Abstract: A method for externally moving a vehicle includes receiving sensor data from a sensor of the vehicle. The sensor data is indicative that a person outside of the vehicle touched a predetermined area of the windshield of the vehicle. The vehicle is initially parked. The method further includes displaying a user interface on the predetermined area of the windshield in response to determining that the person outside of the vehicle touched the predetermined area of the windshield of the vehicle. Moreover, the method includes receiving an input from the person outside of the windshield through the user interface. The input is indicative of a command to move the vehicle. The method includes commanding the vehicle to move by a predetermined distance in response to receiving the input from the person outside of the vehicle.

Abstract: A method for externally moving a vehicle includes receiving sensor data from a sensor of the vehicle. The sensor data is indicative that a person outside of the vehicle touched a predetermined area of the windshield of the vehicle. The vehicle is initially parked. The method further includes displaying a user interface on the predetermined area of the windshield in response to determining that the person outside of the vehicle touched the predetermined area of the windshield of the vehicle. Moreover, the method includes receiving an input from the person outside of the windshield through the user interface. The input is indicative of a command to move the vehicle. The method includes commanding the vehicle to move by a predetermined distance in response to receiving the input from the person outside of the vehicle.

Abstract: A method for fabrication of semiconductor device in which a tungsten film only exists on contact hole which is comprising the steps of depositing a insulator layer on the silicon substrate being doped by impurity, depositing a photoresist high temperature resistant resin on the insulator layer in order to form a contact hole, forming a contact hole by etching the insulator layer using the photoresist resin as a mask, selectively depositing tungsten film on the contact hole and removing the photoresist layer, and a method for fabrication of semiconductor device which is comprising the steps of depositing the first photoresist resin layer followed by depositing the second photoresist resin layer on the insulator layer forming a pattern to the first and the second photoresist resin layer, forming a contact hole by etching the insulator layer, selectively depositing tungsten film on the contact hole after removing the second photoresist resin layer and removing the first photoresist resin layer.