Abstract: A heat dissipation member includes a body formed of a metal; and an epoxy resin layer formed on a surface of the body and having insulating properties. A printed circuit board includes a heat dissipation member embedded in the printed circuit board, the heat dissipation member including a body formed of a metal and an epoxy resin layer formed on a surface of the body and having insulating properties, and an insulator formed to surround the heat dissipation member.

Abstract: There is provided a multilayer ceramic electronic component. The multilayer ceramic electronic component includes: a ceramic body including a dielectric layer; first and second internal electrodes disposed to face each other, having the dielectric layer interposed therebetween in the ceramic body; external electrodes formed on external surfaces of the ceramic body and electrically connected to the first and second internal electrodes; and grooves formed in at least one of top and bottom surface of the ceramic body on which the external electrodes are formed.

Abstract: There is provided a multi-layer ceramic electronic component including: a ceramic sintered body in which a plurality of dielectric layers are laminated; first and second internal electrodes formed in the ceramic sintered body; first and second external electrodes formed on both ends of the ceramic sintered body while covering a circumference thereof, and electrically connected to the first and second internal electrodes; and a sealing part including a glass component and formed in a gap between an outer surface of the ceramic sintered body and ends of the first and second external electrodes.