Abstract: A device includes gate spacers, a gate dielectric layer, and one or more gate metals. The gate spacers are over a substrate. The gate dielectric layer is between the gate spacers. The gate dielectric layer includes a horizontal portion extending parallel to a top surface of the substrate, and vertical portions extending upwards from the horizontal portion. A first one of the vertical portions has a thickness less than a thickness of the horizontal portion.

Abstract: A device for detecting a wearing status of a headphone includes a sensor, a player, an acoustic detection assembly and a microprocessor, where the acoustic detection assembly is connected to the player through a digital-to-analog converter, and the microprocessor is connected to the sensor and the acoustic detection assembly separately; the sensor is configured to determine, in combination with the microprocessor, a wearing status of the headphone within a period of time after current time in the case where the headphone is in a worn status at the current time; and the acoustic detection assembly is configured to determine, in combination with the microprocessor and the player, the wearing status of the headphone within the period of time after the current time in the case where the headphone is in a non-worn status at the current time.

Abstract: Provided are a method and apparatus for optimizing a holographic display. The holographic display back-propagates target field data including generating a predicted hologram by a plurality of planes in a depth direction to a complex plane of a space light modulator (SLM), converts the predicted hologram into a binary hologram, generates predicted field data by forward-propagating the binary hologram to a reproduction plane through an optical system simulation model, calculates a loss function between the predicted field data and the target field data, generates a new predicted hologram for the predicted field data by using a stochastic gradient descent (SGD) method to reduce a value of the loss function, and repeats the generation of the new predicted hologram until the value of the loss function is less than a predefined threshold.

Abstract: The present disclosure provides a receiver circuit, which includes: a first comparator circuit, a second comparator circuit, and an inverter circuit. The inverter circuit has a first input terminal and a second input terminal. A first output terminal of the first comparator circuit is electrically connected to the first input terminal of the inverter circuit, and a second output terminal of the second comparator circuit is electrically connected to the second input terminal of the inverter circuit.

Abstract: A teleprompter includes an accommodating space and an optical assembly disposed in the accommodating space. The accommodating space is configured for accommodating an electronic device including an image display unit and a lens. The image display unit is configured to emit a light along a first path. The optical assembly includes a light-reflecting unit and a beam-splitting unit. The light-reflecting unit is configured to divert the light from the first path to a second path and has a first light-reflecting portion disposed on the first path. The beam-splitting unit is disposed on the second path and is configured to allow a first portion of the light to transmit and divert a second portion of the light from the second path to a third path. The third path has a same direction as a direction of an optic axis of the lens.

Abstract: A method for running an edge-cloud fusion-aware visual prompt large language model includes training a large language model feature encoder and a small feature extraction model, inputting knowledge-based text prompts to the large language model feature encoder in an edge device to generate a plurality of knowledge-based text embeddings, building a large language model database in the edge device according to the plurality of knowledge-based text embeddings, inputting a text prompt to the large language model feature encoder in the edge device to generate a text query embedding, comparing the text query embedding with the large language model database to generate a first similarity score, and if the first similarity score is larger than a first threshold, then inputting the text query embedding to the small feature extraction model to generate a first answer.

Abstract: The present invention discloses a highly integrated R-wave triggered tumor therapy apparatus, and relates to the technical field of medical devices for ablation of tumors. The apparatus includes: a human body R-wave detection module for detecting a human body R-wave signal; a signal generator for obtaining a narrow pulse signal with nanometer width according to the human body R-wave signal; a primary matching circuit; and a high-frequency transformer; where the primary matching circuit is used for matching the narrow pulse signal with nanometer width to an input side of the high-frequency transformer, so that the high-frequency transformer outputs a high-voltage signal needed for treatment of human bodies.

Abstract: The present disclosure provides a multi-modal multi-view classification method for echocardiograms based on a deep learning algorithm, including: collecting videos and images of multi-modal multi-view adult echocardiograms, and preprocessing the videos and images; annotating the preprocessed videos and images of adult echocardiograms to generate an adult echocardiogram dataset; dividing the adult echocardiogram dataset into a training set, a validation set, and a test set; constructing an adult echocardiogram view classification model based on a ResNet network, training the model using the training set, and selecting an optimal classification model using the validation set; evaluating performance of the optimal adult echocardiogram view classification model based on the test set; and inputting a to-be-tested image or video into the adult echocardiogram view classification model to obtain a classification result.

Abstract: Present invention teaches the method of using a keratin hydrolysis peptide (“KHP”) solution to increase the coffee production. By selectively choosing specific weights of feathers and water, and treating the mixture, though one embodiment does not have water mixed in, to a high-temperature high-pressure hydrolysis process, the resulting solution is confirmed to contain at least 253 peptides and then applied to the leaf surface of coffee plants at different growth stages. Optionally, the KHP solution can be diluted by water, as taught in the specification, before applying to the leaf surface of the coffee plants.

Abstract: Present invention teaches the method of using a keratin hydrolysis peptide (“KHP”) solution to accelerate the ripening and color change of the coffee fruits, to increase the reducing sugar content, and to decrease the chlorogenic acid content in coffee beans. By selectively choosing specific weights of feathers and water, and treating the mixture, though one embodiment does not have water mixed in, to a high-temperature high-pressure hydrolysis process, the resulting solution is confirmed to contain at least 253 peptides and then applied to the leaf surface of coffee plants at different growth stages. Optionally, the KHP solution can be diluted by water, as taught in the specification, before applying to the leaf surface of the coffee plants.

