Patents by Inventor Chuljin Lee

Chuljin Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240093042
    Abstract: Embodiments provide an ink composition, a layer manufactured using the ink composition, an electrophoresis device including the layer, and a display device including the layer. The ink composition includes a semiconductor nanorod, and a solvent that satisfies Equation 1: |?1??2|/?1*100?10??[Equation 1] In Equation 1, ?1 is a dielectric constant of the solvent at 50 Hz, and ?2 is a dielectric constant of the solvent at 50 kHz.
    Type: Application
    Filed: September 5, 2023
    Publication date: March 21, 2024
    Applicant: Samsung Display Co., LTD.
    Inventors: Janghyuk KIM, Jinsuop YOUN, Kyuyoung KIM, MISUN KIM, Minjun KIM, BONGYONG KIM, YoungMin KIM, CHULJIN PARK, Heeje WOO, JEONGWOO LEE, HYUNMOO CHOI
  • Patent number: 4990467
    Abstract: A method for fabrication of semiconductor device in which a tungsten film only exists on contact hole which is comprising the steps of depositing a insulator layer on the silicon substrate being doped by impurity, depositing a photoresist high temperature resistant resin on the insulator layer in order to form a contact hole, forming a contact hole by etching the insulator layer using the photoresist resin as a mask, selectively depositing tungsten film on the contact hole and removing the photoresist layer, and a method for fabrication of semiconductor device which is comprising the steps of depositing the first photoresist resin layer followed by depositing the second photoresist resin layer on the insulator layer forming a pattern to the first and the second photoresist resin layer, forming a contact hole by etching the insulator layer, selectively depositing tungsten film on the contact hole after removing the second photoresist resin layer and removing the first photoresist resin layer.
    Type: Grant
    Filed: July 12, 1989
    Date of Patent: February 5, 1991
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Chuljin Lee, Euisong Kim