFP) operation to generate a ground truth image using the motion-distorted image frames and (ii) a second MFP operation to generate an input image using the noisy motion-distorted image frames.

Abstract: The present invention relates to a permanently attached UHF band RFID tire tag and a manufacturing method thereof, and more specifically, the present invention relates to a permanently attached UHF band RFID tire tag and a manufacturing method thereof, which is attached to a tire surface during the manufacturing process of a tire in a high-temperature and high-pressure environment, enabling the management of tire manufacturing history from the beginning of the production to product shipment, and thereafter, the durability is maintained even in the flexing motion of a tire that occurs while the tire is installed and operated in a vehicle such that chip damage of a tag and tag detachment from the tire do not occur, and therefore, it enables RFID communication to be performed without obstacles until the end of a tire life.

Abstract: Disclosed are a parts delivery system and a method of operating the same. The parts delivery system includes a production line configured to receive parts and assemble a finished product, a parts loading site configured to have a space where the parts are loaded; a parts transportation unit configured to load the parts in the parts loading site or discharge the parts from the parts loading site to supply the parts to the production line, and a processor configured to provide virtual space data on the parts loading site, to establish a parts loading schedule and a parts discharging schedule on the virtual space data according to an assembly schedule of the finished product of the production line, and to control the parts transportation unit to load or discharge the parts in the actual parts loading site according to the parts loading schedule and the parts discharging schedule.

Abstract: An organic light emitting diode display including a first substrate, a plurality of electrodes on the first substrate and spaced apart from each other, a pixel defining layer on the plurality of electrodes, spacers on the pixel defining layer, and a second substrate on the spacers. The pixel defining layer includes a plurality of openings spaced apart from each other and respectively open to the plurality of electrodes. The spacers on the pixel defining layer are at crossing points of a plurality of virtual lines, the spacers crossing spaces between adjacent openings of the plurality of openings.

Abstract: A system and a method of connecting devices via a Wireless-Fidelity (Wi-Fi) network are provided. The method of communication-connecting an external device to an Access Point (AP) via a Wi-Fi network is performed by a device and includes operations of receiving device information of the external device from the external device that operates in an AP mode, accessing the external device that operates in the AP mode, by using the device information, and providing connection information relating to the AP to the external device, and wherein, when the connection information is provided to the external device, the external device terminates operating in the AP mode, and the external device then accesses the AP based on the connection information.

Abstract: An organic light emitting diode display is provided that may include a first substrate, a plurality of electrodes on the first substrate and spaced apart from each other, a pixel defining layer on the plurality of electrodes, spacers on the pixel defining layer, and a second substrate on the spacers. The pixel defining layer includes a plurality of openings spaced apart from each other and respectively open to the plurality of electrodes. The spacers on the pixel defining layer are at crossing points of a plurality of virtual lines, the spacers crossing spaces between adjacent openings of the plurality of openings.

Abstract: A system and a method of connecting devices via a Wireless-Fidelity (Wi-Fi) network are provided. The method of communication-connecting an external device to an Access Point (AP) via a Wi-Fi network is performed by a device and includes operations of receiving device information of the external device from the external device that operates in an AP mode, accessing the external device that operates in the AP mode, by using the device information, and providing connection information relating to the AP to the external device, and wherein, when the connection information is provided to the external device, the external device terminates operating in the AP mode, and the external device then accesses the AP based on the connection information.

Abstract: An apparatus and method for applying a multi-component curable composition is disclosed. The method for applying a multi-component curable composition includes a) applying a plurality of fluids constituting the multi-component curable composition to a surface of a bonding target object layer by layer, b) acquiring a two-dimensional image of all the fluids applied layer by layer using an image sensor, c) measuring a height of all the fluids applied layer by layer using a distance sensor, and d) calculating a total volume of the multi-component curable composition by using the two-dimensional image and height of the fluids obtained in b) and c).

Abstract: A system and a method of connecting devices via a Wireless-Fidelity (Wi-Fi) network are provided. The method of communication-connecting an external device to an Access Point (AP) via a Wi-Fi network is performed by a device and includes operations of receiving device information of the external device from the external device that operates in an AP mode, accessing the external device that operates in the AP mode, by using the device information, and providing connection information relating to the AP to the external device, and wherein, when the connection information is provided to the external device, the external device terminates operating in the AP mode, and the external device then accesses the AP based on the connection information.

Abstract: The present disclosure relates to a semiconductor device, and a test apparatus and method thereof, capable of accurately detecting a defect by using a plurality of resistor circuits in a test process. The test apparatus of a semiconductor device according to an aspect of the present disclosure may include semiconductor chips each including an external resistor circuit disposed to be dispersed along an outer region of a chip and an internal resistor circuit disposed in an inner region of the chip in order to test cracks, and test equipment that drives the external resistor circuit and the internal resistor circuit and compares an output of the external resistor circuit with an output of the internal resistor circuit to detect whether a defect occurs in each of the semiconductor chips.