Abstract: A display apparatus includes a first subpixel, a second subpixel and a third subpixel disposed on a substrate; a first organic light emitting element configured to emit a first color of light, a second organic light emitting element configured to emit a second color of light and a third organic light emitting element configured to emit a third color of light disposed in the first, second and third subpixels, respectively; a first anode, a second anode and a third anode disposed in the first, second and third subpixels, respectively; and a first cathode, a second cathode and a third cathode disposed in the first, second and third subpixels, respectively, wherein the first, second and third cathodes include at least one layer, and wherein at least two cathodes among the first, second and third cathodes have a different number of layers than each other.

Abstract: A display apparatus according to invention includes a substrate including a plurality of sub-pixels, a transistor disposed in each sub-pixel over the substrate, an organic light emitting device disposed in each sub-pixel over the substrate, a metal patterning layer over the organic light emitting device, and a reflective wall disposed in boundary area of the sub-pixels on the metal patterning layer.

Abstract: A light emitting display device includes a control pattern configured to control flow of a liquid material, thus defining an edge line of an organic encapsulation layer made of a liquid material and reducing a non-active area. The light emitting display device includes a control metal pattern configured to surround an active area at a non-active area and provided on a first inorganic encapsulation layer, an edge line pattern made of an organic material on the control metal pattern, and an organic encapsulation layer provided on the first inorganic encapsulation layer in an area inward from the control metal pattern.

Abstract: A wafer processing apparatus includes a reaction tube extending in a vertical direction, a door plate positioned under the reaction tube to seal the reaction tube. The door plate may be configured to load a boat into the reaction tube and support a plurality of wafers. The wafer processing apparatus may include a cap plate on the door plate, the cap plate including a cylindrical body. The cylindrical body may surround a lower side surface of the boat. A guiding recess may be formed in an outer surface of the cylindrical body along a circumferential direction of the cylindrical body. The wafer processing apparatus may include an exhaust portion configured to remove the first gas from the reaction tube through the guiding recess.

Abstract: Disclosed is a heating apparatus for manufacturing a display device, which prevents damage or breakage even though a heating member is deformed by heat, and extends a period for replacement of the heating member, wherein the heating apparatus comprises the heating member for emitting heat so as to heat a material to be deposited on a substrate prepared for manufacturing the display device, a first installing device for supporting the heating member, and a second installing device provided with a passing hole for passing the other end of the heating member therethrough.

Abstract: A batch type apparatus may include a tube; a boat configured to receive a plurality of semiconductor substrates, the boat vertically moved into the tube; a gas nozzle vertically arranged in the tube, the tube having a first portion and a second portion upwardly extended from the first portion; a gas pipe for supplying reaction gases to the gas nozzle, the gas pipe having a horizontal extension and a vertical extension, and the vertical extension extended in the gas nozzle; a fixing member for fixing the first portion of the gas nozzle to the gas pipe, the fixing member having strength higher than that of the gas nozzle; and a clamping member for clamping the gas pipe to the tube. Therefore, breakage of the gas nozzle may be suppressed.

Abstract: A wafer processing apparatus includes a reaction tube extending in a vertical direction, a door plate positioned under the reaction tube to seal the reaction tube. The door plate may be configured to load a boat into the reaction tube and support a plurality of wafers. The wafer processing apparatus may include a cap plate on the door plate, the cap plate including a cylindrical body. The cylindrical body may surround a lower side surface of the boat. A guiding recess may be formed in an outer surface of the cylindrical body along a circumferential direction of the cylindrical body. The wafer processing apparatus may include an exhaust portion configured to remove the first gas from the reaction tube through the guiding recess.

Abstract: Disclosed is a heating apparatus for manufacturing a display device, which prevents damage or breakage even though a heating member is deformed by heat, and extends a period for replacement of the heating member, wherein the heating apparatus comprises the heating member for emitting heat so as to heat a material to be deposited on a substrate prepared for manufacturing the display device, a first installing device for supporting the heating member, and a second installing device provided with a passing hole for passing the other end of the heating member therethrough.

Abstract: A batch type apparatus may include a tube; a boat configured to receive a plurality of semiconductor substrates, the boat vertically moved into the tube; a gas nozzle vertically arranged in the tube, the tube having a first portion and a second portion upwardly extended from the first portion; a gas pipe for supplying reaction gases to the gas nozzle, the gas pipe having a horizontal extension and a vertical extension, and the vertical extension extended in the gas nozzle; a fixing member for fixing the first portion of the gas nozzle to the gas pipe, the fixing member having strength higher than that of the gas nozzle; and a clamping member for clamping the gas pipe to the tube. Therefore, breakage of the gas nozzle may be suppressed.

Abstract: The present invention relates to an evaporation source for evaporating an organic electroluminescent layer. In particular, the present invention relates to the evaporation source preventing an aperture, through which a vaporized evaporation material is emitted, from being clogged by restricting heat transfer to outward.

Abstract: The present invention relates to an evaporation source for evaporating an organic electroluminescent layer. In particular, the present invention relates to the evaporation source preventing an aperture, through which a vaporized evaporation material is emitted, from being clogged by restricting heat transfer to outward.