Patents by Inventor Chulchae Chol

Chulchae Chol has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards
    Patent number: 7457491
    Abstract: The present invention provides a system, method and apparatus for improved electrical-to-optical transmitters (100) disposed within printed circuit boards (104). The heat sink (110, 200) is a thermal conductive material disposed within a cavity (102) of the printed circuit board (104) and is thermally coupled to a bottom surface (112) of the electrical-to-optical transmitter (100). A portion of the thermal conductive material extends approximately to an outer surface (120, 122 or 124) of a layer (114, 116 or 118) of the printed circuit board (104). The printed circuit board may comprise a planarized signal communications system or an optoelectronic signal communications system. In addition, the present invention provides a method for fabricating the heat sink wherein the electrical-to-optical transmitter disposed within a cavity of the printed circuit board is fabricated. New methods for flexible waveguides and micro-mirror couplers are also provided.
    Type: Grant
    Filed: September 21, 2006
    Date of Patent: November 25, 2008
    Assignee: Board of Regents, The University of Texas System
    Inventors: Ray T. Chen, Chulchae Chol
  • System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards
    Patent number: 7112885
    Abstract: The present invention provides a system, method and apparatus for improved electrical-to-optical transmitters (100) disposed within printed circuit boards (104). The heat sink (110, 200) is a thermal conductive material disposed within a cavity (102) of the printed circuit board (104) and is thermally coupled to a bottom surface (112) of the electrical-to-optical transmitter (100). A portion of the thermal conductive material extends approximately to an outer surface (120, 122 or 124) of a layer (114, 116 or 118) of the printed circuit board (104). The printed circuit board may comprise a planarized signal communications system or an optoelectronic signal communications system. In addition, the present invention provides a method for fabricating the heat sink wherein the electrical-to-optical transmitter disposed within a cavity of the printed circuit board is fabricated. New methods for flexible waveguides and micro-mirror couplers are also provided.
    Type: Grant
    Filed: July 7, 2004
    Date of Patent: September 26, 2006
    Assignee: Board of Regents, The University of Texas System
    Inventors: Ray T. Chen, Chulchae Chol