Abstract: Techniques are disclosed relating to improving memory reliability. In some embodiments, memory circuitry includes memory cells configured to store data, interface circuitry, and on-die error correcting code (ECC) circuitry. The ECC circuitry may check read data from the memory cells for errors and correct detected correctable errors to generate corrected data. The memory circuitry may provide read data to a requesting circuit via the interface circuitry, including one or more sets of corrected data from the on-die ECC circuitry. The memory circuitry may provide a decoding status flag (DSF) via the interface circuitry, including to: set the DSF to a first value in response to no error being detected for a given set of provided read data, set the DSF to a second value in response to a correctable error that was detected and corrected by the on-die ECC circuitry to provide a given set of read data, and set the DSF to a third value in response to an uncorrectable error detected by the on-die ECC circuitry.

Abstract: A three-dimensional memory device and a manufacturing method thereof are provided. The three-dimensional memory device includes first and second stacking structures, isolation pillars, gate dielectric layers, channel layers and conductive pillars. The stacking structures are laterally spaced apart from each other. The stacking structures respectively comprises alternately stacked insulating layers and conductive layers. The isolation pillars laterally extend between the stacking structures. The isolation pillars further protrude into the stacking structures, and a space between the stacking structures is divided into cell regions. The gate dielectric layers are respectively formed in one of the cell regions, and cover opposing sidewalls of the stacking structures and sidewalls of the isolation pillars. The channel layers respectively cover an inner surface of one of the gate dielectric layers.

Abstract: Provided are organometallic compounds comprising two moieties A and B which are each independently a monocyclic ring or a polycyclic fused ring structure, wherein the monocyclic ring or each ring of the polycyclic fused ring structure is independently a 5-membered to 10-membered carbocyclic or heterocyclic ring which are linked by a direct bond and which are further bridged by a linker comprising two groups which are each independently selected from the group consisting of O, S, Se, NR, BR, BRR?, PR, CR, C?O, C?NR, C?CRR?, C?S, CRR?, SO, SO2, P(O)R, SiRR?, and GeRR?. Also provided are formulations comprising these organometallic compounds. Further provided are organic light emitting devices (OLEDs) and related consumer products that utilize these organometallic compounds.

Abstract: An encoder with a light emitting diode includes: a light emitting diode, a switch module, an encoder module and a control shaft. The switch module includes an insulating base having a terminal part, a conductive elastic piece and a pressing driving body. The conductive elastic piece is disposed in the insulating base, and is disposed above the terminal part. The pressing driving body is disposed in the insulating base and is disposed above the conductive elastic piece for accommodating the light emitting diode. At least part of the encoder module is disposed in the insulating base, and the encoder module includes a magnetic sensor, a magnetic ring and a rotating driving body. The control shaft passes through a penetration hole of the rotating driving body, and is disposed above the pressing driving body.

Abstract: An optical stabilization structure, which includes a fixing component and a movable component, is disclosed. The fixing component provides an accommodating space, and includes a bottom plate and a first annular sidewall. The bottom of the first annular sidewall is orthogonally connected to the bottom plate to constitute the accommodating space, and an inner sidewall of the first annular sidewall has a contact surface. The movable component includes a second annular sidewall disposed in the accommodating space, wherein an outer sidewall of the second annular sidewall has an abutting surface, the abutting surface matches the contact surface by point contact, and the abutting surface is configured to be slidable relative to the contact surface. Through the contact manner of the movable component and the fixing component, the contact position, area and force of the optical stabilization structure are more stable to achieve the purpose of enhancing product performance.

Abstract: A semiconductor package may include a package substrate, a first semiconductor die electrically and mechanically coupled to the package substrate, a second semiconductor die electrically and mechanically coupled to the package substrate, and a reinforcement structure mechanically coupled to at least a first vertical surface of the first semiconductor die and a second vertical surface of the second semiconductor die, such that the reinforcement structure surrounds less than an entirety of the first semiconductor die and the second semiconductor die. The semiconductor package may include an underfill material formed between a top surface of the package substrate and bottom surfaces of the first semiconductor die and the second semiconductor die. The reinforcement structure may include a polymer material located in a space between the first semiconductor die and the second semiconductor die. The polymer material may be a polymer matrix composite having a greater modulus than the underfill material.

Abstract: A projection device includes a light source module, a display panel, a freeform-surface reflective mirror, and a projection lens. The light source module includes a light source, a first Fresnel lens element, and a second Fresnel lens element. The first Fresnel lens element and the second Fresnel lens element are parallel to each other and located between the light source and the display panel. The display panel is arranged between the light source module and the freeform-surface reflective mirror. The projection lens is configured to transmit an image beam out of the projection device, and a direction of an optical axis of the projection lens is different from a direction of a normal of the first Fresnel lens element.

Abstract: A portion of a buffer layer on a backside of a substrate of a photomask assembly may be removed prior to formation of one or more capping layers on the backside of the substrate. The one or more capping layers may be formed directly on the backside of the substrate where the buffer layer is removed from the substrate, and a hard mask layer may be formed directly on the one or more capping layers. The one or more capping layers may include a low-stress material to promote adhesion between the one or more capping layers and the substrate, and to reduce and/or minimize peeling and delamination of the capping layer(s) from the substrate. This may reduce the likelihood of damage to the pellicle layer and/or other components of the photomask assembly and/or may increase the yield of an exposure process in which the photomask assembly is used.