Abstract: A multilayer electronic component includes a body including a capacitance formation portion in which a dielectric layer and an internal electrode are alternately disposed in a first direction; and an external electrode disposed on the body, wherein the capacitance formation portion includes an upper region, a lower region, and a central region disposed between the upper region and the lower region, at least one of dielectric layers disposed in the upper region and the lower region is a first dielectric layer including In, and at least one of dielectric layers disposed in the central region is a second dielectric layer, not including In, or having a lower atomic percentage of average In content than that of the first dielectric layer.

Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers and an internal electrode including a conductive material, and an external electrode disposed on the body and connected to the internal electrode. The internal electrode includes a Sn diffusion portion including Sn in a region connected to the external electrode, and a ratio of an average number of atoms of the Sn compared to an average number of atoms of the conductive material other than the Sn of the internal electrode included in the Sn diffusion portion is 3% or more and 50% or less.

Abstract: A multilayer electronic component includes: a body including a dielectric layer and internal electrodes alternately positioned while having the dielectric layer interposed therebetween; and an external electrode positioned on the body. The external electrode includes an electrode layer connected to one or more of the internal electrodes and including copper (Cu), a first plating layer positioned on the electrode layer and including nickel (Ni), and a second plating layer positioned on the first plating layer and including nickel (Ni). An oxide including nickel (Ni) is positioned on a boundary surface between the first plating layer and the second plating layer. An average thickness of the first plating layer is smaller than an average thickness of the second plating layer.

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and an external electrode disposed on the body, wherein the external electrode includes an electrode layer connected to the internal electrode and including Cu, a first plating portion disposed on the electrode layer, and a second plating portion disposed on the first plating portion, and wherein the first plating portion includes a Ni layer in contact with the electrode layer, and an intermetallic compound layer disposed on the Ni layer and including an intermetallic compound including at least one of Ni and Sn.

Abstract: A multilayer electronic component may include: a body including a dielectric layer and internal electrodes; and external electrodes including an electrode layer disposed on the body and a plating layer disposed on the electrode layer, wherein the plating layer includes an extension extending onto the body to contact the body, and the extension includes one or more grains in which an angle between a surface of the body in contact with the extension and a major axis of the grain is 70 degrees or greater and 110 degrees or less.

Abstract: An external electrode of a multilayer electronic component includes a base electrode layer and a corner electrode layer disposed at a corner of a body and disposed on the base electrode layer, wherein an area ratio of metal of the corner electrode layer is 90% or more.

Abstract: A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes and including first and second surfaces, third and fourth surfaces, and fifth and sixth surfaces, a first external electrode including a 1-1-th electrode layer disposed on the third surface, and a 1-2-th electrode layer disposed on the first and second surfaces, a second external electrode including a 2-1-th electrode layer disposed on the fourth surface, and a 2-2-th electrode layer disposed on the first and second surfaces, wherein S1-2>S1-1, T1-2?8 ?m, S2-2>S2-1, and T2-2?8 ?m where based on a cross section of the first and second external electrodes, S1-1, S1-2, S2-1, S2-2 are fractions of an area occupied by glass in the 1-1-th, 1-2-th, 2-1-th, and 2-2-th electrode layers, respectively, T1-2 and T2-2 are thicknesses of the 1-2-th and 2-2-th electrode layers, respectively.

Abstract: A multilayer electronic component, in which the first external electrode may include the 1-1-th electrode layer disposed on the third surface, and the 1-2-th electrode layer disposed on the first and second surfaces, and the second external electrode may include the 2-1-th electrode layer disposed on the fourth surface and the 2-2-th electrode layer disposed on the first and second surfaces, wherein the 1-2-th electrode layer and the 2-2-th electrode layer include Cu and a first additive element having a content lower than a content of the Cu, the contents of the first additive element included in the 1-2-th electrode layer and the 2-2-th electrode layer are greater than the contents of the first additive element included in the 1-1-th electrode layer and the 2-1-th electrode layer, respectively, and the first additive element is at least one selected from Ag and Al, thereby preventing cracks and improving moisture resistance reliability.

Abstract: A multilayer electronic component according to an embodiment of the present disclosure includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body. The external electrode includes a first electrode layer connected to the internal electrode and including Cu, a second electrode layer partially disposed on the first electrode layer and including Ni, an intermediate layer disposed on the second electrode layer and in a region of the first electrode layer, in which the second electrode layer is not disposed, and including a metal oxide, and a first plating layer disposed on the intermediate layer and including Ni.

Abstract: In an embodiment of the present disclosure, among a plurality of crystal grains included in first electrode layers, crystal grains disposed on an end of the dielectric layer in the second direction and in contact with the second electrode layers are defined as first crystal grains and crystal grains disposed on ends of the internal electrodes in the second direction and in contact with the second electrode layers are defined as second crystal grains, and a growth direction of the first crystal grains and a growth direction of the second crystal grains may be adjusted, so that bonding force between the first electrode layers and the body may be improved.

Abstract: A multilayer ceramic electronic component includes: a body including a dielectric layer and a plurality of internal electrodes stacked on each other having the dielectric layer interposed therebetween; and an external electrode disposed externally on the body and connected to one or more of the internal electrodes. The body includes a first region in contact with the external electrode and a second region not in contact with the external electrode, and R1/R2 satisfies 3 to 15 in which R1 indicates a surface roughness Ra of the first region and R2 indicates a surface roughness of the second region.

Abstract: A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer and including first to fourth portions, first and second external electrodes disposed on the first and second portions, respectively and connected to the first internal electrodes, third and fourth external electrodes disposed on the third and fourth portions, respectively and connected to the second internal electrodes, and a connection electrode disposed in at least one of the first to fourth portions, penetrating the dielectric layer, connecting two first internal electrodes or two internal electrodes adjacent to each other in the first direction. The connection electrode has a plurality of via electrodes laminated in the first direction, and via electrodes adjacent to each other in the first direction among the plurality of via electrodes, are shifted from each other in a direction perpendicular to the first direction.

Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes disposed alternately with the dielectric layer, solder layers disposed on ends of the internal electrodes and each including a Zn-based solder, and external electrodes disposed on the solder layer, wherein the solder layer includes a first alloy layer disposed on an interfacial surface with the internal electrode and including Zn—Ni alloy, and a second alloy layer disposed on an interfacial surface with the external electrode and including Zn—Cu alloy.

Abstract: A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer, and including first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction; a first external electrode disposed on at least one surface among the first, second, fifth and sixth surfaces; a second external electrode disposed on at least one surface among the first, second, third and fourth surfaces; and a first connection electrode penetrating the dielectric layer and connecting two first internal electrodes adjacent to each other in the first direction. In the first connection electrode, a plurality of first via electrodes shifted from each other in a direction perpendicular to the first direction are laminated in the first direction.

Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes stacked in a first direction with the dielectric layer interposed therebetween and external electrodes including a first electrode layer connected to the internal electrodes and including Ni, and a second electrode layer disposed on the first electrode layer and including an Ni—Cu alloy. A Cu content of the second electrode layer is 70 mol to 90 mol compared to 100 mol of the total content of Ni and Cu of the second electrode layer.

Abstract: A multilayer electronic component, in which an external electrode may include a base electrode layer disposed on a surface of a body of the multilayer electronic component and connected to internal electrodes of the body, an intermediate electrode layer disposed on a corner of the body and connected to the base electrode layer, a conductive resin layer disposed on the intermediate electrode layer, and a plating layer disposed on the conductive resin layer. The intermediate electrode layer may be in contact with the plating layer on the corner of the body to prevent an increase in ESR while preventing cracks due to mounting through the conductive resin layer.

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and an external electrode disposed on the body, wherein the external electrode includes an electrode layer connected to the internal electrode and including Cu, a first plating portion disposed on the electrode layer, and a second plating portion disposed on the first plating portion, and wherein the first plating portion includes a Ni layer in contact with the electrode layer, and an intermetallic compound layer disposed on the Ni layer and including an intermetallic compound including at least one of Ni and Sn.

Abstract: A multilayer electronic component may include: a body including a dielectric layer and internal electrodes; and external electrodes including an electrode layer disposed on the body and a plating layer disposed on the electrode layer, wherein the plating layer includes an extension extending onto the body to contact the body, and the extension includes one or more grains in which an angle between a surface of the body in contact with the extension and a major axis of the grain is 70 degrees or greater and 110 degrees or less.

Abstract: A multilayer electronic component includes: a body including a dielectric layer and internal electrodes alternately positioned while having the dielectric layer interposed therebetween; and an external electrode positioned on the body. The external electrode includes an electrode layer connected to one or more of the internal electrodes and including copper (Cu), a first plating layer positioned on the electrode layer and including nickel (Ni), and a second plating layer positioned on the first plating layer and including nickel (Ni). An oxide including nickel (Ni) is positioned on a boundary surface between the first plating layer and the second plating layer. An average thickness of the first plating layer is smaller than an average thickness of the second plating layer.

Abstract: A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes and including first and second surfaces, third and fourth surfaces, and fifth and sixth surfaces, a first external electrode including a 1-1-th electrode layer disposed on the third surface, and a 1-2-th electrode layer disposed on the first and second surfaces, a second external electrode including a 2-1-th electrode layer disposed on the fourth surface, and a 2-2-th electrode layer disposed on the first and second surfaces, wherein S1-2>S1-1, T1-2?8 ?m, S2-2>S2-1, and T2-2?8 ?m where based on a cross section of the first and second external electrodes, S1-1, S1-2, S2-1, S2-2 are fractions of an area occupied by glass in the 1-1-th, 1-2-th, 2-1-th, and 2-2-th electrode layers, respectively, T1-2 and T2-2 are thicknesses of the 1-2-th and 2-2-th electrode layers, respectively.